B5817X2-TP Micro Commercial Components (MCC)

B5817X2 Features Lead Free Finish/RoHS Compliant Suffix Designates RoHS Compliant. See Ordering Information) 1 Amp Surface Mount Package Ideally Suited for Automatic Insertion Halogen Free Available Upon Request By Adding Suffix-H Schottky Rectifier Epoxy Meets UL 94 V-0 Flammability Rating Moisture Sensitivity Level 1 20 Volts Maximum Ratings Operating Junction Temperature Range: -55C to +125C Storage Temperature Range: -55C to +150C Maximum Thermal Resistance : 667C/W Junction to Ambient Maximum Maximum DC MCC Device Recurrent Maximum Blocking SOD-523 Part Number Marking Peak Reverse RMS Voltage Voltage Voltage B5817X2 4A 20V 14V 20V A B Electrical Characteristics @ 25C Unless Otherwise Specified C E Average Forward I 1A F (AV) G Current D Non-Repetitive Peak F I 4A 8.3ms Half Sine FSM Forward Surge Current H I =10mA; 0.30V F Maximum V Instantaneous I =100mA; F 0.40V F Forward Voltage I =1A; 0.60V F Maximum DC Reverse DIMENSIONS o 2 0A V = 10V, T =25 C A R INCHES MM Current at Rated DC I R DIM NOTE o 3 0A V = 20V, T =25 C A MIN MAX MIN MAX R Blocking Voltage A 0.059 0.067 1.50 1.70 B 0.043 0.051 1.10 1.30 Capacitance Between C 0.030 0.033 0.75 0.85 1 20pF V =0, f=1MHz C R T Terminals D 0.001 0.003 0.01 0.07 E 0.010 0.014 0.25 0.35 F 0.003 0.006 0.08 0.15 Power Dissipation P 150mW D G 0.020 0.028 0.50 0.70 H 0.020 0.031 0.51 0.77 Suggested Solder Pad Layout 1.1mm 0.8mm 0.6mm Rev.3-1-01012019 1/3 MCCSEMI.COMB5817X2 Curve CharacteristicsCurve Characteristics Fig. 1 - Typical Instantaneous Forward Characteristics Fig. 2 - Typical Reverse Leakage Characteristics 1000 2 1 100 T =100C A T =100C A 10 T =25C A 0.1 1 T =25C A 0.01 0.1 0.0 0.2 0.4 0.6 0.8 1.0 0 4 8 12 16 20 Instantaneous Forward Voltage (V) Reverse Voltage (V) Fig. 3 - Power Derating Curve 200 150 100 50 0 0 25 50 75 100 125 Ambient Temperature (C) Rev.3-1-01012019 2/3 MCCSEMI.COM Power Dissipation (mW) Instantaneous Forward Current (A) Instantaneous Reverse Leakage Current ( A)