DAC1405D750
Dual 14-bit DAC, up to 750 Msps; 4x and 8x interpolating
Rev. 4 7 June 2011 Product data sheet
1. General description
The DAC1405D750 is a high-speed 14-bit dual channel Digital-to-Analog Converter
(DAC) with selectable 4 or 8 interpolating filters optimized for multi-carrier wireless
transmitters.
Thanks to its digital on-chip modulation, the DAC1405D750 allows the complex I and Q
inputs to be converted from BaseBand (BB) to IF. The mixing frequency is adjusted via a
Serial Peripheral Interface (SPI) with a 32-bit Numerically Controlled Oscillator (NCO) and
the phase is controlled by a 16-bit register.
Two modes of operation are available: separate data ports or a single interleaved
high-speed data port. In the Interleaved mode, the input data stream is demultiplexed into
its original I and Q data and then latched.
A 4 and 8 clock multiplier enables the DAC1405D750 to provide the appropriate
internal clocks from the internal PLL. The internal PLL can be bypassed enabling the use
of an external high frequency clock. The voltage regulator enables adjustment of the
output full-scale current.
2. Features and benefits
Dual 14-bit resolution IMD3: 74 dBc; f = 737.28 Msps;
s
f = 140 MHz
o
750 Msps maximum update rate ACPR: 72 dBc; 2-carrier WCDMA;
f = 737.28 Msps; f =153.6 MHz
s o
Selectable 4 or 8 interpolation filters Typical 1.2 W power dissipation at 4
interpolation, PLL off and 740 Msps
Input data rate up to 185 Msps Power-down and Sleep modes
Very low noise cap-free integrated PLL Differential scalable output current from
1.6 mA to 22 mA
32-bit programmable NCO frequency On-chip 1.25 V reference
Dual port or Interleaved data modes External analog offset control
(10-bit auxiliary DACs)
1.8 V and 3.3 V power supplies Internal digital offset control
LVDS compatible clock Inverse x / (sin x) function
Twos complement or binary offset Fully compatible SPI port
data format
1.8 V/3.3 V CMOS input data buffers Industrial temperature range from
40 C to +85 CDAC1405D750
NXP Semiconductors
Dual 14-bit DAC, up to 750 Msps; 4 and 8 interpolating
3. Applications
Wireless infrastructure: LTE, WiMAX, GSM, CDMA, WCDMA, TD-SCDMA
Communication: LMDS/MMDS, point-to-point
Direct Digital Synthesis (DDS)
Broadband wireless systems
Digital radio links
Instrumentation
Automated Test Equipment (ATE)
4. Ordering information
Table 1. Ordering information
Type number Package
Name Description Version
DAC1405D750HW HTQFP100 plastic thermal enhanced thin quad flat package; 100 leads; SOT638-1
body 14 14 1 mm; exposed die pad
DAC1405D750 All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 4 7 June 2011 2 of 42