X-On Electronics has gained recognition as a prominent supplier of MC13233CR2 RF System on a Chip - SoC across the USA, India, Europe, Australia, and various other global locations. MC13233CR2 RF System on a Chip - SoC are a product manufactured by NXP. We provide cost-effective solutions for RF System on a Chip - SoC, ensuring timely deliveries around the world.

MC13233CR2 NXP

MC13233CR2 electronic component of NXP
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Part No.MC13233CR2
Manufacturer: NXP
Category: RF System on a Chip - SoC
Description: 802.15.4 LR-WPAN 2480MHz 250Kbps 48-Pin LGA T/R
Datasheet: MC13233CR2 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
8: USD 8.9057 ea
Line Total: USD 71.25 
Availability - 0
MOQ: 8  Multiples: 1
Pack Size: 1
   
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We are delighted to provide the MC13233CR2 from our RF System on a Chip - SoC category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MC13233CR2 and other electronic components in the RF System on a Chip - SoC category and beyond.

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Document Number: MC1323x Freescale Semiconductor Rev. 1.0 10/2011 Technical Data MC1323x Package Information Case 2124-02 MC1323x LGA-48 7x7 mm Ordering Information Low Cost SoC Remote Control Device Device Marking Package Platform for the 2.4 GHz IEEE 1 MC13233C MC13233C LGA-48 802.15.4 Standard 1 See Table 1 for more details Contents 1 Introduction 1 Introduction 1 The MC1323x family is Freescales low cost 2 Features . 2 System-on-Chip (SoC) platform for the IEEE 802.15.4 3 Integrated IEEE 802.15.4 Transceiver (Radio and Modem) 7 Standard that incorporates a complete, low power, 2.4 4 HCS08 8-Bit Central Processing Unit (CPU) 9 GHz radio frequency transceiver with Tx/Rx switch, an 5 System Clocks . 10 8-bit HCS08 CPU, and a functional set of MCU 6 Memory . 10 peripherals into a 48-pin LGA package. This family of 7 System and Power Management 11 products is targeted for wireless RF remote control and 8 MCU Peripherals 12 other cost-sensitive applications ranging from home TV 9 Development Environment . 16 and entertainment systems such as ZigBee BeeStack 10Pin Assignment and Connections . 17 Consumer (RF4CE) to low cost, low power, IEEE 11Electrical Specifications . 20 802.15.4 and ZigBee end nodes. The MC1323x is a 12Applications Information . 32 highly integrated solution, with very low power 13Mechanical Diagrams (Case 2124-02, Non-JEDEC) 34 consumption. The MC1323x contains an RF transceiver which is an 802.15.4 Standard - 2006 compliant radio that operates in the 2.4 GHz ISM frequency band. The transceiver includes a low noise amplifier, 1mW nominal output power amplifier (PA), internal voltage controlled oscillator (VCO), integrated transmit/receive switch, on-board power supply regulation, and full spread-spectrum encoding and decoding. Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. Freescale Semiconductor, Inc., 2006, 2007, 2008, 2009, 2010, 2011. All rights reserved.The on-chip CPU is based on the Freescale HCS08 family of Microcontroller Units (MCU) and has 82 kilobyte (KB) of FLASH memory and 5KB of RAM. The onboard MCU peripheral set has been defined to support the targeted applications. A dedicated DMA block transfers packet data between RAM and the transceiver to off-load the CPU and allow higher efficiency and increased performance. 1.1 Ordering Information Table 1 provides additional details about the MC1323x Table 1. Orderable Parts Details Operating Memory Device Temp Range Package Description Options (TA.) MC13233C -40 to 85 C LGA-48 5KB RAM, Intended for smaller memory footprint applications. 82KB Flash MC13233CR2 -40 to 85 C LGA-48 5KB RAM, Intended for smaller memory footprint applications. Tape and Reel 82KB Flash 2Features This section provides a simplified block diagram and highlights MC1323x features. 2.1 Block Diagram Figure 1 shows a simplified block diagram of the MC1323x. 32 MHz 32.768 KHz (Optional) Clock & Timer RF Oscillator/PLL Reset Module & (4 Timers, Module Clock Generation Each w/1Ch) (CRM) 12x12 Keyboard Interface Digital Analog CPU Complex TX Modem 802.15.4 HCS08 SCI/UART Modem PHY Core TX/RX Interface TX Balun Switch Sequence Manager Bus Modem Interface & Analog RX 2 I C Memory RX Arbitrator Module IEEE 802.15.4 Transceiver Interrupt Advanced SPI Controller Security Interface Module 82 KB CMT Analog Pwr FLASH (IR) Management Module & Voltage Reg 5 KB Low Debug RAM Battery Module MC1323x Figure 1. MC1323x Simplified Block Diagram MC1323x Advance Information, Rev. 1.0 2 Freescale Semiconductor Data & Address Busese Up to 32 GPIO

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI
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