NXP Semiconductors Document Number: MC10XS3425 Rev. 6.0, 8/2018 Technical Data Quad high-side switch 10XS3425 (dual 10 mOhm, dual 25 mOhm) The 10XS3425 is one in a family of devices designed for low-voltage automotive lighting applications. Its four low R MOSFETs (dual 10 m/dual 25 m) DS(on) can control four separate 55 W/28 W bulbs, and/or Xenon modules, and/or LEDs. HIGH-SIDE SWITCH Programming, control and diagnostics are accomplished using a 16-bit SPI interface. Its output with selectable slew-rate improves electromagnetic compatibility (EMC) behavior. Additionally, each output has its own parallel input or SPI control for pulse-width modulation (PWM) control if desired. The 10XS3425 allows the user to program via the SPI the fault current trip levels and duration of acceptable lamp inrush. The device has Fail-safe mode to provide fail-safe functionality of the outputs in case of MCU damaged. This device is powered by SMARTMOS technology. Features EK SUFFIX (PB-FREE) Four protected 10 m and 25 m high-side switches (at 25 C) 98ASA00368D Operating voltage range of 6.0 to 20 V with sleep current 32-PIN EXPOSED PAD SOIC < 5.0 A, extended mode from 4.0 to 28 V 8.0 MHz 16-bit 3.3 V and 5.0 V SPI control and status reporting with daisy Applications Low-voltage automotive exterior lighting chain capability Low-voltage industrial lighting PWM module using external clock or calibratable internal oscillator with Halogen lamps programmable output delay management Incandescent bulbs Smart overcurrent shutdown, severe short-circuit, overtemperature Light-emitting diodes (LEDs) protections with time limited autoretry, and fail-safe mode, in case of MCU HID Xenon ballasts damage Output off or on openload detection compliant to bulbs or leds and short to battery detection, analog current feedback with selectable ratio and board temperature feedback V V V V V DD DD PWR DD PWR 10XS3425 VDD VPWR HS0 WAKE LOAD I/O FSB SCLK SCLK CSB CSB HS1 SI SO LOAD I/O RSTB SO SI MCU HS2 I/O IN0 LOAD I/O IN1 I/O IN2 HS3 I/O IN3 A/D CSNS LOAD FSI GND GND Figure 1. 10XS3425 simplified application diagram NXP B.V. 2018.Table of Contents 1 Orderable parts 3 2 Internal block diagram . 4 3 Pin connections 5 3.1 Pinout diagram . 5 3.2 Pin definitions 5 4 Electrical characteristics 7 4.1 Maximum ratings . 7 4.2 Static electrical characteristics . 9 4.3 Dynamic electrical characteristics . 14 4.4 Timing diagrams . 21 5 Functional description 24 5.1 Introduction . 24 5.2 Functional pin description 24 5.3 Functional internal block description . 26 6 Functional device operation 27 6.1 SPI protocol description . 27 6.2 Operational modes . 27 6.3 Protection and diagnostic features . 32 6.4 Logic commands and registers . 36 7 Typical applications 46 7.1 Introduction . 46 8 Packaging 47 8.1 Soldering information . 47 8.2 Marking information 47 8.3 Package mechanical dimensions 47 9 Revision history . 51 10XS3425 2 NXP Semiconductors