SM0502-M1 Microchip

www.MICROSEMI.com SM0502 SM1003 SM0502 SM1003 CONTROL DEVICES TM Surface Mount MELF PIN Diodes RoHS Compliant Versions DESCRIPTION KEY FEATURES 1 This line of MELF high power PIN diodes are hermetically sealed Non-Magnetic Versions Ideal for surface mount packaged devices with full face bonded chips for low MRI Applications inductance construction. The MELF ceramic package has square end Very Low Inductance, Full Face terminations which are ideal for surface mount and pick and place operations. The PIN diode chips are coated with a special hard glass Bonding passivation which is required for high power applications and to Hi-Rel Hermetic Design enhance the reliability resulting in MTBFs of greater than one million Surface Mount Devices Available hours. in Tape and Reel RoHS compliant versions of these products meet RoHS requirements per EU 2 RoHS Compliant Versions Directive 2002/95/EC. The standard terminal finish is gold unless otherwise specified. Consult the factory if you have special requirements. Available APPLICATIONS The MELF diodes are used as switching, attenuating and phase shifting elements from HF through 2 GHz and have breakdown APPLICATIONS/BENEFITS 1 voltage ratings up to 500 volts. Non-magnetic .Cer-Met. (MELFs) Designed for Low Loss Low are also used as switching elements in MRI (magnetic resonance Distortion Applications imaging). Conventional Magnetic MELF packages are used in Cellular, Beam Steering units (telephone via satellites) surface mount Switch Filter Bank applications, and Filter Switch banks for Frequency Hopping Radios. T/R Control Attenuators MRI Switching ABSOLUTE MAXIMUM RATINGS AT 25 C (UNLESS OTHERWISE SPECIFIED) Rating Symbol Value Unit Maximum Leakage Current I 500 nA R 80% of Minimum Rated V B Forward Current (1us Pulse) I 1 A F Storage Temperature T -55 to +150 C STG Operating Temperature T -55 to +150 C OP 1 Non Magnetic refers to any products that IMPORTANT: For the most current data, consult our website: www.MICROSEMI.com are designed with low and ultra low Specifications are subject to change, consult factory for the latest information. magnetic materials for use in MRI systems These devices are ESD sensitive and must be handled using ESD precautions. 2 RoHS versions are supplied with a matte tin finish Microsemi Page 1 Copyright 2007 Microwave Products Rev: 2009-02-25 75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748 www.MICROSEMI.com ELECTRICAL ELECTRICAL SM0502 SM1003 CONTROL DEVICES TM Surface Mount MELF PIN Diodes RoHS Compliant Versions ELECTRICAL PARAMETERS 25C (unless otherwise specified) 1 2 2 V (V) C (pF) R ( ) R ( ) T (uS) b T s s L P (C/W) I =10 A 50V 100 mA 200 mA . R Model Number THERMAL RESISTANCE (Min) (Max) (Max) (Typ) (Typ) (Max) SM0502 M1 500 0.5 0.7 0.55 1.0 35 SM0504 M1 500 0.6 0.6 0.45 1.5 20 SM0508 M1 500 0.9 0.4 0.25 2.0 15 SM0509 M1 500 1.2 0.35 0.2 2.5 15 SM0511 M1 500 1.25 0.3 0.15 3.0 15 SM0512 M1 500 1.5 0.25 0.12 3.5 15 SM1002 M1 50 1.2 0.75 50mA 0.2 4.0 15 SM1003 M1 35 1.2 20V 0.5 10mA 0.1 0.6 25 Notes: 1- Capacitance (C ) is measured at F = 1 MHz T 2- Series Resistance (R ) is measured at F = 100 MHz S RoHS and MRI Models Base Model RoHS Compliant PN Non-Mag. / RoHS PN SM0502 M1 SMX0502 M1 SMX0502MR M1 SM0504 M1 SMX0504 M1 SMX0504MR M1 SM0508 M1 SMX0508 M1 SMX0508MR M1 SM0509 M1 SMX0509 M1 SMX0509MR M1 SM0511 M1 SMX0511 M1 SMX0511MR M1 SM0512 M1 SMX0512 M1 SMX0512MR M1 SM1002 M1 SMX1002 M1 SMX1002MR M1 SM1003 M1 SMX1003 M1 SMX1003MR M1 Microsemi Page 2 Copyright 2007 Microwave Products Rev: 2009-02-25 75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748