LPC2102FBD48,118 NXP

LPC2101/02/03 Single-chip 16-bit/32-bit microcontrollers 8 kB/16 kB/32 kB ash with ISP/IAP, fast ports and 10-bit ADC Rev. 04 2 June 2009 Product data sheet 1. General description The LPC2101/02/03 microcontrollers are based on a 16-bit/32-bit ARM7TDMI-S CPU with real-time emulation that combines the microcontroller with 8 kB, 16 kB or 32 kB of embedded high-speed ash memory. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at the maximum clock rate. For critical performance in interrupt service routines and DSP algorithms, this increases performance up to 30 % over Thumb mode. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 % with minimal performance penalty. Due to their tiny size and low power consumption, the LPC2101/02/03 are ideal for applications where miniaturization is a key requirement. A blend of serial communications 2 interfaces ranging from multiple UARTs, SPI to SSP and two I C-buses, combined with on-chip SRAM of 2 kB/4 kB/8 kB, make these devices very well suited for communication gateways and protocol converters. The superior performance also makes these devices suitable for use as math coprocessors. Various 32-bit and 16-bit timers, an improved 10-bit ADC, PWM features through output match on all timers, and 32 fast GPIO lines with up to nine edge or level sensitive external interrupt pins make these microcontrollers particularly suitable for industrial control and medical systems. 2. Features 2.1 Enhanced features Enhanced features are available in parts LPC2101/02/03 labelled Revision A and higher: n Deep power-down mode with option to retain SRAM memory and/or RTC. n Three levels of ash Code Read Protection (CRP) implemented. 2.2 Key features n 16-bit/32-bit ARM7TDMI-S microcontroller in tiny LQFP48 and HVQFN48 packages. n 2 kB/4 kB/8 kB of on-chip static RAM and 8 kB/16 kB/32 kB of on-chip ash program memory. 128-bit wide interface/accelerator enables high-speed 70 MHz operation. n ISP/IAP via on-chip bootloader software. Single ash sector or full chip erase in 100 ms and programming of 256 bytes in 1 ms. n EmbeddedICE-RT offers real-time debugging with the on-chip RealMonitor software. n The 10-bit ADC provides eight analog inputs, with conversion times as low as 2.44 s per channel and dedicated result registers to minimize interrupt overhead. n Two 32-bit timers/external event counters with combined seven capture and seven compare channels.LPC2101/02/03 NXP Semiconductors Single-chip 16-bit/32-bit microcontrollers n Two 16-bit timers/external event counters with combined three capture and seven compare channels. n Low power Real-Time Clock (RTC) with independent power and dedicated 32 kHz clock input. 2 n Multiple serial interfaces including two UARTs (16C550), two Fast I C-buses (400 kbit/s), SPI and SSP with buffering and variable data length capabilities. n Vectored interrupt controller with congurable priorities and vector addresses. n Up to thirty-two, 5 V tolerant fast general purpose I/O pins. n Up to 13 edge or level sensitive external interrupt pins available. n 70 MHz maximum CPU clock available from programmable on-chip PLL with a possible input frequency of 10 MHz to 25 MHz and a settling time of 100 s. n On-chip integrated oscillator operates with an external crystal in the range from 1 MHz to 25 MHz. n Power saving modes include Idle mode, Power-down mode with RTC active, and Power-down mode. n Individual enable/disable of peripheral functions as well as peripheral clock scaling for additional power optimization. n Processor wake-up from Power-down and Deep power-down (Revision A and higher) mode via external interrupt or RTC. 3. Ordering information Table 1. Ordering information Type number Package Name Description Version LPC2101FBD48 LQFP48 plastic low prole quad at package 48 leads body 7 7 1.4 mm SOT313-2 LPC2102FBD48 LQFP48 plastic low prole quad at package 48 leads body 7 7 1.4 mm SOT313-2 LPC2103FBD48 LQFP48 plastic low prole quad at package 48 leads body 7 7 1.4 mm SOT313-2 LPC2102FHN48 HVQFN48 plastic thermal enhanced very thin quad at package no leads SOT619-7 48 terminals body 7 7 0.85 mm LPC2103FHN48 HVQFN48 plastic thermal enhanced very thin quad at package no leads SOT619-7 48 terminals body 7 7 0.85 mm LPC2103FHN48H HVQFN48 plastic thermal enhanced very thin quad at package no leads SOT778-3 48 terminals body 6 6 0.85 mm 3.1 Ordering options Table 2. Ordering options Type number Flash memory RAM ADC Temperature range (C) LPC2101FBD48 8 kB 2 kB 8 inputs - 40 to +85 LPC2102FBD48 16 kB 4 kB 8 inputs - 40 to +85 LPC2103FBD48 32 kB 8 kB 8 inputs - 40 to +85 LPC2102FHN48 16 kB 4 kB 8 inputs - 40 to +85 LPC2103FHN48 32 kB 8 kB 8 inputs - 40 to +85 LPC2103FHN48H 32 kB 8 kB 8 inputs - 40 to +85 LPC2101 02 03 4 NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 2 June 2009 2 of 37