MA4P MELF & HIPAX Series High Power PIN Diodes V16 Features Package Styles High Power Handling Low Loss / Low Distortion Voltage Ratings up to 1000 Volts Passivated Chip for Low Leakage Current 401 & 402 Low Theta () Due to Full Face Chip Bonding Leadless Low Inductance MELF Packages Various Package Options Available as Chips Fully RoHS Compliant Non-Magnetic Packages Available for MRI 1072 & 1091 Description Applications The MELF and HIPAX PIN diode series are HIPAX PIN diodes are designed for use in a wide designed for usage in switch and attenuator variety of switch and attenuator applications from applications requiring high power handling and low HF through UHF frequencies and at power levels distortion. These diodes incorporate a fully above 1 kW, CW. The internal chip as well as each passivated PIN diode chip resulting in an extremely diode assembly has been comprehensively tested low reverse bias leakage current. The and characterized to ensure predictable and semiconductor technology utilized in the MELF and repeatable performance. HIPAX families draws on MACOM s substantial experience in PIN diode design and wafer fabrication. The result is a device which has a thick Design Recommendations I-region and long carrier lifetime while maintaining Low Distortion Attenuators low series resistance and capacitance values. The MA4P4301B chips of the MELF and HIPAX PIN diodes are Surface Mount Switches enclosed in a rugged ceramic package and is full MA4P7101F face bonded to metal pins on both the anode and Cellular Radio Antenna Switches cathode. The result is a low loss PIN diode with low MA4P1200, MA4P1250 thermal resistance due to symmetrical thermal paths. The parts are offered in either magnetic or non-magnetic, HIPAX (axial leaded) or MELF (Metal Electrode Leadless Faced) surface mount packages Absolute Maximum Ratings for MRI applications. The MELF is a rectangular 1 T = +25C (Unless Otherwise Noted) A SMQ, package which is designed for high volume tape and reel assembly. This easy to use package Parameter Absolute Maximum design makes automatic pick and place, indexing and assembly, extremely easy. The parallel flat sur- DC Reverse Voltage (V ) (See Tables) R faces are suitable for most key jaw or vacuum pick- Operating Chip Junction -55C to +175C up techniques. All of the solderable surfaces are tin Temperature plated and compatible with industry standard reflow Storage Temperature -55C to +200C and vapor phase soldering processes. See Applica- tion Note M538 for a typical solder reflow profile. Installation Temperature +280C for 30 Seconds ESD Class 1A, HBM Many of MACOMs HIPAX PIN diodes are also available as chips. Please consult the Silicon PIN Notes Chip Datasheet for availability and specifications. 1. Operation of this device above any one of these parameters may cause permanent damage. 11 1 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: MA4P MELF & HIPAX Series High Power PIN Diodes V16 MA4P1000 Series Electrical Specifications T = +25C A C V R R T R S P Total Capacitance Reverse Voltage Series Resistance Parallel Resistance pF VDC W kW Part (NM Indicates Non- V = 50 V, 1 MHz I = 10 mA I = 50 mA, 100 MHz V = 0 V, 100 MHz R R F R Magnetic) Typ. Max. Min. Max. Typ. Max. Min. MA4P1200 - 401T 1.2 1.5 MA4P1200NM - 401T 1.2 1.5 MA4P1250 -1072T 0.8 1.2 50 100 0.5 0.75 5 MA4P1250NM -1072T 0.8 1.2 MA4P1450 -1091T 1.8 2.5 V T Forward Bias Reverse Bias F L Forward Voltage Carrier Lifetime Harmonic Distortion Harmonic Distortion (Max. I 1V R(2a/a) * R(3a/a) R(2a/a) R(3a/a) Forward Part P = 30 W, 100 MHz P = 0 dBm, V = 0 V, IN IN R (NM Indicates Non- I = 50 mA I = 10 mA, I = 6 mA F F R I = 50 mA 100 MHz F Magnetic) Typ. Max. Min. Typ. Min. Typ. Min. Typ. MA4P1200 - 401T MA4P1200NM - 401T MA4P1250 -1072T 0.85 1.0 2 8 80 90 60 70 MA4P1250NM-1072T MA4P1450 -1091T *Notes: 1.) NM in the base part number signifies non-magnetic package. 2.) T suffix denotes tape and reel Power Dissipation and Thermal Resistance Ratings T = +25C A MA4P1200(NM)-401T MA4P1250(NM)-1072T MA4P1450-1091T Package Condition Style P P P DISS JC DISS JC DISS JC No Heatsink 1.5 W B 15C/W Axial Lead Lead Length 1/4 5.5 W No Heatsink 6 W 10 W F 15C/W 5C/W MELF Infinite Heatsink 18 W 30 W 22 2 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: