LPSC425.xxx - 0603 Low Profile Silicon Capacitor Rev 3.1 Key features Key applications n All demanding applications, such as n Ultr a low profile (100m) medical, telecom, computer industries n High stability of capacitance value: n Decoupling / Filtering / Charge pump w Temperature <0.5% (-55C to +150C) (i.e.: Pacemakers / mobile phones) w Voltage <0.1%/Volts n High reliability applications w Negligible capacitance loss through ageing n Devices with battery operations n Unique high capacitance in EIA/0603 package n Extreme miniaturization size, up to 100 nF n Suitable for Embedded technologies n High reliability (FIT <0.017 parts / billion hours) n Low leakage current down to 100 pA n Low ESL and Low ESR n Suitable for lead free reflow-soldering *Please refer to our assembly Application Note for further recommendations Thanks to the unique IPDiA Silicon capacitor The IPDiA technology features high reliability, up technology, most of the problems encountered in to 10 times better than alternative capacitor demanding applications can be solved. technologies, such as Tantalum or MLCC, and Low Profile Silicon Capacitors are available with eliminates cracking phenomena. thicknesses down to 80m and are the most Silicon Capacitor technology also offers a very appropriate solution in applications with height stable capacitor value over the full operating constraints. voltage & temperature range, with a high and LPSC is the perfect choice for embedded stable insulation resistance. technologies, modules, systems in package, when This Silicon based technology is RoHS compliant designers are looking at utmost decoupling and compatible with lead free reflow soldering behaviours. process. The Silicon capacitor technology offers a capacitor integration capability (up to 250nF/mm ) which allows downsizing compared to Tantalum and MLCC. LPSC425.xxx Electrical specification Capacitance value Parameters Value (***) Capacitance range 100 nF 10 15 22 33 47 68 (***) Capacitance tolerances 15 % Contact Contact Contact Contact Contact Contact (**) 10 pF IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales -55 C to 150 C Operating temperature range Contact Contact Contact Contact Contact Contact Storage temperatures - 70 C to 165 C 0.1 nF IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales Temperature coefficient <0.5 %, from -55 C to +150 C Contact Contact Contact Contact Contact Contact (***) 1 nF Breakdown voltage (BV) 11 VDC IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales 100 nF: Capacitance variation versus 0.1 % /V (from 0 V to RVDC) 10 nF 935.121.425.610 RVDC Equivalent Serial Inductor (ESL) Max 250 pH (*)80 m thickness on request (***) Equivalent Serial Resistor (ESR) Max 400mW Insulation resistance 100GW min 3V,25C (**) Extended temperature range (up to +250 C) available, see Xtreme Temperature Silicon Capacitor product: XTSC Ageing Negligible, < 0.001 % / 1000 h Reliability FIT<0.017 parts / billion hours, (***) Other values on request. (*) Max 100 m Capacitor height DC Voltage stability ESL (nH) 25C Temperature coefficient MLCC capacitors vs. PICS 0402 C0G(NPO) vs. PICS PICS vs. MLCC capacitors 1,1 20 10 PICS 1 10 0 C0G PICS 0,9 PICS -10 0 C0G C0G C0G 0,8 -20 -10 X8R X8R 0,7 X7R X7R -30 -20 X7R Z5U 0,6 -40 -30 0,5 -50 -40 Y5V 0,4 -60 -50 Z5U Z5U 0,3 -70 -60 0,2 Temperature (C) -80 Y5V PICS -70 0,1 Y5V Y5V -90 -80 0 -100 -50 0 50 100 150 200 0 50 100 150 200 250 300 350 400 450 500 550 600 650 700 750 800 850 900 950 1000 0 1 2 3 4 5 6 7 Temperature (C) Temperature (C) Capacitance (pF) Bias voltage (V) Fig.1 Capacitance change versus temperature Fig.2 Capacitance change versus voltage Fig.3 ESL versus capacitance value variation compared with alternative dielectrics variation compared with alternative dielectrics compared with alternative dielectrics Part Number 935.121. B.2 S. U xx Value (E6) 10 Breakdown 15 Voltage Size 22 Unit 4 = 11V i.e.: 100 nF/0603 case (LPSC type) 5 = 0603 33 0 = 10 f 5 = 1 n 47 1 = 0.1 p 6 = 10 n 935.121.425.610 68 2 = 1 p 7 = 0.1 3 = 10 p 8 = 1 4 = 0.1 n 9 = 10 Termination and Outline Termination Package outline Lead-free nickel/solder coating compatible L with automatic soldering technologies: Typ. 0603 W reflow and manual. L 1.800.05 Comp. Solder size Land IPD W 1.100.05 Resist component pattern Typical dimensions, all dimensions in mm. (0603 PCB footprint) Packaging Tape and reel, tray, waffle pack or wafer delivery. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information For more information, please visit: