IP4386CX4/P,315 Nexperia

IP4085CX4 IP4385CX4 IP4386CX4 IP4387CX4 Integrated high-performance ESD protection diodes Rev. 2 14 December 2012 Product data sheet 1. Product profile 1.1 General description Integrated high-performance protection diodes protecting appliances against ElectroStatic Discharge (ESD) of 30 kV, far exceeding IEC 61000-4-2 level 4 standard, overvoltage and wrong polarity. Each device includes one high-level ESD protection diode in a 4-channel 0.4 mm (IP438xCX4) or 0.5 mm (IP4085CX4) pitch Wafer Level Chip-Size Package (WLCSP). The anode and the cathode of ESD protection diode are each connected to two solder balls. 1.2 Features and benefits Single integrated high-performance ESD protection diode Surge immunity according to IEC 61000-4-5 (8/20 s) up to 60 A (IP4085CX4) ESD protection of >30 kV contact discharge, far exceeding IEC 61000-4-2, level 4 Small 2 2 solder ball WLCSP package with 0.4 mm or 0.5 mm pitch 1.3 Applications General-purpose ESD protection such as for charger interfaces in: Mobile handsets Portable devices Wireless data systems IP4085/4385/4386/4387/CX4 NXP Semiconductors Integrated high-performance ESD protection diodes 2. Pinning information Table 1. Pinning Pin Description Simplified outline Graphic symbol A1 and A2 cathode bump A1 A1 A2 B1 and B2 anode index area 1 2 B1 B2 006aad220 A B 008aaa236 transparent top view, solder balls facing down 3. Ordering information Table 2. Ordering information Type number Package Name Description Version 1 IP4085CX4/LF/P WLCSP4 wafer level chip-size package: 4 bumps (2 2) IP4085CX4/LF/P 2 IP4385CX4/LF wafer level chip-size package: 4 bumps (2 2) IP4385CX4/LF IP4386CX4/P IP4386CX4/P IP4387CX4/P IP4387CX4/P 1 Size: 0.91 0.91 0.65 mm 2 Size: 0.76 0.76 0.61 mm IP4085 4385 4386 4387 CX4 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. Product data sheet Rev. 2 14 December 2012 2 of 18