8GB (x64, SR) 260-Pin DDR4 SODIMM Features DDR4 SDRAM SODIMM MTA8ATF1G64HZ 8GB Figure 1: 260-Pin SODIMM (MO-310 R/C A1, R/C Features A2) DDR4 functionality and operations supported as Module Height: 30mm (1.181in) defined in the component data sheet 260-pin, small-outline dual in-line memory module (SODIMM) Fast data transfer rates: PC4-3200, PC4-2666, or PC4-2400 8GB (1 Gig x 64) V = 1.20V (NOM) DD V = 2.5V (NOM) PP V = 2.5V (NOM) DDSPD Nominal and dynamic on-die termination (ODT) for Options Marking data, strobe, and mask signals Operating temperature Low-power auto self refresh (LPASR) Commercial (0C T 95C) None OPER Package Data bus inversion (DBI) for data bus 260-pin DIMM (halogen-free) Z On-die V generation and calibration REFDQ Frequency/CAS latency Single-rank 0.62ns CL = 22 (DDR4-3200) -3G2 2 On-board I C serial presence-detect (SPD) EEPROM 0.75ns CL = 19 (DDR4-2666) -2G6 16 internal banks 4 groups of 4 banks each 0.83ns CL = 17 (DDR4-2400) -2G3 Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) Selectable BC4 or BL8 on-the-fly (OTF) Gold edge contacts Halogen-free Fly-by topology Terminated control command and address bus Table 1: Key Timing Parameters Data Rate (MT/s) CL = t t t 20 18 16 14 12 10 RCD RP RC PC4- 24 22 21 19 17 15 13 11 9 (ns) (ns) (ns) -3G2 3200 3200, 3200, 2933 2666 2400 2133 1866 1600 1333 13.75 13.75 45.75 2933 2933 2666 2400 2133 1866 1600 -2G9 2933 2933 2933 2666 2400 2133 1866 1600 1333 14.32 14.32 46.32 1 1 1 2666 2400 2133 1866 1600 (13.75) (13.75) (45.75) -2G6 2666 2666 2400 2133 1866 1600 1333 14.25 14.25 46.25 1 1 1 2666 2400 2133 1866 1600 (13.75) (13.75) (45.75) CCMTD-1725822587-9885 Micron Technology, Inc. reserves the right to change products or specifications without notice. 1 atf8c1gx64hz.pdf Rev. J 10/18 EN 2015 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice. Speed Grade8GB (x64, SR) 260-Pin DDR4 SODIMM Features Table 1: Key Timing Parameters (Continued) Data Rate (MT/s) CL = t t t 20 18 16 14 12 10 RCD RP RC PC4- 24 22 21 19 17 15 13 11 9 (ns) (ns) (ns) -2G3 2400 2400 2133 1866 1600 1333 14.16 14.16 46.16 1 1 1 2400 2133 1866 1600 (13.75) (13.75) (45.75) -2G1 2133 2133 1866 1600 1333 14.06 14.06 47.06 1 1 1 2133 1866 1600 1333 (13.5) (13.5) (46.5) Note: 1. Down-bin timing, refer to component data sheet Speed Bin Tables for details. Table 2: Addressing Parameter 8GB Row address 64K A 15:0 Column address 1K A 9:0 Device bank group address 4 BG 1:0 Device bank address per group 4 BA 1:0 Device configuration 8Gb (1 Gig x 8), 16 banks Module rank address CS0 n Table 3: Part Numbers and Timing Parameters 8GB Modules 1 Base device: MT40A1G8, 8Gb DDR4 SDRAM Module Module Memory Clock/ Clock Cycles 2 t t Part Number Density Configuration Bandwidth Data Rate (CL- RCD- RP) MTA8ATF1G64HZ-3G2 8GB 1 Gig x 64 25.6 GB/s 0.62ns/3200 MT/s 22-22-22 MTA8ATF1G64HZ-2G6 8GB 1 Gig x 64 21.3 GB/s 0.75ns/2666 MT/s 19-19-19 MTA8ATF1G64HZ-2G3 8GB 1 Gig x 64 19.2 GB/s 0.83ns/2400 MT/s 17-17-17 Notes: 1. The data sheet for the base device can be found on micron.com. 2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Consult factory for current revision codes. Example: MTA8ATF1G64HZ-3G2J1. CCMTD-1725822587-9885 Micron Technology, Inc. reserves the right to change products or specifications without notice. 2 atf8c1gx64hz.pdf Rev. J 10/18 EN 2015 Micron Technology, Inc. All rights reserved. Speed Grade