Document Number: MC1322x Freescale Semiconductor Rev. 1.3 10/2010 Technical Data MC1322x Package Information Case 1901-01 MC1322x 99-Pin 9.5X9.5X1.2mm Advanced ZigBee - Compliant Ordering Information Platform-in-Package (PiP) for the Device Device Marking Package 1 MC13224V MC13224V LGA 2.4 GHz IEEE 802.15.4 1 MC13224VR2 MC13224V LGA Standard 1 MC13226V MC13226V LGA 1 MC13226VR2 MC13226V LGA 1 See Table 1 for more details. 1 Introduction Contents The MC1322x family is Freescales third-generation 1 Introduction 1 ZigBee platform which incorporates a complete, low 2 Features . 4 power, 2.4 GHz radio frequency transceiver, 32-bit 3 High Density, Low Component Count, Integrated ARM7 core based MCU, hardware acceleration for both IEEE 802.15.4 Solution 10 4 Memory . 18 the IEEE 802.15.4 MAC and AES security, and a full set 5 MCU Peripherals 19 of MCU peripherals into a 99-pin LGA 6 Pin Assignments and Connections 28 Platform-in-Package (PiP). 7 System Electrical Specification . 36 The MC1322x solution can be used for wireless 8 Developer Environment 48 applications ranging from simple proprietary 9 Mechanical Diagrams (Case 1901-01, non-JEDEC) 51 point-to-point connectivity to complete ZigBee mesh networking. The MC1322x is designed to provide a highly integrated, total solution, with premier processing capabilities and very low power consumption. The MC1322x MCU resources offer superior processing power for ZigBee applications. A full 32-bit ARM7TDMI-S core operates up to 26 MHz. A 128 Kbyte FLASH memory is mirrored into a 96 Kbyte RAM for upper stack and applications software. In addition, an 80 Kbyte ROM is available for boot software, standardized IEEE 802.15.4 MAC and Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. Freescale Semiconductor, Inc., 2005, 2006, 2007, 2008, 2009, 2010. All rights reserved.communications stack software. A full set of peripherals and Direct Memory Access (DMA) capability for transceiver packet data complement the processor core. The RF radio interface provides for low cost and the high density as shown in Figure 1. An onboard balun along with a TX/RX switch allows direct connection to a single-ended 50- antenna. The integrated PA provides programmable output power typically from -30 dBm to +4 dBm, and the RX LNA provides -96 dBm sensitivity. In addition, separate complementary PA outputs allow use of an external PA and/or an external LNA for extended range applications. The device also has onboard bypass capacitors and crystal load capacitors for the smallest footprint in the industry. All components are integrated into the package except the crystal and antenna. PA ANALOG TRANSMITTER RF TX/RX BALUN SWITCH ANALOG RECEIVER LNA Figure 1. MC1322x RF Radio Interface In addition to the best-in-class MCU performance and power, the MC1322x also provides best-in-class power savings. Typical transmit current is 29 mA and typical receive current is 22 mA with the CPU at 2 MHz operation and even lower with the bus stealing enabled. Onboard power supply regulation is provided for source voltages from 2.0 Vdc to 3.6 Vdc. Numerous low current modes are available to maximize battery life including sleep or restricted performance operation. Applications include, but are not limited to, the following: Residential and commercial automation Lighting control Security Access control Heating, ventilation, air-conditioning (HVAC) Automated meter reading (AMR) Industrial Control MC1322x Technical Data, Rev. 1.3 2 Freescale Semiconductor