MK02FN64VLF10 NXP

NXP Semiconductors K02P64M100SFA Data Sheet: Technical Data Rev. 4, 08/2016 Kinetis K02 64 KB/128 KB Flash MK02FN128VLH10 100 MHz ARM Cortex-M4 Based Microcontroller with FPU MK02FN128VLF10 MK02FN128VFM10 MK02FN64VLH10 Ideal for low-power applications that require processing efficiency and high peripheral integration. These devices share MK02FN64VLF10 the comprehensive enablement and scalability of the Kinetis MK02FN64VFM10 family. This product offers: Run power consumption down to 117.5 A/MHz and static power consumption down to 2.8 A with full state retention 64 LQFP (LH) 48 LQFP (LF) and 5.7 s wakeup. Lowest static mode down to 70 nA. 10 x 10 x 1.4 Pitch 0.5 7 x 7 x 1.4 Pitch 0.5 Excellent processing efficiency, 100 MHz ARM Cortex - mm mm M4-based device with floating-point unit in a tiny form factor 32 QFN (FM) 5 x 5 x 1 Pitch 0.5 mm Performance Analog modules 100 MHz ARM Cortex-M4 core with DSP instructions One 16-bit SAR ADC (1.2 MS/s in 12bit mode) delivering 1.25 Dhrystone MIPS per MHz One 12-bit DAC Two analog comparators (CMP) with 6- bit DAC Memories and memory interfaces Accurate internal voltage reference (not available in Up to 128 KB of embedded flash and 16 KB of RAM 32-pin QFN package) Preprogrammed Kinetis flashloader for one-time, in- system factory programming Communication interfaces One SPI module System peripherals Two UART modules Flexible low-power modes, multiple wake up sources One I2C: Support for up to 1 Mbps operation 4-channel DMA controller Independent External and Software Watchdog monitor Timers One 6-channel general-purpose/PWM timer Clocks Two 2-channel general-purpose timers with Crystal oscillator: 32-40 kHz or 3-32 MHz quadrature decoder functionality (FTM2 does not Three internal oscillators: 32 kHz, 4 MHz, and 48 MHz have external pins on the 32-pin QFN or the 48-pin Multi-purpose clock generator with FLL LQFP package) Periodic interrupt timers Security and integrity modules 16-bit low-power timer Hardware CRC module Programmable delay block 128-bit unique identification (ID) number per chip Flash access control to protect proprietary software Operating Characteristics Voltage range (including flash writes): 1.71 to 3.6 V Human-machine interface Temperature range (ambient): -40 to 105C Up to 46 general-purpose I/O (GPIO) NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Ordering Information Part Number Memory Number of GPIOs Flash (KB) SRAM (KB) MK02FN128VLH10 128 16 46 MK02FN128VLF10 128 16 35 MK02FN128VFM10 128 16 26 MK02FN64VLH10 64 16 46 MK02FN64VLF10 64 16 35 MK02FN64VFM10 64 16 26 Device Revision Number Device Mask Set Number SIM SDID REVID JTAG ID Register PRN 0N36M 0000 0000 Related Resources Type Description Resource Selector The NXP Solution Advisor is a web-based tool that features interactive KINETISKMCUSELGD Guide application wizards and a dynamic product selector. Reference The Reference Manual contains a comprehensive description of the K02P64M100SFARM Manual structure and function (operation) of a device. Data Sheet The Data Sheet includes electrical characteristics and signal This document. connections. Chip Errata The chip mask set Errata provides additional or corrective information for Kinetis K 0N36M a particular device mask set. Package Package dimensions are provided by the part number: 98ARE10566D drawing MK02FN64VFM10 98ARE10566D MK02FN128VFM10 98ASH00962A MK02FN64VLF10 98ASH00962A MK02FN128VLF10 98ASS23234W MK02FN64VLH10 98ASS23234W MK02FN128VLH10 Figure 1 shows the functional modules in the chip. 2 Kinetis K02 64 KB/128 KB Flash, Rev. 4, 08/2016 NXP Semiconductors