4Gb: x4, x8 TwinDie DDR2 SDRAM Features TwinDie DDR2 SDRAM MT47H1G4 64 Meg x 4 x 8 Banks x 2 Ranks MT47H512M8 32 Meg x 8 x 8 Banks x 2 Ranks Options Marking Features Configuration Uses 2Gb Micron die 64 Meg x 4 x 8 banks x 2 ranks 1G4 Two ranks (includes dual CS , ODT, and CKE balls) 32 Meg x 8 x 8 banks x 2 ranks 512M8 Each rank has 8 internal banks for concurrent oper- FBGA package (Pb-free) ation 63-ball FBGA (9mm x 11.5mm) Rev. WTR V = V = +1.8V 0.1V DD DDQ C JEDEC-standard 63-ball FBGA 1 Timing cycle time Low-profile package 1.35mm MAX thickness 2.5ns CL = 5 (DDR2-800) -25E 2.5ns CL = 6 (DDR2-800) -25 Functionality 3.0ns CL = 5 (DDR2-667) -3 The 4Gb (TwinDie ) DDR2 SDRAM uses Microns 3.75ns CL = 4 (DDR2-533) -37E 2Gb DDR2 monolithic die and has similar functionali- Self refresh ty. This TwinDie data sheet is intended to provide a Standard None general description, package dimensions, and the Operating temperature ballout only. Refer to Micron s 2Gb DDR2 data sheet Commercial (0C T 85C) None for complete information or for specifications not in- C Revision :C cluded in this document. Note: 1. CL = CAS (READ) latency. Table 1: Key Timing Parameters Data Rate (MT/s) Speed t t t t Grade CL = 3 CL = 4 CL = 5 CL = 6 RCD (ns) RP (ns) RC (ns) RFC (ns) -25E 400 533 800 800 12.5 12.5 55 197.5 -25 400 533 667 800 15 15 55 197.5 -3 400 533 667 n/a 15 15 55 197.5 -37E 400 533 n/a n/a 15 15 55 197.5 Table 2: Addressing Parameter 1 Gig x 4 512 Meg x 8 Configuration 64 Meg x 4 x 8 banks x 2 ranks 32 Meg x 8 x 8 banks x 2 ranks Refresh count 8K 8K Row address A 14:0 (32K) A 14:0 (32K) Bank address BA 2:0 (8) BA 2:0 (8) Column address A 11, 9:0 (2K) A 9:0 (1K) CCMTD-1725822587-6461 Micron Technology, Inc. reserves the right to change products or specifications without notice. 1 mt47h1g 64m 32m twindie.pdf - Rev. J 09/18 EN 2006 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice.4Gb: x4, x8 TwinDie DDR2 SDRAM Important Notes and Warnings Important Notes and Warnings Micron Technology, Inc. Micro) reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions. This document supersedes and replaces all information supplied prior to the publication hereof. You may not rely on any information set forth in this docu- ment if you obtain the product described herein from any unauthorized distributor or other source not authorized by Micron. Automotive Applications. Products are not designed or intended for use in automotive applications unless specifi- cally designated by Micron as automotive-grade by their respective data sheets. 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Customer/distributor shall ensure that the terms and con- ditions of sale between customer/distributor and any customer of distributor/customer (1) state that Micron products are not designed or intended for use in automotive applications unless specifically designated by Micron as automotive-grade by their respective data sheets and (2) require such customer of distributor/customer to in- demnify and hold Micron harmless against all claims, costs, damages, and expenses and reasonable attorneys fees arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property damage resulting from any use of non-automotive-grade products in automotive applications. Critical Applications. Products are not authorized for use in applications in which failure of the Micron compo- nent could result, directly or indirectly in death, personal injury, or severe property or environmental damage Critical Application). Customer must protect against death, personal injury, and severe property and environ- mental damage by incorporating safety design measures into customer s applications to ensure that failure of the Micron component will not result in such harms. Should customer or distributor purchase, use, or sell any Micron component for any critical application, customer and distributor shall indemnify and hold harmless Micron and its subsidiaries, subcontractors, and affiliates and the directors, officers, and employees of each against all claims, costs, damages, and expenses and reasonable attorneys fees arising out of, directly or indirectly, any claim of product liability, personal injury, or death arising in any way out of such critical application, whether or not Mi- cron or its subsidiaries, subcontractors, or affiliates were negligent in the design, manufacture, or warning of the Micron product. Customer Responsibility. Customers are responsible for the design, manufacture, and operation of their systems, applications, and products using Micron products. ALL SEMICONDUCTOR PRODUCTS HAVE INHERENT FAIL- URE RATES AND LIMITED USEFUL LIVES. IT IS THE CUSTOMER S SOLE RESPONSIBILITY TO DETERMINE WHETHER THE MICRON PRODUCT IS SUITABLE AND FIT FOR THE CUSTOMER S SYSTEM, APPLICATION, OR PRODUCT. Customers must ensure that adequate design, manufacturing, and operating safeguards are included in customer s applications and products to eliminate the risk that personal injury, death, or severe property or en- vironmental damages will result from failure of any semiconductor component. Limited Warranty. In no event shall Micron be liable for any indirect, incidental, punitive, special or consequential damages (including without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort, warranty, breach of contract or other legal theory, unless explicitly stated in a written agreement executed by Micron s duly authorized representative. CCMTD-1725822587-6461 Micron Technology, Inc. reserves the right to change products or specifications without notice. 2 mt47h1g 64m 32m twindie.pdf - Rev. J 09/18 EN 2006 Micron Technology, Inc. All rights reserved.