Document Number: K11P80M50SF4 Freescale Semiconductor Rev. 4.1, 08/2013 Data Sheet: Technical Data K11P80M50SF4 K11 Sub-Family Supports the following: MK11DX128VLK5, MK11DX256VLK5, MK11DN512VLK5 Features Security and integrity modules Operating Characteristics Hardware CRC module to support fast cyclic Voltage range: 1.71 to 3.6 V redundancy checks Flash write voltage range: 1.71 to 3.6 V Tamper detect and secure storage Temperature range (ambient): -40 to 105C Hardware random-number generator Hardware encryption supporting DES, 3DES, AES, Performance MD5, SHA-1, and SHA-256 algorithms Up to 50 MHz ARM Cortex-M4 core with DSP 128-bit unique identification (ID) number per chip instructions delivering 1.25 Dhrystone MIPS per MHz Human-machine interface General-purpose input/output Memories and memory interfaces Up to 512 KB of program flash for devices without Analog modules FlexNVM. 16-bit SAR ADC Up to 256 KB program flash for devices with Two analog comparators (CMP) containing a 6-bit FlexNVM. DAC and programmable reference input 64 KB FlexNVM on FlexMemory devices Timers 4 KB FlexRAM on FlexMemory devices Programmable delay block Up to 64 KB RAM Eight-channel motor control/general purpose/PWM Serial programming interface (EzPort) timer Clocks Two 2-channel general purpose timers, one with 3 to 32 MHz crystal oscillator quadrature decoder functionality 32 kHz crystal oscillator Periodic interrupt timers Multi-purpose clock generator 16-bit low-power timer Carrier modulator transmitter System peripherals Real-time clock Multiple low-power modes to provide power optimization based on application requirements Communication interfaces 16-channel DMA controller, supporting up to 63 USB Device Charger detect request sources Two SPI modules External watchdog monitor Two I2C modules Software watchdog Four UART modules Low-leakage wakeup unit I2S module Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 20122013 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................3 5.3.2 General switching specifications...........................20 1.1 Determining valid orderable parts......................................3 5.4 Thermal specifications.......................................................20 2 Part identification......................................................................3 5.4.1 Thermal operating requirements...........................21 2.1 Description.........................................................................3 5.4.2 Thermal attributes.................................................21 2.2 Format...............................................................................3 6 Peripheral operating requirements and behaviors....................22 2.3 Fields.................................................................................3 6.1 Core modules....................................................................22 2.4 Example............................................................................4 6.1.1 JTAG electricals....................................................22 2.5 Small package marking.....................................................4 6.2 System modules................................................................25 3 Terminology and guidelines......................................................5 6.3 Clock modules...................................................................25 3.1 Definition: Operating requirement......................................5 6.3.1 MCG specifications...............................................25 3.2 Definition: Operating behavior...........................................5 6.3.2 Oscillator electrical specifications.........................27 3.3 Definition: Attribute............................................................6 6.3.3 32 kHz oscillator electrical characteristics.............29 3.4 Definition: Rating...............................................................6 6.4 Memories and memory interfaces.....................................30 3.5 Result of exceeding a rating..............................................7 6.4.1 Flash electrical specifications................................30 3.6 Relationship between ratings and operating 6.4.2 EzPort switching specifications.............................33 requirements......................................................................7 6.5 Security and integrity modules..........................................34 3.7 Guidelines for ratings and operating requirements............8 6.5.1 DryIce Tamper Electrical Specifications................34 3.8 Definition: Typical value.....................................................8 6.6 Analog...............................................................................34 3.9 Typical value conditions....................................................9 6.6.1 ADC electrical specifications.................................34 4 Ratings......................................................................................9 6.6.2 CMP and 6-bit DAC electrical specifications.........38 4.1 Thermal handling ratings...................................................9 6.7 Timers................................................................................41 4.2 Moisture handling ratings..................................................10 6.8 Communication interfaces.................................................41 4.3 ESD handling ratings.........................................................10 6.8.1 DSPI switching specifications (limited voltage 4.4 Voltage and current operating ratings...............................10 range)....................................................................41 5 General.....................................................................................10 6.8.2 DSPI switching specifications (full voltage range).43 5.1 AC electrical characteristics..............................................11 6.8.3 I2C switching specifications..................................45 5.2 Nonswitching electrical specifications...............................11 6.8.4 UART switching specifications..............................45 5.2.1 Voltage and current operating requirements.........11 6.8.5 Normal Run, Wait and Stop mode performance 5.2.2 LVD and POR operating requirements.................12 over the full operating voltage range.....................45 5.2.3 Voltage and current operating behaviors..............13 6.8.6 VLPR, VLPW, and VLPS mode performance 5.2.4 Power mode transition operating behaviors..........13 over the full operating voltage range.....................47 5.2.5 Power consumption operating behaviors..............14 7 Dimensions...............................................................................49 5.2.6 EMC radiated emissions operating behaviors.......18 7.1 Obtaining package dimensions.........................................49 5.2.7 Designing with radiated emissions in mind...........19 8 Pinout........................................................................................49 5.2.8 Capacitance attributes..........................................19 8.1 K11 Signal Multiplexing and Pin Assignments..................49 5.3 Switching specifications.....................................................19 8.2 K11 Pinouts.......................................................................52 5.3.1 Device clock specifications...................................19 9 Revision History........................................................................54 K11 Sub-Family Data Sheet, Rev. 4.1, 08/2013. 2 Freescale Semiconductor, Inc.