ES1D-LTP Micro Commercial Components (MCC)

NOT RECOMMENDED FOR NEW DESIGNS USE ES1A-LTP~ES1J-LTP SERIES M C C R Micro Commercial Components ES1A Micro Commercial Components THRU 130 W Cochran St, Unit B Simi Valley, CA 93065 ES1M Tel:818-701-4933 Features Halogen free available upon request by adding suffix-H Suffix designates Lead Free Finish/Rohs Compliant (Note1) 1 Amp Ultra Fast Compliant. See ordering information) Epoxy meets UL 94 V-0 flammability rating Recovery Moisture Sensitivity Level 1 Silicon Rectifier x High Temp Soldering: 260Cq for 10 Seconds At Terminals x Superfast Recovery Times For High Efficiency 50 to 1000 Volts Maximum Ratings x Operating TemperatureqC : to -50+150 qC DO-214AC x Storage Temperature: -50 qC to +150 qC x Maximum Thermal Resistance 15qC/W Junction To Lead (HSMA) (High Profile) MCC Maximum Maximum Maximum H Part Device Recurrent RMS DC Cathode Band Number Marking Peak Reverse Voltage Blocking Voltage Voltage J ES1A ES1A 50V 35V 50V ES1B ES1B 100V 70V 100V ES1C ES1C 150V 105V 150V ES1D ES1D 200V 140V 200V A ES1G ES1G 400V 280V 400V C ES1J ES1J 600V 420V 600V ES1K ES1K 800V 560V 800V E D B F ES1M ES1M 1000V 700V 1000V Electrical Characteristics 25q C Unless Otherwise Specified G Average Forward I 1.0A T = 75 qC F(AV) a DIMENSIONS Current INCHES MM Peak Forward Surge I 30A 8.3ms, half sine FSM DIM MIN MAX MIN MAX NOTE A .078 .116 1.98 2.95 Current B .067 .089 1.70 2.25 C .002 .008 .05 .20 Maximum D --- .02 --- .51 Instantaneous E .035 .055 .89 1.40 F .065 .096 1.65 2.45 Forward Voltage G .205 .224 5.21 5.69 H .160 .180 4.06 4.57 ES1A-D V .975V I = 1.0A F FM J .100 .112 2.57 2.84 ES1G-J 1.35V T = 25 qC* J ES1K~M 1.70V SUGGESTED SOLDER Maximum DC PAD LAYOUT Reverse Current At I 5P A T = 25Cq R J 0.090 Rated DC Blocking 100 P A T = 100 qC J Voltage Maximum Reverse Recovery Time 0.085 ES1A-D T 50ns I =0.5A, I =1.0A, rr F R ES1G-K 75ns I =0.25A rr ES1M 100ns 0.070 Typical Junction C 45pF Measured at J Capacitance 1.0MHz, V =4.0V R *Pulse test: Pulse width 200 P sec, Duty cycle 2% Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7. www.mccsemi.com Revision: C 2013/01/01 1 of 4M C C R Micro Commercial Components ES1A thru ES1M Figure 1 Typical Forward Characteristics Figure 2 Forward Derating Curve 2.4 50 2.2 ES1A~ES1D 2.0 10 ES1G~ES1J 1.8 1.6 3.0 1.4 ES1K~ES1M 1.0 1.2 Amps 1.0 .8 .6 0.1 .4 Single Phase, Half Wave .2 60Hz Resistive or Inductive Load 0 25 50 75 100 125 150 0 .01 .6 .8 1.0 1.2 1.4 1.6 1.8 2.0 C FORWARD VOLTAGE,(V) Average Forward Rectified Current - Amperesversus Ambient Temperature -C Instantaneous Forward Current - Amperes versus Instantaneous Forward Voltage - Volts Figure 3 Junction Capacitance 100 60 40 20 T =25C f=1MHZ J pF 10 6 4 2 1 .1 .2 .4 1 2 4 10 20 40 100 200 400 1000 Volts Junction Capacitance - pF versus Reverse Voltage - Volts www.mccsemi.com Revision: C 2013/01/01 2 of 4 INSTANTANEOUS FORWARD CURRENT,(A)