Product Information

BAP65-02,135

BAP65-02,135 electronic component of NXP

Datasheet
PIN Diodes 30V 100mA Single

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.6557 ea
Line Total: USD 0.66

9593 - Global Stock
Ships to you between
Wed. 22 May to Fri. 24 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
7059 - WHS 1


Ships to you between Wed. 22 May to Fri. 24 May

MOQ : 1
Multiples : 1
1 : USD 0.4174
10 : USD 0.2944
100 : USD 0.1484
1000 : USD 0.107
2500 : USD 0.0978
10000 : USD 0.0851
20000 : USD 0.0805
50000 : USD 0.0782
100000 : USD 0.0748

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Vr - Reverse Voltage
Maximum Diode Capacitance
If - Forward Current
Vf - Forward Voltage
Mounting Style
Package / Case
Series
Packaging
Configuration
Height
Length
Termination Style
Type
Width
Brand
Ir - Reverse Current
Pd - Power Dissipation
Product Type
Factory Pack Quantity :
Subcategory
Cnhts
Hts Code
Mxhts
Taric
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BAP65-02 Silicon PIN diode Rev. 6.1 28 January 2019 Product data sheet 1 Product profile 1.1 General description Planar PIN diode in a SOD523 ultra small SMD plastic package. 1.2 Features and benefits High voltage, current controlled RF resistor for RF switches Low diode capacitance Low diode forward resistance Very low series inductance AEC-Q101 qualified 1.3 Applications RF attenuators and switches Bandswitch for TV tuners Series diode for mobile communication transmit/receive switchNXP Semiconductors BAP65-02 Silicon PIN diode 2 Pinning information Table 1.Discrete pinning Pin Description Simplified outline Graphic symbol 1 cathode 2 anode 1 2 sym006 Top view 3 Ordering information Table 2.Ordering information Type number Package Name Description Version BAP65-02 - plastic surface-mounted package 2 leads SOD523 4 Marking Table 3.Marking code Type number Marking code BAP65-02 K6 5 Limiting values Table 4.Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V continuous reverse - 30 V R voltage I continuous forward - 100 mA F current P total power dissipation T 90 C - 715 mW tot sp T storage temperature -65 +150 C stg T junction temperature -65 +150 C j T ambient temperature -40 +85 C amb 6 Thermal characteristics Table 5.Thermal characteristics Symbol Parameter Conditions Typ Unit R thermal resistance from junction to 85 K/W th(j-sp) solder point BAP65-02 All information provided in this document is subject to legal disclaimers. NXP B.V. 2019. All rights reserved. Product data sheet Rev. 6.1 28 January 2019 2 / 10

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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