16GB (x72, ECC, DR) 240-Pin DDR3 RDIMM
Features
DDR3 SDRAM RDIMM
MT36JSF2G72PZ 16GB
Figure 1: 240-Pin RDIMM (R/C J1)
Features
Module height: 30mm (1.181in)
DDR3 functionality and operations supported as
defined in the component data sheet
240-pin, registered dual in-line memory module
(RDIMM)
Fast data transfer rates: PC3-14900, PC3-12800,
PC3-10600, PC3-8500, or PC3-6400
Figure 2: 240-Pin RDIMM (R/C E2)
16GB (2 Gig x 72)
V = 1.5V 0.075V
DD Module height: 30mm (1.181in)
V = 3.03.6V
DDSPD
Supports ECC error detection and correction
Nominal and dynamic on-die termination (ODT) for
data and strobe signals
Dual-rank
Options Marking
8 internal device banks
Operating temperature
Fixed burst chop (BC) of 4 and burst length (BL) of 8
Commercial (0C T 70C) None
A
via the mode register set (MRS)
Package
2
On-board I C temperature sensor with integrated
240-pin DIMM (halogen-free) Z
serial presence-detect (SPD) EEPROM
Frequency/CAS latency
Gold edge contacts
1.07ns @ CL = 13 (DDR3-1866) -1G9
Halogen-free
1.25ns @ CL = 11 (DDR3-1600) -1G6
Fly-by topology
1.5ns @ CL = 9 (DDR3-1333) -1G4
1.87ns @ CL = 7 (DDR3-1066) -1G1
Terminated control, command, and address bus
Table 1: Key Timing Parameters
Data Rate (MT/s)
t t t
Speed Industry CL = CL = CL = RCD RP RC
Grade Nomenclature 13 11 10 CL = 9 CL = 8 CL = 7 CL = 6 CL = 5 (ns) (ns) (ns)
-1G9 PC3-14900 1866 1600 1333 1333 1066 1066 800 667 13.125 13.125 47.125
-1G6 PC3-12800 1600 1333 1333 1066 1066 800 667 13.125 13.125 48.125
-1G4 PC3-10600 1333 1333 1066 1066 800 667 13.125 13.125 49.125
-1G1 PC3-8500 1066 1066 800 667 13.125 13.125 50.625
-1G0 PC3-8500 1066 800 667 15 15 52.5
-80B PC3-6400 800 667 15 15 52.5
PDF: 09005aef846f3cd1 Micron Technology, Inc. reserves the right to change products or specifications without notice.
1
jsf36c2gx72pz.pdf - Rev. F 4/14 EN 2011 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.16GB (x72, ECC, DR) 240-Pin DDR3 RDIMM
Features
Table 2: Addressing
Parameter 16GB
Refresh count 8K
Row address 64K A[15:0]
Device bank address 8 BA[2:0]
Device configuration 4Gb (1Gig x 4)
Column address 2K A[11, 9:0]
Module rank address 2 S#[1:0]
Table 3: Part Numbers and Timing Parameters 16GB Modules
1
Base device: MT41J1G4, 4Gb DDR3 SDRAM
Module Module Memory Clock/ Clock Cycles
2 t t
Part Number Density Configuration Bandwidth Data Rate (CL- RCD- RP)
MT36JSF2G72PZ-1G9__ 16GB 2 Gig x 72 14.9 GB/s 1.07ns/1866 MT/s 13-13-13
MT36JSF2G72PZ-1G6__ 16GB 2 Gig x 72 12.8 GB/s 1.25ns/1600 MT/s 11-11-11
MT36JSF2G72PZ-1G4__ 16GB 2Gig x 72 10.6 GB/s 1.5ns/1333 MT/s 9-9-9
MT36JSF2G72PZ-1G1__ 16GB 2 Gig x 72 8.5 GB/s 1.87ns/1066 MT/s 7-7-7
Notes: 1. The data sheet for the base device can be found on Microns web site.
2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions.
Consult factory for current revision codes. Example: MT36JSF2G72PZ-1G4N1.
PDF: 09005aef846f3cd1 Micron Technology, Inc. reserves the right to change products or specifications without notice.
2
jsf36c2gx72pz.pdf - Rev. F 4/14 EN 2011 Micron Technology, Inc. All rights reserved.