Le87402MQC Microchip

Le87402 PLC Dual Channel Line Driver Line Driver BD870 Series Product Brief Version 1 April 2013 Features Document Number 146539 Designed for HPAV2 Standard MIMO or SISO Operation Ordering Information Le87402MQC 28-pin QFN Green Pkg. Tray Best in Class Density The green package is Halogen free and meets RoHS Directive Dual Channel Architecture 2002/95/EC of the European Council to minimize the environmental impact of electrical equipment. 28-pin, 4x5 mm QFN Package Low Power Operation Class GH Operation Supports HPAV2 Power Save Mode Independent Channel Enable/Disable Control Capable of Driving Line Impedance Between 12 to 100 Power Control Block BSTEN Operations to 86 MHz High Signal Level Operation C0 IREF Bias -54.5 dBm/Hz, 2 30 MHz Control C1 -85.0 dBm/Hz, 30 86 MHz +12 V Operation + VINA A VOUTA RoHS Compliant Applications EN1 Power Line Communications Home Networking B VOUTB HPNA VINB + G.HN VINC + C VOUTC Description The Le87402 is a 2-channel line driver designed to work in Home Plug Alliance HPAV2 systems, G.HN EN2 and MOCA. Each channel can be enabled independently allowing multiple-in, multiple-out (MIMO) or single-in, single-out VOUTD D (SISO) operations. VIND + The Le87402 can drive a line impedance of 100 down to 12 through a proper transformer and Figure 1 - Block Diagram delivers superior performance with power efficiency using Class GH operation. 1 2013 Microsemi Corporation. All Rights Reserved. VS VBPI VBPO VBNO VBNI GNDLe87402 Product Brief Applications The Le87402 integrates two sets of high-power line driver amplifiers. The amplifiers are designed for low distortion for signals up to 86 MHz. A typical PLC application is shown in Figure 2 (one Line Driver channel shown). Power Power Line Communications Line Wireless Line Driver + POE LAN/USB Processor AFE + LED Le87402 Driver Isolated DC/DC AC/DC Power Power Supply Figure 2 - PLC Application Diagram Pin Diagram Top View 28 27 26 25 24 23 1 22 NC IREF VINA 2 21 VBPI VINB 3 20 VS GND 4 19 VS 28-pin QFN GND 5 18 VS VINC 6 17 GND VIND 7 16 VBNI NC 8 15 NC EXPOSED PAD 9 10 11 12 13 14 Figure 3 - Pin Diagram The device incorporates an exposed die pad on the underside of its package. The pad acts as a heat sink and must be connected to a copper plane through thermal vias for proper heat dissipation. It is electrically isolated and may be connected to GND. 2 2013 Microsemi Corporation. All Rights Reserved. C1 C0 VOUTD VOUTA EN2 EN1 VOUTC VOUTB GND BSTEN VBNO VBPO