X-On Electronics has gained recognition as a prominent supplier of MC10XS3435BHFK Power Switch ICs - Power Distribution across the USA, India, Europe, Australia, and various other global locations. MC10XS3435BHFK Power Switch ICs - Power Distribution are a product manufactured by NXP. We provide cost-effective solutions for Power Switch ICs - Power Distribution, ensuring timely deliveries around the world.

MC10XS3435BHFK NXP

MC10XS3435BHFK electronic component of NXP
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Part No.MC10XS3435BHFK
Manufacturer: NXP
Category: Power Switch ICs - Power Distribution
Description: Power Switch ICs - Power Distribution Eswitch Gen3 1035
Datasheet: MC10XS3435BHFK Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0
MOQ : 840
Multiples : 840
840 : USD 5.9434
1680 : USD 5.6339
2520 : USD 5.6339
5040 : USD 5.4172
N/A

Obsolete
   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Number of Outputs
Operating Supply Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Mounting Style
Package / Case
Supply Current - Max
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Factory Pack Quantity :
Cnhts
Hts Code
Mxhts
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We are delighted to provide the MC10XS3435BHFK from our Power Switch ICs - Power Distribution category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MC10XS3435BHFK and other electronic components in the Power Switch ICs - Power Distribution category and beyond.

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NXP Semiconductors Document Number: MC10XS3435 Rev. 12.0, 8/2018 Technical Data Quad high-side switch 10XS3435 (dual 10 mOhm, dual 35 mOhm) The 10XS3435 is one in a family of devices designed for low voltage automotive lighting applications. Its four low R MOSFETs (dual 10 mOhm/dual DS(on) 35 mOhm) can control four separate 55/28 W bulbs, and/or Xenon modules, and/or LEDs. HIGH-SIDE SWITCH Programming, control and diagnostics are accomplished using a 16-bit SPI interface. Its output with selectable slew rate improves electromagnetic compatibility (EMC) behavior. Additionally, each output has its own parallel input or SPI control for pulse-width modulation (PWM) control. The 10XS3435 allows the user to program via the SPI the fault current trip levels and duration of acceptable lamp inrush. The device has Fail-safe mode to provide functionality of the outputs in case of MCU damage. This device is powered using SMARTMOS technology. Features Four protected 10 mOhm and 35 mOhm high-side switches (at 25 C) Operating voltage range of 6.0 to 20 V with sleep current < 5.0 A, FK SUFFIX extended mode from 4.0 to 28 V 98ARL10596D 8.0 MHz 16-bit 3.3 V and 5.0 V SPI control and status reporting with daisy 24-PIN PQFN chain capability PWM module using external clock or calibratable internal oscillator with Applications programmable outputs delay management Low-voltage automotive lighting Smart overcurrent shutdown, severe short-circuit, overtemperature Xenon bulbs protections with time limited autoretry, and Fail-safe mode in case of MCU Halogen bulbs damage Light-emitting diodes (LEDs) Output OFF or ON openload detection compliant to bulbs or LEDs and short to battery detection High beam Analog current feedback with selectable ratio and board temperature Low beam feedback Flashers Low-voltage industrial lighting V V V V V DD DD PWR DD PWR 10XS3435 VDD VPWR HS0 WAKE LOAD I/O FS SCLK SCLK CS CS HS1 SI SO LOAD I/O RST SO SI MCU HS2 I/O IN0 LOAD I/O IN1 I/O IN2 I/O IN3 HS3 A/D CSNS LOAD FSI GND GND Figure 1. 10XS3435 simplified application diagram 2018 NXP B.V.Table of Contents 1 Orderable parts 3 2 Device variations . 3 3 Internal block diagram . 4 4 Pin connections 5 5 Electrical characteristics 7 5.1 Maximum ratings 7 5.2 Static electrical characteristics . 9 5.3 Dynamic electrical characteristics 15 5.4 Timing diagrams . 22 6 Functional description 25 6.1 Introduction . 25 6.2 Functional pin description 25 6.3 Functional internal block description 27 7 Functional device operation 28 7.1 SPI protocol description . 28 7.2 Operational modes . 28 7.3 Protection and diagnostic features . 33 7.4 Logic commands and registers 37 8 Typical applications 47 9 Packaging . 48 9.1 Soldering information . 48 9.2 Package dimensions 48 10 Additional documentation 52 10.1Thermal addendum (Rev 2.0) . 52 11 Revision history . 57 10XS3435 2 NXP Semiconductors

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8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
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