X-On Electronics has gained recognition as a prominent supplier of MT29F2G01ABAGD12-AAT:G TR NAND Flash across the USA, India, Europe, Australia, and various other global locations. MT29F2G01ABAGD12-AAT:G TR NAND Flash are a product manufactured by Micron. We provide cost-effective solutions for NAND Flash, ensuring timely deliveries around the world.

MT29F2G01ABAGD12-AAT:G TR Micron

MT29F2G01ABAGD12-AAT:G TR electronic component of Micron
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Part No.MT29F2G01ABAGD12-AAT:G TR
Manufacturer: Micron
Category: NAND Flash
Description: NAND Flash SLC 2G 2GX1 TBGA
Datasheet: MT29F2G01ABAGD12-AAT:G TR Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 4.2987 ea
Line Total: USD 4.3 
Availability - 266
Ship by Wed. 20 Nov to Fri. 22 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
266
Ship by Wed. 20 Nov to Fri. 22 Nov
MOQ : 1
Multiples : 1
1 : USD 4.2987
10 : USD 3.9606
100 : USD 3.55
250 : USD 3.5379
500 : USD 3.4052
1000 : USD 3.2844
2000 : USD 3.1274
5000 : USD 3.0308
10000 : USD 2.9825

   
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We are delighted to provide the MT29F2G01ABAGD12-AAT:G TR from our NAND Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MT29F2G01ABAGD12-AAT:G TR and other electronic components in the NAND Flash category and beyond.

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2, 4, 8Gb: x8/x16 Multiplexed NAND Flash Memory Features NAND Flash Memory MT29F2G08AABWP/MT29F2G16AABWP MT29F4G08BABWP/MT29F4G16BABWP MT29F8G08FABWP Figure 1: 48-Pin TSOP Type 1 Features Organization: Page size: x8: 2,112 bytes (2,048 + 64 bytes) x16: 1,056 words (1,024 + 32 words) Block size: 64 pages (128K + 4K bytes) Device size: 2Gb: 2,048 blocks 4Gb: 4,096 blocks 8Gb: 8,192 blocks Read performance: Random read: 25s Sequential read: 30ns (3V x8 only) Write performance: Page program: 300s (TYP) Block erase: 2ms (TYP) Endurance: 100,000 PROGRAM/ERASE cycles Data retention: 10 years First block (block address 00h) guaranteed to be valid without ECC (up to 1,000 PROGRAM/ERASE cycles) Options Marking VCC: 2.7V3.6V Density: Automated PROGRAM and ERASE 2Gb (single die) MT29F2GxxAAB Basic NAND command set: 4Gb (dual-die stack) MT29F4GxxBAB PAGE READ, RANDOM DATA READ, READ ID, 8Gb (quad-die stack) MT29F8GxxFAB READ STATUS, PROGRAM PAGE, RANDOM DATA Device width: INPUT, PROGRAM PAGE CACHE MODE, INTER- x8 MT29Fxx08x NAL DATA MOVE, INTERNAL DATA MOVE with x16 MT29Fxx16x Configuration: of of of RANDOM DATA INPUT, BLOCK ERASE, RESET die CE R/B New commands: 11 1 A PAGE READ CACHE MODE 21 1 B READ UNIQUE ID (contact factory) 42 2 F READ ID2 (contact factory) VCC: 2.7V3.6V A Operation status byte provides a software method of Second generation die B detecting: Package: PROGRAM/ERASE operation completion 48 TSOP type I (lead-free) WP PROGRAM/ERASE pass/fail condition 48 TSOP type I (NEW version, WA Write-protect status 8Gb device only, lead-free) Ready/busy (R/B ) pin provides a hardware 48 TSOP type I (contact factory) WG method of detecting PROGRAM or ERASE cycle Operating temperature: completion Commercial (0C to 70C) None PRE pin: prefetch on power up Extended temperature (-40C to +85C) ET WP pin: hardware write protect PDF: 09005aef818a56a7 / Source: 09005aef81590bdd Micron Technology, Inc., reserves the right to change products or specifications without notice. 2gb nand m29b 1.fm - Rev. I 1/06 EN 1 2004 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice. 2, 4, 8Gb: x8/x16 Multiplexed NAND Flash Memory Part Numbering Information Part Numbering Information Micron NAND Flash devices are available in several different configurations and densities. (See Figure 2.) Figure 2: Part Number Chart MT 29F 2G 08 A A B WP ES Micron Technology Production Status Blank = Production Product Family ES = Engineering Sample 29F = Single-Supply NAND Flash Memory MS = Mechanical Sample Density Operating Temperature Range 2G = 2Gb Blank = Commercial (0C to +70C) 4G = 4Gb ET = Extended (40 to +85C) 8G = 8Gb Reserved for Future Use Device Width 08 = 8 bits Reserved for Future Use 16 = 16 bits Package Codes Classification WP = 48-pin TSOP I (lead-free) of die of CE of R/B I/O WA = 48-pin TSOP I (new version, A 1 1 1 Common 8Gb device only, lead-free) B 2 1 1 Common WG = 48-pin TSOP I (contact factory) F 4 2 2 Common Generation Operating Voltage Range A = 1st Generation Die A = 3.3V (2.70V3.60V) B = 2nd Generation Die C = 3rd Generation Die Valid Part Number Combinations After building the part number from the part numbering chart above, verify that the part number is valid using the Micron Parametric Part Search Web site at

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
Elpida Memory
ELPIDA MEMORY INC
IE6
MI9
MICRON SEMICONDUCTOR
Micron Tech
MICRON TECHNOLOGY
Micron Technology Inc
Micron Technology Inc.
NU9
Numonyx - A DIVISION OF MICRON SEMICONDUCTOR PRODUCTS, INC. (VA)
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