NXP Semiconductors K32L2B3x Data Sheet: Technical Data Rev. 3, 09/2020 K32 L2B Microcontroller K32L2B31Vxx0A 48 MHz Arm Cortex-M0+ and 64/128/256 KB Flash K32L2B21Vxx0A K32L2B11Vxx0A The K32 L2B series is optimized for cost-sensitive and battery- powered applications requiring low-power USB connectivity and an optional segment LCD (SLCD). The product offers: Optional low power segment LCD up to 24x8 or 28x4 32 QFN 48 QFN 5x5 mm P 0.5 mm 7x7 mm P 0.5 mm USB FS 2.0 device without requiring an external crystal Embedded ROM with boot loader for flexible program upgrade High accuracy internal voltage and clock reference FlexIO to support any standard and customized serial peripheral emulation 64 LQFP 64 BGA Down to 54 uA/MHz in very low power run mode and 1.96 10x10 mm P 0.5 mm 5x5 mm P 0.5 mm uA in deep sleep mode (RAM + RTC retained) Core Processor Peripherals Arm Cortex -M0+ core up to 48 MHz SLCD supporting up to 24x8 or 28x4 segments USB full-speed 2.0 device controller supporting Memories crystal-less operation 64/128/256 KB program flash memory One UART module supporting ISO7816, operating 32 KB SRAM up to 1.5 Mbit/s 16 KB ROM with build-in bootloader Two low-power UART modules supporting 32-byte backup register asynchronous operation in low-power modes Two I2C modules and I2C0 supporting up to 1 System Mbit/s 4-channel asynchronous DMA controller Two 16-bit SPI modules supporting up to 24 Mbit/s Watchdog One FlexIO module supporting emulation of Low-leakage wakeup unit additional UART, SPI, I2C, PWM and other serial Two-pin Serial Wire Debug (SWD) programming and modules, etc. debug interface One 16-bit 461 ksps ADC module with high Micro Trace Buffer accuracy internal voltage reference (Vref) and up to Bit manipulation engine 16 channels Interrupt controller High-speed analog comparator containing a 6-bit DAC for programmable reference input Clocks One 12-bit DAC 48 MHz high accuracy (up to 0.5%) internal reference 1.2 V internal voltage reference clock 8 MHz/2 MHz high accuracy (up to 3%) internal I/O reference clock Up to 50 general-purpose input/output pins (GPIO) 1 KHz reference clock active under all low-power and 6 high-drive pad modes (except VLLS0) 3240 KHz and 332 MHz crystal oscillator NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Operating Characteristics Timers Voltage range: 1.71 to 3.6 V One 6-channel Timer/PWM module Flash write voltage range: 1.71 to 3.6 V Two 2-channel Timer/PWM modules Temperature range: 40 to 105 C One low-power timer Periodic interrupt timer Packages Real time clock 64 LQFP 10mm x 10mm, 0.5 mm pitch, 1.6 mm thickness Security and Integrity 64 MAPBGA 5mm x 5mm, 0.5 mm pitch, 1.23 mm 80-bit unique identification number per chip thickness Advanced flash security 48 QFN 7mm x 7mm, 0.5 mm pitch, 0.65 mm thickness 32 QFN 5mm x 5mm, 0.5 mm pitch, 0.65 mm thickness Low Power Down to 54 A/MHz in very low power run mode Down to 1.96 A in VLLS3 mode (RAM + RTC retained) Six flexible static modes Related Resources Type Description Resource Selector The NXP Selector Guide is a web-based tool that features interactive Selector Guide Guide application wizards and a dynamic product selector. 1 Reference The Reference Manual contains a comprehensive description of the K32L2B3xRM Manual structure and function (operation) of a device. Data Sheet The Data Sheet includes electrical characteristics and signal This document. connections. 1 Chip Errata The chip mask set Errata provides additional or corrective information for K32L2B 1N71K a particular device mask set. Package Package dimensions are provided in package drawings. 64-LQFP: 98ASS23234W, 64- drawing MAPBGA: 98ASA00420D, 32- QFN: 98ASA00615D, 48-QFN: 1 98ASA00616D 1. To find the associated resource, go to