X-On Electronics has gained recognition as a prominent supplier of MT29F4G08ABBDAH4:D TR NAND Flash across the USA, India, Europe, Australia, and various other global locations. MT29F4G08ABBDAH4:D TR NAND Flash are a product manufactured by Micron. We provide cost-effective solutions for NAND Flash, ensuring timely deliveries around the world.

MT29F4G08ABBDAH4:D TR Micron

MT29F4G08ABBDAH4:D TR electronic component of Micron
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Part No.MT29F4G08ABBDAH4:D TR
Manufacturer: Micron
Category: NAND Flash
Description: NAND Flash SLC 4G 512MX8 FBGA
Datasheet: MT29F4G08ABBDAH4:D TR Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 5.1282 ea
Line Total: USD 5.13 
Availability - 910
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
910
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ : 1
Multiples : 1
1 : USD 5.1282
10 : USD 4.3775
100 : USD 4.1811
250 : USD 4.0772
500 : USD 3.927
1000 : USD 3.465
2000 : USD 3.4534

   
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We are delighted to provide the MT29F4G08ABBDAH4:D TR from our NAND Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MT29F4G08ABBDAH4:D TR and other electronic components in the NAND Flash category and beyond.

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Micron Confidential and Proprietary 4Gb, 8Gb, 16Gb: x8, x16 NAND Flash Memory Features NAND Flash Memory MT29F4G08ABADAH4, MT29F4G08ABADAWP, MT29F4G08ABBDAH4, MT29F4G08ABBDAHC, MT29F4G16ABADAH4, MT29F4G16ABADAWP, MT29F4G16ABBDAH4, MT29F4G16ABBDAHC, MT29F8G08ADADAH4, MT29F8G08ADBDAH4, MT29F8G16ADADAH4, MT29F8G16ADBDAH4, MT29F16G08AJADAWP First block (block address 00h) is valid when ship- Features ped from factory with ECC. For minimum required 1 Open NAND Flash Interface (ONFI) 1.0-compliant ECC, see Error Management. Single-level cell (SLC) technology Block 0 requires 1-bit ECC if PROGRAM/ERASE cy- Organization cles are less than 1000 Page size x8: 2112 bytes (2048 + 64 bytes) RESET (FFh) required as first command after pow- Page size x16: 1056 words (1024 + 32 words) er-on Block size: 64 pages (128K + 4K bytes) Alternate method of device initialization (Nand In- Plane size: 2 planes x 2048 blocks per plane it) after power up (contact factory) Device size: 4Gb: 4096 blocks 8Gb: 8192 blocks Internal data move operations supported within the 16Gb: 16,384 blocks plane from which data is read Asynchronous I/O performance Quality and reliability t t RC/ WC: 20ns (3.3V), 25ns (1.8V) Data retention: 10 years Array performance Endurance: 100,000 PROGRAM/ERASE cycles 3 Read page: 25s Operating voltage range 3 Program page: 200s (TYP: 1.8V, 3.3V) V : 2.73.6V CC Erase block: 700s (TYP) V : 1.71.95V CC Command set: ONFI NAND Flash Protocol Operating temperature: Advanced command set Commercial: 0C to +70C 4 Program page cache mode Industrial (IT): 40C to +85C 4 Read page cache mode Automotive Industrial (AIT): 40C to +85C One-time programmable (OTP) mode Automotive (AAT): 40C to +105C 4 Two-plane commands Package 2 Interleaved die (LUN) operations 48-pin TSOP type 1, CPL Read unique ID 63-ball VFBGA Block lock (1.8V only) 1. The ONFI 1.0 specification is available at Notes: Internal data move www.onfi.org. Operation status byte provides software method for 2. CPL = Center parting line. detecting 3. See Program and Erase Characteristics for Operation completion t t R ECC and PROG ECC specifications. Pass/fail condition 4. These commands supported only with ECC Write-protect status disabled. Ready/Busy (R/B ) signal provides a hardware method of detecting operation completion WP signal: Write protect entire device PDF: 09005aef83b25735 Micron Technology, Inc. reserves the right to change products or specifications without notice. 1 m60a 4gb 8gb 16gb ecc nand.pdf - Rev. Q 04/14 EN 2009 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice.Micron Confidential and Proprietary 4Gb, 8Gb, 16Gb: x8, x16 NAND Flash Memory Features Part Numbering Information Micron NAND Flash devices are available in different configurations and densities. Verify valid part numbers by using Microns part catalog search at www.micron.com. To compare features and specifications by device type, visit www.micron.com/products. Contact the factory for devices not found. Figure 1: Marketing Part Number Chart MT 29F 4G 08 A B A D A WP IT ES :D Micron Technology Design Revision (shrink) Product Family Production Status 29F = NAND Flash memory Blank = Production ES = Engineering sample Density MS = Mechanical sample 4G = 4Gb QS = Qualification sample 8G = 8Gb 16G = 16Gb Special Options Blank Device Width X = Product longevity program (PLP) 08 = 8-bit 16 = 16-bit Operating Temperature Range Blank = Commercial (0C to +70C) Level IT = Industrial (40C to +85C) A = SLC AIT = Automotive Industrial (40C to +85C) AAT = Automotive (40C to +105C) Classification Mark Die nCE RnB I/O Channels B 1 1 1 1 Speed Grade D 2 1 1 1 Blank J 4 2 2 1 Package Code Operating Voltage Range WP = 48-pin TSOP Type 1 HC = 63-ball VFBGA (10.5 x 13 x 1.0mm) A = 3.3V (2.73.6V) B = 1.8V (1.71.95V) H4 = 63-ball VFBGA (9 x 11 x 1.0mm) Interface Feature Set A = Async only D = Feature set D PDF: 09005aef83b25735 Micron Technology, Inc. reserves the right to change products or specifications without notice. 2 m60a 4gb 8gb 16gb ecc nand.pdf - Rev. Q 04/14 EN 2009 Micron Technology, Inc. All rights reserved.

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
Elpida Memory
ELPIDA MEMORY INC
IE6
MI9
MICRON SEMICONDUCTOR
Micron Tech
MICRON TECHNOLOGY
Micron Technology Inc
Micron Technology Inc.
NU9
Numonyx - A DIVISION OF MICRON SEMICONDUCTOR PRODUCTS, INC. (VA)
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