Document Number: K11P121M50SF4 Freescale Semiconductor Rev. 4, 08/2013 Data Sheet: Technical Data K11P121M50SF4 K11 Sub-Family Supports the following: MK11DX128VMC5, MK11DX256VMC5, MK11DN512VMC5 Features Security and integrity modules Operating Characteristics Hardware CRC module to support fast cyclic Voltage range: 1.71 to 3.6 V redundancy checks Flash write voltage range: 1.71 to 3.6 V Tamper detect and secure storage Temperature range (ambient): -40 to 105C Hardware random-number generator Hardware encryption supporting DES, 3DES, AES, Performance MD5, SHA-1, and SHA-256 algorithms Up to 50 MHz ARM Cortex-M4 core with DSP 128-bit unique identification (ID) number per chip instructions delivering 1.25 Dhrystone MIPS per MHz Human-machine interface General-purpose input/output Memories and memory interfaces Up to 512 KB of program flash for devices without Analog modules FlexNVM. 16-bit SAR ADC Up to 256 KB program flash for devices with 12-bit DAC FlexNVM. Two analog comparators (CMP) containing a 6-bit 64 KB FlexNVM on FlexMemory devices DAC and programmable reference input 4 KB FlexRAM on FlexMemory devices Voltage reference Up to 64 KB RAM Timers Serial programming interface (EzPort) Programmable delay block Clocks Eight-channel motor control/general purpose/PWM 3 to 32 MHz crystal oscillator timer 32 kHz crystal oscillator Two 2-channel general purpose timers, one with Multi-purpose clock generator quadrature decoder functionality Periodic interrupt timers System peripherals 16-bit low-power timer Multiple low-power modes to provide power Carrier modulator transmitter optimization based on application requirements Real-time clock 16-channel DMA controller, supporting up to 63 request sources Communication interfaces External watchdog monitor USB Device Charger detect Software watchdog Two SPI modules Low-leakage wakeup unit Two I2C modules Four UART modules I2S module Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 20122013 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................3 5.4 Thermal specifications.......................................................20 1.1 Determining valid orderable parts......................................3 5.4.1 Thermal operating requirements...........................21 2 Part identification......................................................................3 5.4.2 Thermal attributes.................................................21 2.1 Description.........................................................................3 6 Peripheral operating requirements and behaviors....................22 2.2 Format...............................................................................3 6.1 Core modules....................................................................22 2.3 Fields.................................................................................3 6.1.1 JTAG electricals....................................................22 2.4 Example............................................................................4 6.2 System modules................................................................25 2.5 Small package marking.....................................................4 6.3 Clock modules...................................................................25 3 Terminology and guidelines......................................................5 6.3.1 MCG specifications...............................................25 3.1 Definition: Operating requirement......................................5 6.3.2 Oscillator electrical specifications.........................27 3.2 Definition: Operating behavior...........................................5 6.3.3 32 kHz oscillator electrical characteristics.............29 3.3 Definition: Attribute............................................................6 6.4 Memories and memory interfaces.....................................30 3.4 Definition: Rating...............................................................6 6.4.1 Flash electrical specifications................................30 3.5 Result of exceeding a rating..............................................7 6.4.2 EzPort switching specifications.............................33 3.6 Relationship between ratings and operating 6.5 Security and integrity modules..........................................34 requirements......................................................................7 6.5.1 DryIce Tamper Electrical Specifications................34 3.7 Guidelines for ratings and operating requirements............8 6.6 Analog...............................................................................34 3.8 Definition: Typical value.....................................................8 6.6.1 ADC electrical specifications.................................34 3.9 Typical value conditions....................................................9 6.6.2 CMP and 6-bit DAC electrical specifications.........38 4 Ratings......................................................................................9 6.6.3 12-bit DAC electrical characteristics.....................41 4.1 Thermal handling ratings...................................................9 6.6.4 Voltage reference electrical specifications............44 4.2 Moisture handling ratings..................................................10 6.7 Timers................................................................................45 4.3 ESD handling ratings.........................................................10 6.8 Communication interfaces.................................................45 4.4 Voltage and current operating ratings...............................10 6.8.1 DSPI switching specifications (limited voltage 5 General.....................................................................................10 range)....................................................................45 5.1 AC electrical characteristics..............................................11 6.8.2 DSPI switching specifications (full voltage range).47 5.2 Nonswitching electrical specifications...............................11 6.8.3 I2C switching specifications..................................49 5.2.1 Voltage and current operating requirements.........11 6.8.4 UART switching specifications..............................49 5.2.2 LVD and POR operating requirements.................12 6.8.5 Normal Run, Wait and Stop mode performance 5.2.3 Voltage and current operating behaviors..............13 over the full operating voltage range.....................49 5.2.4 Power mode transition operating behaviors..........13 6.8.6 VLPR, VLPW, and VLPS mode performance 5.2.5 Power consumption operating behaviors..............14 over the full operating voltage range.....................51 5.2.6 EMC radiated emissions operating behaviors.......18 7 Dimensions...............................................................................53 5.2.7 Designing with radiated emissions in mind...........19 7.1 Obtaining package dimensions.........................................53 5.2.8 Capacitance attributes..........................................19 8 Pinout........................................................................................53 5.3 Switching specifications.....................................................19 8.1 K11 Signal Multiplexing and Pin Assignments..................53 5.3.1 Device clock specifications...................................19 8.2 K11 Pinouts.......................................................................58 5.3.2 General switching specifications...........................20 9 Revision History........................................................................59 K11 Sub-Family Data Sheet, Rev. 4, 08/2013. 2 Freescale Semiconductor, Inc.