MK20DX128VFM5 NXP

Document Number: K20P32M50SF0 Freescale Semiconductor Rev. 4 5/2012 Data Sheet: Technical Data K20P32M50SF0 K20 Sub-Family Supports the following: MK20DN32VFM5, MK20DX32VFM5, MK20DN64VFM5, MK20DX64VFM5, MK20DN128VFM5, MK20DX128VFM5 Features Security and integrity modules Operating Characteristics Hardware CRC module to support fast cyclic Voltage range: 1.71 to 3.6 V redundancy checks Flash write voltage range: 1.71 to 3.6 V 128-bit unique identification (ID) number per chip Temperature range (ambient): -40 to 105C Analog modules Performance 16-bit SAR ADC Up to 50 MHz ARM Cortex-M4 core with DSP Two analog comparators (CMP) containing a 6-bit instructions delivering 1.25 Dhrystone MIPS per DAC and programmable reference input MHz Timers Memories and memory interfaces Programmable delay block Up to 128 KB program flash. Eight-channel motor control/general purpose/PWM Up to 32 KB FlexNVM on FlexMemory devices timer 2 KB FlexRAM on FlexMemory devices Two-channel quadrature decoder/general purpose Up to 16 KB RAM timer Serial programming interface (EzPort) Periodic interrupt timers 16-bit low-power timer Clocks Carrier modulator transmitter 3 to 32 MHz crystal oscillator Real-time clock 32 kHz crystal oscillator Multi-purpose clock generator Communication interfaces USB full-/low-speed On-the-Go controller with on- System peripherals chip transceiver Multiple low-power modes to provide power SPI module optimization based on application requirements I2C module 4-channel DMA controller, supporting up to 41 Two UART modules request sources I2S module External watchdog monitor Software watchdog Low-leakage wakeup unit Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 20112012 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................3 5.4 Thermal specifications.......................................................21 1.1 Determining valid orderable parts......................................3 5.4.1 Thermal operating requirements...........................21 2 Part identification......................................................................3 5.4.2 Thermal attributes.................................................21 2.1 Description.........................................................................3 6 Peripheral operating requirements and behaviors....................22 2.2 Format...............................................................................3 6.1 Core modules....................................................................22 2.3 Fields.................................................................................3 6.1.1 JTAG electricals....................................................22 2.4 Example............................................................................4 6.2 System modules................................................................25 3 Terminology and guidelines......................................................4 6.3 Clock modules...................................................................25 3.1 Definition: Operating requirement......................................4 6.3.1 MCG specifications...............................................25 3.2 Definition: Operating behavior...........................................5 6.3.2 Oscillator electrical specifications.........................27 3.3 Definition: Attribute............................................................5 6.3.3 32 kHz Oscillator Electrical Characteristics...........29 3.4 Definition: Rating...............................................................6 6.4 Memories and memory interfaces.....................................30 3.5 Result of exceeding a rating..............................................6 6.4.1 Flash electrical specifications................................30 3.6 Relationship between ratings and operating 6.4.2 EzPort Switching Specifications............................34 requirements......................................................................6 6.5 Security and integrity modules..........................................35 3.7 Guidelines for ratings and operating requirements............7 6.6 Analog...............................................................................35 3.8 Definition: Typical value.....................................................7 6.6.1 ADC electrical specifications.................................35 3.9 Typical value conditions....................................................8 6.6.2 CMP and 6-bit DAC electrical specifications.........40 4 Ratings......................................................................................9 6.7 Timers................................................................................43 4.1 Thermal handling ratings...................................................9 6.8 Communication interfaces.................................................43 4.2 Moisture handling ratings..................................................9 6.8.1 USB electrical specifications.................................43 4.3 ESD handling ratings.........................................................9 6.8.2 USB DCD electrical specifications........................43 4.4 Voltage and current operating ratings...............................9 6.8.3 USB VREG electrical specifications......................44 5 General.....................................................................................10 6.8.4 DSPI switching specifications (limited voltage 5.1 AC electrical characteristics..............................................10 range)....................................................................44 5.2 Nonswitching electrical specifications...............................11 6.8.5 DSPI switching specifications (full voltage range).46 5.2.1 Voltage and current operating requirements.........11 6.8.6 I2C switching specifications..................................48 5.2.2 LVD and POR operating requirements.................11 6.8.7 UART switching specifications..............................48 5.2.3 Voltage and current operating behaviors..............12 6.8.8 I2S/SAI Switching Specifications..........................48 5.2.4 Power mode transition operating behaviors..........13 6.9 Human-machine interfaces (HMI)......................................52 5.2.5 Power consumption operating behaviors..............14 6.9.1 TSI electrical specifications...................................52 5.2.6 EMC radiated emissions operating behaviors.......18 7 Dimensions...............................................................................54 5.2.7 Designing with radiated emissions in mind...........19 7.1 Obtaining package dimensions.........................................54 5.2.8 Capacitance attributes..........................................19 8 Pinout........................................................................................54 5.3 Switching specifications.....................................................19 8.1 K20 Signal Multiplexing and Pin Assignments..................54 5.3.1 Device clock specifications...................................19 8.2 K20 Pinouts.......................................................................55 5.3.2 General switching specifications...........................20 9 Revision History........................................................................56 K20 Sub-Family Data Sheet, Rev. 4 5/2012. 2 Freescale Semiconductor, Inc.