74LVC574AD NXP

74LVC574A Octal D-type flip-flop with 5 V tolerant inputs/outputs; positive edge-trigger; 3-state Rev. 5 18 December 2012 Product data sheet 1. General description The 74LVC574A is an octal D-type flip-flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus-oriented applications. A clock (CP) and an Output Enable (OE) input are common to all flip-flops. The eight flip-flops will store the state of their individual D-inputs that meet the set-up and hold times requirements on the LOW to HIGH CP transition. When OE is LOW, the contents of the eight flip-flops are available at the outputs. When OE is HIGH, the outputs go to the high-impedance OFF-state. Operation of the OE input does not affect the state of the flip-flops. Inputs can be driven from either 3.3 V or 5 V devices. When disabled, up to 5.5 V can be applied to the outputs. These features allow the use of these devices as translators in mixed 3.3 V or 5 V applications. The 74LVC574A is functionally identical to the 74LVC374A, but has a different pin arrangement. 2. Features and benefits 5 V tolerant inputs for interfacing with 5 V logic Supply voltage range from 1.2 V to 3.6 V CMOS low power consumption Direct interface with TTL levels High-impedance when V = 0 V CC 8-bit positive edge-triggered register Independent register and 3-state buffer operation Flow-through pin-out architecture Complies with JEDEC standard: JESD8-7A (1.65 V to 1.95 V) JESD8-5A (2.3 V to 2.7 V) JESD8-C/JESD36 (2.7 V to 3.6 V) ESD protection: HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-B exceeds 200 V CDM JESD22-C101E exceeds 1000 V Specified from 40 C to +85 C and 40 C to +125 C74LVC574A NXP Semiconductors Octal D-type flip-flop; 5 V tolerance; positive edge-trigger; 3-state 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74LVC574AD 40 Cto +125 C SO20 plastic small outline package; 20 leads; SOT163-1 body width 7.5 mm 74LVC574ADB 40 Cto +125 C SSOP20 plastic shrink small outline package; 20 leads; SOT339-1 body width 5.3 mm 74LVC574APW 40 Cto +125 C TSSOP20 plastic thin shrink small outline package; 20 leads; SOT360-1 body width 4.4 mm 74LVC574ABQ 40 Cto +125 C DHVQFN20 plastic dual in-line compatible thermal enhanced very SOT764-1 thin quad flat package; no leads; 20 terminals; body 2.5 4.5 0.85 mm 4. Functional diagram 11 C1 1 EN 11 2 19 CP 1D 2 19 D0 Q0 3 18 3 18 D1 Q1 4 17 4 17 D2 Q2 5 16 5 16 D3 Q3 6 15 6 15 D4 Q4 7 14 D5 Q5 7 14 8 13 D6 Q6 8 13 9 12 D7 Q7 9 12 OE 1 mna798 mna446 Fig 1. Logic diagram Fig 2. IEC logic symbol 74LVC574A All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. Product data sheet Rev. 5 18 December 2012 2 of 19