1.125Gb: x18, x36 RLDRAM 3
Features
RLDRAM 3
MT44K64M18 4 Meg x 18 x 16 Banks
MT44K32M36 2 Meg x 36 x 16 Banks
1
Options Marking
Features
t
Clock cycle and RC timing
1200 MHz DDR operation (2400 Mb/s/ball data
t
0.83ns and RC (MIN) = 6.67ns -083F
rate)
(RL3-2400)
86.4Gb/s peak bandwidth (x36 at 1200 MHz clock
t
0.83ns and RC (MIN) = 7.5ns -083E
frequency)
(RL3-2400)
Organization
t
0.93ns and RC (MIN) = 7.5ns -093F
64 Meg x 18, and 32 Meg x 36 common I/O (CIO)
(RL3-2133)
16 banks
t
0.93ns and RC (MIN) = 8ns -093E
1.2V center-terminated push/pull I/O
(RL3-2133)
2.5V V , 1.35V V , 1.2V V (optional 1.35V
t
EXT DD DDQ
1.07ns and RC (MIN) = 8ns -107E
V for 2400 operation only).
DDQ
(RL3-1866)
t
Reduced cycle time ( RC (MIN) = 6.67 - 8ns)
Configuration
SDR addressing
64 Meg x 18 64M18
Programmable READ/WRITE latency (RL/WL) and
32 Meg x 36 32M36
burst length
Operating temperature
Data mask for WRITE commands
Commercial (T = 0 to +95C) None
C
Differential input clocks (CK, CK#)
Industrial (T = 40C to +95C) IT
C
Free-running differential input data clocks (DKx,
Package
DKx#) and output data clocks (QKx, QKx#)
168-ball BGA (Pb-free) RB
On-die DLL generates CK edge-aligned data and
Revision :A
differential output data clock signals
1. Not all options listed can be combined to
Note:
64ms refresh (128K refresh per 64ms)
define an offered product. Use the part cat-
168-ball BGA package
alog search on www.micron.com for availa-
or 60 matched impedance outputs
ble offerings.
Integrated on-die termination (ODT)
Single or multibank writes
Extended operating range (2001200 MHz)
READ training register
Multiplexed and non-multiplexed addressing capa-
bilities
Mirror function
Output driver and ODT calibration
JTAG interface (IEEE 1149.1-2001)
PDF: 09005aef85a88362 Micron Technology, Inc. reserves the right to change products or specifications without notice.
1
1.125Gb_rldram3.pdf Rev. E 1/19 EN 2015 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.1.125Gb: x18, x36 RLDRAM 3
Features
Figure 1: 1Gb RLDRAM 3 Part Numbers
Example Part Number: MT44K32M36RB-093E:A
-:
MT44K Configuration Package Speed Temp Rev
Revision
Die Rev :A
Configuration
64 Meg x 18 64M18
Temperature
32 Meg x 36 32M36
None
Commercial
IT
Industrial
Package
Speed Grade
168-ball BGA (Pb-free) RB
t
t
-083F CK = 0.83ns (6.67ns RC)
t t
-083E CK = 0.83ns (7.5ns RC)
t t
-093F CK = 0.93ns (7.5ns RC)
t t
-093E CK = 0.93ns (8ns RC)
t t
-107E CK = 1.07ns (8ns RC)
BGA Part Marking Decoder
Due to space limitations, BGA-packaged components have an abbreviated part marking that is different from the
part number. Microns BGA Part Marking Decoder is available on Microns Web site at www.micron.com.
PDF: 09005aef85a88362 Micron Technology, Inc. reserves the right to change products or specifications without notice.
2
1.125Gb_rldram3.pdf Rev. E 1/19 EN 2015 Micron Technology, Inc. All rights reserved.