MT36JDZS2G72PZ-1G6E1 Micron

16GB (x72, ECC, DR) 240-Pin DDR3 VLP RDIMM Features DDR3 SDRAM VLP RDIMM MT36JDZS2G72PZ 16GB Figure 1: 240-Pin RDIMM Features (MO-269 R/C N, R/C N1) DDR3 functionality and operations supported as Module height: 18.75mm (0.74in) defined in the component data sheet 240-pin, registered dual in-line very low profile memory module (VLP RDIMM) Fast data transfer rates: PC3-14900, PC3-10600, PC3-8500, or PC3-6400 Options Marking 1 Operating temperature Full module heat spreader Commercial (0C T +70C) None A 16GB (2 Gig x 72) Package V = 1.5V 0.075V DD 240-pin DIMM (halogen-free) Z V = 3.03.6V DDSPD Frequency/CAS latency Supports ECC error detection and correction 1.07ns CL = 13 (DDR3-1866) -1G9 Nominal and dynamic on-die termination (ODT) for 1.25ns CL = 11 (DDR3-1600) -1G6 data, strobe, and mask signals 1. Contact Micron for industrial temperature Note: Dual rank, using 8Gb TwinDie DDR3 module offerings. devices 2 On-board I C temperature sensor with integrated serial presence-detect (SPD) EEPROM 8 internal device banks Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) Selectable BC4 or BL8 on-the-fly (OTF) Gold edge contacts Halogen-free Fly-by topology Terminated control, command, and address bus Table 1: Key Timing Parameters Data Rate (MT/s) t t t Speed Industry CL = CL = CL = RCD RP RC Grade Nomenclature 13 11 10 CL = 9 CL = 8 CL = 7 CL = 6 CL = 5 (ns) (ns) (ns) -1G9 PC3-14900 1866 1600 1333 1333 1066 1066 800 667 13.125 13.125 47.125 -1G6 PC3-12800 1600 1333 1333 1066 1066 800 667 13.125 13.125 48.125 -1G4 PC3-10600 1333 1333 1066 1066 800 667 13.125 13.125 49.125 -1G1 PC3-8500 1066 1066 800 667 13.125 13.125 50.625 -1G0 PC3-8500 1066 800 667 15 15 52.5 -80B PC3-6400 800 667 15 15 52.5 PDF: 09005aef84d98f93 Micron Technology, Inc. reserves the right to change products or specifications without notice. 1 jdzs36c2gx72pz.pdf - Rev. D 4/13 EN 2012 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice.16GB (x72, ECC, DR) 240-Pin DDR3 VLP RDIMM Features Table 2: Addressing Parameter 16GB Refresh count 8K Row address 64K A 15:0 Device bank address 8 BA 2:0 Device configuration 8Gb TwinDie (2 Gig x 4) Column address 2K A 11, 9:0 Module rank address 2 S 1:0 Table 3: Part Numbers and Timing Parameters 16GB Modules 1 Base device: MT41J2G4, 8Gb TwinDie DDR3 SDRAM Module Module Memory Clock/ Clock Cycles 2 t t Part Number Density Configuration Bandwidth Data Rate (CL- RCD- RP) MT36JDZS2G72PZ-1G9 16GB 2 Gig x 72 14.9GB/s 1.07ns/1866 MT/s 13-13-13 MT36JDZS2G72PZ-1G6 16GB 2 Gig x 72 12.8GB/s 1.25ns/1600 MT/s 11-11-11 Notes: 1. The data sheet for the base device can be found on Microns web site. 2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Consult factory for current revision codes. Example: MT36JDZS2G72PZ-1G6E1. PDF: 09005aef84d98f93 Micron Technology, Inc. reserves the right to change products or specifications without notice. 2 jdzs36c2gx72pz.pdf - Rev. D 4/13 EN 2012 Micron Technology, Inc. All rights reserved.