MK10DX256VLK7 NXP

Document Number: K10P81M72SF1 Freescale Semiconductor Rev. 3, 11/2012 Data Sheet: Technical Data K10P81M72SF1 K10 Sub-Family Supports: MK10DX64VLK7, MK10DX128VLK7, MK10DX256VLK7 Features Analog modules Operating Characteristics Two 16-bit SAR ADCs Voltage range: 1.71 to 3.6 V Programmable gain amplifier (PGA) (up to x64) Flash write voltage range: 1.71 to 3.6 V integrated into each ADC Temperature range (ambient): -40 to 105C 12-bit DAC Three analog comparators (CMP) containing a 6-bit Clocks DAC and programmable reference input 3 to 32 MHz crystal oscillator Voltage reference 32 kHz crystal oscillator Multi-purpose clock generator Timers Programmable delay block System peripherals Eight-channel motor control/general purpose/PWM Multiple low-power modes to provide power timer optimization based on application requirements Two 2-channel quadrature decoder/general purpose 16-channel DMA controller, supporting up to 63 timers request sources Periodic interrupt timers External watchdog monitor 16-bit low-power timer Software watchdog Carrier modulator transmitter Low-leakage wakeup unit Real-time clock Security and integrity modules Communication interfaces Hardware CRC module to support fast cyclic Controller Area Network (CAN) module redundancy checks Two SPI modules 128-bit unique identification (ID) number per chip Two I2C modules Four UART modules Human-machine interface I2S module Low-power hardware touch sensor interface (TSI) General-purpose input/output Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 2012 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................3 5.4.2 Thermal attributes.................................................21 1.1 Determining valid orderable parts......................................3 6 Peripheral operating requirements and behaviors....................21 2 Part identification......................................................................3 6.1 Core modules....................................................................22 2.1 Description.........................................................................3 6.1.1 Debug trace timing specifications.........................22 2.2 Format...............................................................................3 6.1.2 JTAG electricals....................................................22 2.3 Fields.................................................................................3 6.2 System modules................................................................25 2.4 Example............................................................................4 6.3 Clock modules...................................................................25 3 Terminology and guidelines......................................................4 6.3.1 MCG specifications...............................................25 3.1 Definition: Operating requirement......................................4 6.3.2 Oscillator electrical specifications.........................27 3.2 Definition: Operating behavior...........................................5 6.3.3 32 kHz Oscillator Electrical Characteristics...........30 3.3 Definition: Attribute............................................................5 6.4 Memories and memory interfaces.....................................30 3.4 Definition: Rating...............................................................6 6.4.1 Flash electrical specifications................................30 3.5 Result of exceeding a rating..............................................6 6.4.2 EzPort Switching Specifications............................35 3.6 Relationship between ratings and operating 6.4.3 Flexbus Switching Specifications..........................36 requirements......................................................................6 6.5 Security and integrity modules..........................................39 3.7 Guidelines for ratings and operating requirements............7 6.6 Analog...............................................................................39 3.8 Definition: Typical value.....................................................7 6.6.1 ADC electrical specifications.................................39 3.9 Typical value conditions....................................................8 6.6.2 CMP and 6-bit DAC electrical specifications.........47 4 Ratings......................................................................................9 6.6.3 12-bit DAC electrical characteristics.....................49 4.1 Thermal handling ratings...................................................9 6.6.4 Voltage reference electrical specifications............52 4.2 Moisture handling ratings..................................................9 6.7 Timers................................................................................53 4.3 ESD handling ratings.........................................................9 6.8 Communication interfaces.................................................53 4.4 Voltage and current operating ratings...............................9 6.8.1 CAN switching specifications................................53 5 General.....................................................................................10 6.8.2 DSPI switching specifications (limited voltage 5.1 AC electrical characteristics..............................................10 range)....................................................................54 5.2 Nonswitching electrical specifications...............................10 6.8.3 DSPI switching specifications (full voltage range).55 5.2.1 Voltage and current operating requirements.........10 6.8.4 I2C switching specifications..................................57 5.2.2 LVD and POR operating requirements.................11 6.8.5 UART switching specifications..............................57 5.2.3 Voltage and current operating behaviors..............12 6.8.6 I2S/SAI Switching Specifications..........................57 5.2.4 Power mode transition operating behaviors..........13 6.9 Human-machine interfaces (HMI)......................................61 5.2.5 Power consumption operating behaviors..............14 6.9.1 TSI electrical specifications...................................61 5.2.6 Designing with radiated emissions in mind...........18 7 Dimensions...............................................................................62 5.2.7 Capacitance attributes..........................................18 7.1 Obtaining package dimensions.........................................62 5.3 Switching specifications.....................................................19 8 Pinout........................................................................................63 5.3.1 Device clock specifications...................................19 8.1 K10 Signal Multiplexing and Pin Assignments..................63 5.3.2 General switching specifications...........................19 8.2 K10 Pinouts.......................................................................66 5.4 Thermal specifications.......................................................20 9 Revision History........................................................................67 5.4.1 Thermal operating requirements...........................20 K10 Sub-Family Data Sheet, Rev. 3, 11/2012. 2 Freescale Semiconductor, Inc.