Document Number: DSP56F803 Freescale Semiconductor, Inc. Rev. 17, 10/2015 Datasheet: Technical Data 56F803 Datasheet with Addendum Rev.17 of the 56F803 Datasheet has two parts: The addendum to revision 16 of the datasheet, immediately following this cover page. Revision 16 of the datasheet, following the addendum. The changes described in the addendum have not been implemented in the specified pages. 2015 Freescale Semiconductor, Inc. All rights reserved.Freescale Semiconductor, Inc. Document Number: DSP56F803AD Datasheet Addendum Rev. 0, 10/2015 Addendum to Rev. 16 of the 56F803 datasheet This addendum identifies changes to Rev.16 of the 56F803 datasheet. The changes described in this addendum have not been implemented in the specified pages. 1 Update the incomplete Thermal Design Considerations section Location: Section 5.1, Page 51 Thermal Considerations section in 56F803 datasheet Rev.16 is incomplete. The complete Thermal Design Consideration section should be as follows: , in C can be obtained from the equation: An estimation of the chip junction temperature, T J T = T + (P x R ) Eqn. 1 J A D JA where: T = ambient temperature C A R = package junction-to-ambient thermal resistance C/W JA P = power dissipation in package D Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and a case-to-ambient thermal resistance: R = R + R Eqn. 2 JA JC CA 2015 Freescale Semiconductor, Inc. All rights reserved.