NTE424 NonSilicone Heat Sink Compound 1 oz. Plunger Tube Description: NTE424 heat sink compound is a greaselike, nonsilicone, nonmigrating material heavily impregnated with heatconductive metal oxides. This formulation provides high thermal conductivity, low bleed and high temperature stability. NTE424 has been engineered to solve the problems of contamination and migration associated with silicone based products. A unique poly syntheticbased thermal grease use to insure quick, efficient heat transfer and dissipation for the full operational life of your hardware. Key Features and Benefits: Non Silicone Advantages/No Creep or Migration over Wide Temperature Range 2 Low Interface Thermal Resistance (0.03 C In /W) High Thermal Conductivity, High Dielectric Strength Exceptionally Low Bleed and Evaporation Meets MILC47113 & MIS 19846 Specifications Will Not harden, Dry Out or Melt Will Not Contaminate Solder bath or Other Devices Non Toxic Reworkable/Easy to Remove Easy to Dispense Typical Properties: Viscosity .............................................................. Thixotropic Paste Specific Gravity +25 C ............................................................ 2.7 Color ........................................................................... White Evaporation +200 C, 24 Hours, %/Wt. ............................................... 0.3 Thermal Conductivity, (ASTM D5470) 4 Cal/Sec. Cm. C ........................................................ 23 x 10 2 BTU.In/(Hr.Ft . F) ............................................................. 6.9 W/m. K ...................................................................... 1.0 2 Thermal Resistance ( C In /W) ..................................................... 0.03 Electrical Properties: Dielectric Strength (ASTM D150) 0.05 gap, V/mil ...................................... 350 Dielectric Constant (ASTM D150) +25 C 1000Hz ................................... 4.65 Dissipation Factor (ASTM D150) +25 C 1000Hz .................................. 0.0026 14 Volume Resistivity (ASTM D257) Ohm cm ...................................... 1.8 x 10 Operating Temperature Range ............................................. 55 to +200C Rev. 113Typical Applications: The NTE424 heat sink compound is applied to the base and mounting studs of transistors, diodes and silicon controlled rectifiers (SCRs). In these situations, a small amount of the thermal grease is applied using either the dispensing of screen printing/stencil methods. NTE424 can be used as a high voltage corona suppressant/nonflammable coating, in connections for flyback transformers located in TV sets and similar design applications. It is also used in mounting semiconductor devices thermoelectric mod- ules power transistors and diodes coupling entire heat generating assemblies to chassis heat transfer medium on ballasts thermal joints thermocouple wells mounting power resistors and for any devices where efficient cooling is required in major industries including: electronic (computer, appliance, wire- less, etc.), automotive and electrical. ShelfLife: The NTE424 has a shelflife of 5 years at room temperature (+25 C) in unopened containers. Slight settling of the filler may occur during long term storage. In this case, it is recommended to re disperse the filler by hand or mechanical mixing. Refrigerate material at 0 to +10 C to avoid any settling. Clean Up: Standard approved cleanup and disposal procedures should be followed in every situation. The use of disposable containers and utensils are recommended whenever possible to simplify and expedite cleanup. However, when disposable containers are impractical, NTE424 can be removed by cleaning solvents such as Mineral Spirit (Paint Thinner), Heptane or Isopropyl Alcohol.