ATMEGA8-16PU Microchip

Features High-performance, Low-power Atmel AVR 8-bit Microcontroller Advanced RISC Architecture 130 Powerful Instructions Most Single-clock Cycle Execution 32 8 General Purpose Working Registers Fully Static Operation Up to 16MIPS Throughput at 16MHz On-chip 2-cycle Multiplier High Endurance Non-volatile Memory segments 8Kbytes of In-System Self-programmable Flash program memory 512Bytes EEPROM 8-bit Atmel with 1Kbyte Internal SRAM Write/Erase Cycles: 10,000 Flash/100,000 EEPROM 8KBytes In- (1) Data retention: 20 years at 85C/100 years at 25C Optional Boot Code Section with Independent Lock Bits System In-System Programming by On-chip Boot Program True Read-While-Write Operation Programmable Programming Lock for Software Security Peripheral Features Two 8-bit Timer/Counters with Separate Prescaler, one Compare Mode Flash One 16-bit Timer/Counter with Separate Prescaler, Compare Mode, and Capture Mode Real Time Counter with Separate Oscillator Three PWM Channels ATmega8 8-channel ADC in TQFP and QFN/MLF package Eight Channels 10-bit Accuracy ATmega8L 6-channel ADC in PDIP package Six Channels 10-bit Accuracy Byte-oriented Two-wire Serial Interface Programmable Serial USART Master/Slave SPI Serial Interface Programmable Watchdog Timer with Separate On-chip Oscillator On-chip Analog Comparator Special Microcontroller Features Power-on Reset and Programmable Brown-out Detection Internal Calibrated RC Oscillator External and Internal Interrupt Sources Five Sleep Modes: Idle, ADC Noise Reduction, Power-save, Power-down, and Standby I/O and Packages 23 Programmable I/O Lines 28-lead PDIP, 32-lead TQFP, and 32-pad QFN/MLF Operating Voltages 2.7V - 5.5V (ATmega8L) 4.5V - 5.5V (ATmega8) Speed Grades 0 - 8MHz (ATmega8L) 0 - 16MHz (ATmega8) Power Consumption at 4Mhz, 3V, 25C Active: 3.6mA Idle Mode: 1.0mA Power-down Mode: 0.5A Rev.2486AAAVR02/2013ATmega8(L) Pin PDIP Configurations (RESET) PC6 1 28 PC5 (ADC5/SCL) (RXD) PD0 2 27 PC4 (ADC4/SDA) (TXD) PD1 3 26 PC3 (ADC3) (INT0) PD2 4 25 PC2 (ADC2) (INT1) PD3 5 24 PC1 (ADC1) (XCK/T0) PD4 6 23 PC0 (ADC0) VCC 7 22 GND GND 8 21 AREF (XTAL1/TOSC1) PB6 9 20 AVCC (XTAL2/TOSC2) PB7 10 19 PB5 (SCK) (T1) PD5 11 18 PB4 (MISO) (AIN0) PD6 12 17 PB3 (MOSI/OC2) (AIN1) PD7 13 16 PB2 (SS/OC1B) (ICP1) PB0 14 15 PB1 (OC1A) TQFP Top View (INT1) PD3 1 24 PC1 (ADC1) (XCK/T0) PD4 2 23 PC0 (ADC0) GND 3 22 ADC7 VCC 4 21 GND GND 5 20 AREF VCC 6 19 ADC6 (XTAL1/TOSC1) PB6 7 18 AVCC (XTAL2/TOSC2) PB7 8 17 PB5 (SCK) MLF Top View (INT1) PD3 1 24 PC1 (ADC1) (XCK/T0) PD4 2 23 PC0 (ADC0) GND ADC7 3 22 VCC 4 21 GND GND 20 AREF 5 VCC 6 19 ADC6 (XTAL1/TOSC1) PB6 7 18 AVCC (XTAL2/TOSC2) PB7 PB5 (SCK) 8 17 NOTE: The large center pad underneath the MLF packages is made of metal and internally connected to GND. It should be soldered or glued to the PCB to ensure good mechanical stability. If the center pad is left unconneted, the package might loosen from the PCB. 2 2486AAAVR02/2013 (T1) PD5 9 32 PD2 (INT0) (T1) PD5 9 32 PD2 (INT0) 10 31 (AIN0) PD6 PD1 (TXD) (AIN0) PD6 10 31 PD1 (TXD) (AIN1) PD7 11 30 PD0 (RXD) (AIN1) PD7 11 30 PD0 (RXD) (ICP1) PB0 12 29 PC6 (RESET) (ICP1) PB0 12 29 PC6 (RESET) (OC1A) PB1 13 28 PC5 (ADC5/SCL) (OC1A) PB1 13 28 PC5 (ADC5/SCL) (SS/OC1B) PB2 14 27 PC4 (ADC4/SDA) (SS/OC1B) PB2 14 27 PC4 (ADC4/SDA) 15 26 (MOSI/OC2) PB3 PC3 (ADC3) (MOSI/OC2) PB3 15 26 PC3 (ADC3) (MISO) PB4 16 25 PC2 (ADC2) (MISO) PB4 16 25 PC2 (ADC2)