Le87401NQC Microchip

Le87401 PLC Single Channel Line Driver Line Driver BD870 Series Product Brief Version 2 May 2013 Features Document Number 146538 Designed for HPAV2 Standard MIMO or SISO Operation Ordering Information Single Channel Operation Le87401NQC 16-pin QFN Green Pkg. Tray Small 16-pin, 4x4 mm Package The green package is Halogen free and meets RoHS Directive Low Power Operation 2002/95/EC of the European Council to minimize the environmental impact of electrical equipment. Class GH Operation Supports HPAV2 Power Save Mode Channel Enable/Disable Control Capable of Driving Line Impedance Between 12 to 100 Operations to 86 MHz Power Control Block High Signal Level Operation BSTEN -54.5 dBm/Hz, 2 30 MHz C0 IREF -85.0 dBm/Hz, 30 86 MHz Bias Control C1 +12 V Operation RoHS Compliant VINA + A VOUTA Applications Power Line Communications EN1 Home Networking HPNA B VOUTB G.HN VINB + Description The Le87401 is a single channel line driver designed Figure 1 - Block Diagram to work in Home Plug Alliance HPAV2 systems, G.HN and MOCA. This single channel device can be used for single-in, single-out (SISO) operation. Potentially, two single- channel devices can work together for multiple-in, multiple-out (MIMO) operation. The Le87401 can drive a line impedance of 100 down to 12 through a proper transformer and delivers superior performance with power efficiency using Class GH operation. 1 2013 Microsemi Corporation. All Rights Reserved. VS VBPI VBPO VBNO VBNI GNDLe87401 Product Brief Applications The Le87401 integrates two high-power line driver amplifiers. The amplifiers are designed for low distortion for signals up to 86 MHz. A typical PLC application is shown in Figure 2. Power Power Line Communications Line Wireless Line Driver + LAN/USB Processor POE AFE + LED Le87401 Driver Isolated DC/DC AC/DC Power Power Supply Figure 2 - PLC Application Diagram Pin Diagrams Top View 16 15 14 13 12 VBPO IREF 1 VINA 2 11 VS 16-pin QFN VINB 3 10 GND 4 9 VBNO GND EXPOSED PAD 5 6 7 8 Figure 3 - 16-Pin QFN Diagram The device incorporates an exposed die pad on the underside of its package. The pad acts as a heat sink and must be connected to a copper plane through thermal vias for proper heat dissipation. It is electrically isolated and may be connected to GND. 2 2013 Microsemi Corporation. All Rights Reserved. C1 C0 VOUTB VOUTA EN1 BSTEN VBNI VBPI