MT48LC2M32B2B5-6A IT:J TR Micron

64Mb: x32 SDRAM Features SDR SDRAM MT48LC2M32B2 512K x 32 x 4 Banks Options Marking Features Configuration PC100-compliant 2 Meg x 32 (512K x 32 x 4 banks) 2M32B2 Fully synchronous; all signals registered on positive 1 Plastic package OCPL edge of system clock 86-pin TSOP II (400 mil) standard TG Internal pipelined operation; column address can 86-pin TSOP II (400 mil) Pb-free P be changed every clock cycle 90-ball VFBGA (8mm x 13mm) Pb- B5 Internal banks for hiding row access/precharge free Programmable burst lengths: 1, 2, 4, 8, or full page Timing cycle time Auto precharge, includes concurrent auto precharge 5ns (200 MHz) -5 and auto refresh modes 2 5.5ns (183 MHz) -55 Self refresh mode (not available on AT devices) 3 6ns (167 MHz) -6A Auto refresh 2 6ns (167 MHz) -6 64ms, 4096-cycle refresh 2 7ns (143 MHz) -7 (commercial and industrial) Operating temperature range 16ms, 4096-cycle refresh Commercial (0C to +70C) None (automotive) Industrial (40C to +85C) IT LVTTL-compatible inputs and outputs 4 Automotive (40C to +105C) AT Single 3.3V 0.3V power supply Revision :G/:J Supports CAS latency (CL) of 1, 2, and 3 1. Off-center parting line. Notes: 2. Available only on revision G. 3. Available only on revision J. 4. Contact Micron for availability. Table 1: Key Timing Parameters CL = CAS (READ) latency Clock t t t t Speed Grade Frequency (MHz) Target RCD- RP-CL RCD (ns) RP (ns) CL (ns) -5 200 3-3-3 15 15 15 -55 183 3-3-3 16.5 16.5 16.5 -6A 167 3-3-3 18 18 18 -6 167 3-3-3 18 18 18 -7 143 3-3-3 20 20 21 PDF: 09005aef811ce1fe Micron Technology, Inc. reserves the right to change products or specifications without notice. 1 64mb_x32_sdram.pdf - Rev. V 09/14 EN 1999 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice.64Mb: x32 SDRAM Features Table 2: Address Table Parameter 2 Meg x 32 Configuration 512K x 32 x 4 banks Refresh count 4K Row addressing 2K A[10:0] Bank addressing 4 BA[1:0] Column addressing 256 A[7:0] Table 3: 64Mb (x32) SDR Part Numbering Part Numbers Architecture Package MT48LC2M32B2TG 2 Meg x 32 86-pin TSOP II MT48LC2M32B2P 2 Meg x 32 86-pin TSOP II 1 MT48LC2M32B2B5 2 Meg x 32 90-ball VFBGA Note: 1. FBGA Device Decoder: www.micron.com/decoder. PDF: 09005aef811ce1fe Micron Technology, Inc. reserves the right to change products or specifications without notice. 2 64mb_x32_sdram.pdf - Rev. V 09/14 EN 1999 Micron Technology, Inc. All rights reserved.