Freescale Semiconductor Document Number: IMX25CEC Rev. 10, 07/2013 Data Sheet: Technical Data MCIMX25 i.MX25 Applications Processor for Consumer and Industrial Products Silicon Version 1.2 Package Information Plastic package Case 5284 17 x 17 mm, 0.8 mm Pitch Case 2107 12 x 12 mm, 0.5 mm Pitch Ordering Information 1 Introduction See Table 1 on page 3 for ordering information. The i.MX25 multimedia applications processor has the right mix of high performance, low power, and 1. Introduction 1 1.1. Ordering Information 3 integration to support the growing needs of the 1.2. Block Diagram 5 industrial and general embedded markets. 2. Features 6 2.1. Special Signal Considerations 9 At the core of the i.MX25 is Freescale s fast, 3. Electrical Characteristics 11 proven, power-efficient implementation of the 3.1. i.MX25 Chip-Level Conditions 11 3.2. Supply Power-Up/Power-Down Requirements and ARM 926EJ-S core, with speeds of up to Restrictions 16 400 MHz. The i.MX25 includes support for up to 3.3. Power Characteristics 18 3.4. Thermal Characteristics 20 133 MHz DDR2 memory, integrated 10/100 3.5. I/O DC Parameters 20 Ethernet MAC, and two on-chip USB PHYs. The 3.6. AC Electrical Characteristics 24 3.7. Module Timing and Electrical Parameters 41 device is suitable for a wide range of applications, 4. Package Information and Contact Assignment 124 including the following: 4.1. 400 MAPBGACase 17x17 mm, 0.8 mm Pitch . 124 4.2. Ground, Power, Sense, and Reference Contact Graphical remote controls Assignments Case 17x17 mm, 0.8 mm Pitch . 125 Human Machine Interface (HMI) 4.3. Signal Contact Assignments17 x 17 mm, 0.8 mm Pitch 127 Residential and commercial control panels 4.4. i.MX25 17x17 Package Ball Map 135 4.5. 347 MAPBGACase 12 x 12 mm, 0.5 mm Pitch 138 Residential gateway (smart metering) 4.6. Ground, Power, Sense, and Reference Contact Assignments Case 12x12 mm, 0.5 mm Pitch . 139 Handheld scanners and printers 4.7. Signal Contact Assignments12 x 12 mm, 0.5 mm Electronic point-of-sale terminals Pitch 140 4.8. i.MX25 12x12 Package Ball Map 148 Patient-monitoring devices 5. Revision History 151 2009-2013 Freescale Semiconductor, Inc. All rights reserved.Features of the i.MX25 processor include the following: Advanced power managementThe heart of the device is a level of power management throughout the IC that enables the multimedia features and peripherals to achieve minimum system power consumption in active and various low-power modes. Power management techniques allow the designer to deliver a feature-rich product that requires levels of power far lower than typical industry expectations. Multimedia powerhouseThe multimedia performance of the i.MX25 processor is boosted by a 16 KB L1 instruction and data cache system and further enhanced by an LCD controller (with alpha blending), a CMOS image sensor interface, an A/D controller (integrated touchscreen controller), and a programmable Smart DMA (SDMA) controller. 128 Kbytes on-chip SRAMThe additional 128 Kbyte on-chip SRAM makes the device ideal for eliminating external RAM in applications with small footprint RTOS. The on-chip SRAM allows the designer to enable an ultra low power LCD refresh. Interface flexibilityThe device interface supports connection to all common types of external memories: MobileDDR, DDR, DDR2, NOR Flash, PSRAM, SDRAM and SRAM, NAND Flash, and managed NAND. Increased securityBecause the need for advanced security for tethered and untethered devices continues to increase, the i.MX25 processor delivers hardware-enabled security features that enable secure e-commerce, Digital Rights Management (DRM), information encryption, robust tamper detection, secure boot, and secure software downloads. On-chip PHYThe device includes an HS USB OTG PHY and FS USB HOST PHY. Fast EthernetFor rapid external communication, a Fast Ethernet Controller (FEC) is included. i.MX25 only supports Little Endian mode. i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 10 2 Freescale Semiconductor