BLM15GA750SN1D Murata

Spec No.: JENF243A 0029H-01 P1/9 HIGH-GHz NOISE SUPPRESSION CHIP FERRITE BEAD BLM15GSN1 REFERENCE SPECIFICATION 1. Scope This reference specification applies to chip ferrite bead BLM15G SN series for general electronic equipment. 2. Part Numbering (Ex.) BL M 15 GG 221 S N 1 D Product Type Dimension Characteristics Impedance Performance Category Numbers of Packaging ID (L W) (Typical value circuit D: taping at 100 MHz) 3. Part Number and Rating Operating temperature range -55C to +125C Storage temperature range -55C to +125C Impedance DC resistance () () max. Customer Murata Rated current Part number Part number (mA) Values after at 100 MHz at 1 GHz Initial values testing BLM15GG221SN1D 22025% 60040% 300 0.7 0.8 BLM15GG471SN1D 47025% 120040% 200 1.3 1.4 BLM15GA750SN1D 7525% 100040% 200 1.3 1.4 4. Testing Conditions Unless otherwise specified Temperature: ordinary temperature (15C to 35C) Humidity: ordinary humidity 25% to 85% (RH) In case of doubt Temperature: 20C2C Humidity: 60% to 70% (RH) Atmospheric pressure: 86 kPa to 106 kPa 5. Appearance and Dimensions Equivalent circuit Unit mass (typical value): 0.001 g 6. Marking No marking. MURATA MFG CO., LTD Spec No.: JENF243A 0029H-01 P2/9 7. Electrical Performance No. Item Specification Test method 7.1 Impedance Meet chapter 3 ratings. Measuring equipment: Keysight 4291A or the equivalent Measuring frequency: 100 MHz1 MHz, 1 GHz1 MHz Measuring fixture: Keysight 16192A or the equivalent 7.2 DC resistance Meet chapter 3 ratings. Measuring equipment: digital multimeter Substrate wiring resistance is excluded. 8. Mechanical Performance The product is soldered on a substrate for test. (Excluding appearance and dimensions, drop, resistance to soldering heat, and solderability) (Test shall be done using flux, solder and soldering condition which are specified in chapter 12 except the case of being specified special condition.) No. Item Specification Test method 8.1 Appearance and Meet chapter 5. Visual inspection and measured with slide calipers. Dimensions 8.2 Shear test Appearance: No significant mechanical Applying force: 5 N damage shall be observed. Holding time: 5 s1 s Impedance change rate (at 100 MHz): Force application direction: within 30% DC resistance: Meet chapter 3 ratings. 8.3 Bending test Appearance: No significant mechanical Test substrate: glass-epoxy substrate (100 mm 40 damage shall be observed. mm 0.8 mm) Impedance change rate (at 100 MHz): Pressurizing speed: 0.5 mm/s within 30% Pressure jig: R340 DC resistance: Meet chapter 3 ratings. Deflection: 2.0 mm Holding time: 30 s 8.4 Vibration Appearance: No significant mechanical Oscillation frequency: 10 Hz to 2000 Hz to 10 Hz, for damage shall be observed. approx. 20 min Impedance change rate (at 100 MHz): Total amplitude: 1.5 mm or acceleration amplitude of 2 within 30% 196 m/s , whichever is smaller DC resistance: Meet chapter 3 ratings. Test time: 3 directions perpendicular to each other, 2 h for each direction (6 h in total) 8.5 Resistance to Appearance: No significant mechanical Flux: ethanol solution with a rosin content of 25(wt)% soldering heat damage shall be observed. Pre-heating: 150C10C/60 s to 90 s Impedance change rate (at 100 MHz): Solder: Sn-3.0Ag-0.5Cu solder within 30% Solder temperature: 270C5C DC resistance: Meet chapter 3 ratings. Immersion time: 10 s0.5 s Immersion and emersion rates: 25 mm/s Post-treatment: left at a room condition for 48 h4 h 8.6 Drop Appearance shall have no significant The product shall be dropped on concrete or steel mechanical damage. board. Method: free fall Height: 75 cm Attitude from which the product is dropped: 3 directions Number of times: 3 times for each direction (Total 9 times) MURATA MFG CO., LTD