X-On Electronics has gained recognition as a prominent supplier of DSP56321VL200 Digital Signal Processors & Controllers - DSP, DSC across the USA, India, Europe, Australia, and various other global locations. DSP56321VL200 Digital Signal Processors & Controllers - DSP, DSC are a product manufactured by NXP. We provide cost-effective solutions for Digital Signal Processors & Controllers - DSP, DSC, ensuring timely deliveries around the world.

DSP56321VL200 NXP

DSP56321VL200 electronic component of NXP
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Part No.DSP56321VL200
Manufacturer: NXP
Category: Digital Signal Processors & Controllers - DSP, DSC
Description: Digital Signal Processors & Controllers - DSP, DSC 24 BIT DSP PBFREE
Datasheet: DSP56321VL200 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
126: USD 94.2163 ea
Line Total: USD 11871.25 
Availability - 0
MOQ: 126  Multiples: 126
Pack Size: 126
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0
Ship by Mon. 11 Nov to Fri. 15 Nov
MOQ : 126
Multiples : 126
126 : USD 131.1976

   
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We are delighted to provide the DSP56321VL200 from our Digital Signal Processors & Controllers - DSP, DSC category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the DSP56321VL200 and other electronic components in the Digital Signal Processors & Controllers - DSP, DSC category and beyond.

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DSP56321 Freescale Semiconductor Rev. 11, 2/2005 Technical Data DSP56321 24-Bit Digital Signal Processor 3 16 6 6 The DSP56321 is intended Memory Expansion Area for applications requiring a Program large amount of internal RAM Triple 32 K 24 bits SCI HI08 ESSI EFCOP memory, such as networking Timer or X Data Y Data 31 K 24 bits RAM RAM and wireless infrastructure and 80 K 24 bits 80 K 24 bits Instruction applications. The onboard Cache 1024 24 bits EFCOP can accelerate Peripheral general filtering applications, Expansion Area YAB such as echo-cancellation Address External XAB 18 Generation Address applications, correlation, and Unit PAB Bus Address DAB Switch Six Channel general-purpose convolution- DMA Unit External based algorithms. 24-Bit Bus 10 Bootstrap Interface DSP56300 and ROM I - Cache Control Core Control DDB Whats New External YDB Internal 24 Data XDB Rev. 11 includes the following Data Bus PDB Bus changes: Switch Data Switch GDB Adds lead-free packaging and Power part numbers. Management Data ALU 5 Program Program Program Clock + 24 24 56 56-bit MAC PLL JTAG Interrupt Decode Address Generator Two 56-bit Accumulators Controller Controller Generator OnCE 56-bit Barrel Shifter DE EXTAL MODA/IRQA XTAL MODB/IRQB RESET MODC/IRQC PINIT/NMI MODD/IRQD Figure 1. DSP56321 Block Diagram The Freescale DSP56321, a member of the DSP56300 DSP family, supports networking, security encryption, and home entertainment using a high-performance, single-clock-cycle-per- instruction engine (DSP56000 code- compatible), a barrel shifter, 24-bit addressing, an instruction cache, and a direct memory access (DMA) controller (see Figure 1). The DSP56321 offers 275 million multiply- accumulates per second (MMACS) performance, attaining 550 MMACS when the EFCOP is in use. It operates with an internal 275 MHz clock with a 1.6 volt core and independent 3.3 volt input/output (I/O) power. By operating in parallel with the core, the EFCOP provides overall enhanced performance and signal quality with no impact on channel throughput or total channel support. This device is pin-compatible with the Freescale DSP56303, DSP56L307, DSP56309, and DSP56311. Freescale Semiconductor, Inc., 2001, 2005. All rights reserved. PIO EB PM EB XM EB YM EBTable of Contents Data Sheet Conventions.......................................................................................................................................ii Features...............................................................................................................................................................iii Target Applications .............................................................................................................................................iv Product Documentation .......................................................................................................................................v Chapter 1 Signals/Connections 1.1 Power ................................................................................................................................................................1-3 1.2 Ground ..............................................................................................................................................................1-3 1.3 Clock.................................................................................................................................................................1-3 1.4 External Memory Expansion Port (Port A) ......................................................................................................1-4 1.5 Interrupt and Mode Control ..............................................................................................................................1-6 1.6 Host Interface (HI08)........................................................................................................................................1-7 1.7 Enhanced Synchronous Serial Interface 0 (ESSI0) ........................................................................................1-10 1.8 Enhanced Synchronous Serial Interface 1 (ESSI1) ........................................................................................1-11 1.9 Serial Communication Interface (SCI) ...........................................................................................................1-12 1.10 Timers .............................................................................................................................................................1-13 1.11 JTAG and OnCE Interface ..............................................................................................................................1-14 Chapter 2 Specifications 2.1 Maximum Ratings.............................................................................................................................................2-1 2.2 Thermal Characteristics ....................................................................................................................................2-2 2.3 DC Electrical Characteristics............................................................................................................................2-2 2.4 AC Electrical Characteristics............................................................................................................................2-3 Chapter 3 Packaging 3.1 Package Description .........................................................................................................................................3-2 3.2 MAP-BGA Package Mechanical Drawing .....................................................................................................3-10 Chapter 4 Design Considerations 4.1 Thermal Design Considerations........................................................................................................................4-1 4.2 Electrical Design Considerations......................................................................................................................4-2 4.3 Power Consumption Considerations.................................................................................................................4-3 4.4 Input (EXTAL) Jitter Requirements .................................................................................................................4-4 Appendix A Power Consumption Benchmark Data Sheet Conventions OVERBAR Indicates a signal that is active when pulled low (For example, the RESET pin is active when low.) asserted Means that a high true (active high) signal is high or that a low true (active low) signal is low deasserted Means that a high true (active high) signal is low or that a low true (active low) signal is high Examples: Signal/Symbol Logic State Signal State Voltage PIN V /V True Asserted IL OL PIN V /V False Deasserted IH OH PIN V /V True Asserted IH OH PIN V /V False Deasserted IL OL Note: Values for V , V , V , and V are defined by individual product specifications. IL OL IH OH DSP56321 Technical Data, Rev. 11 ii Freescale Semiconductor

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
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NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
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NXP Semiconductors
NXP USA Inc.
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