MK20DX256VLH7 NXP

Document Number: K20P64M72SF1 Freescale Semiconductor Rev. 3, 11/2012 Data Sheet: Technical Data K20P64M72SF1 K20 Sub-Family Supports: MK20DX64VLH7, MK20DX128VLH7, MK20DX256VLH7 Features Timers Operating Characteristics Programmable delay block Voltage range: 1.71 to 3.6 V Eight-channel motor control/general purpose/PWM Flash write voltage range: 1.71 to 3.6 V timer Temperature range (ambient): -40 to 105C Two 2-channel quadrature decoder/general purpose timers Clocks Periodic interrupt timers 3 to 32 MHz crystal oscillator 16-bit low-power timer 32 kHz crystal oscillator Carrier modulator transmitter Multi-purpose clock generator Real-time clock System peripherals Communication interfaces Multiple low-power modes to provide power USB full-/low-speed On-the-Go controller with on- optimization based on application requirements chip transceiver 16-channel DMA controller, supporting up to 63 Controller Area Network (CAN) module request sources SPI module External watchdog monitor Two I2C modules Software watchdog Three UART modules Low-leakage wakeup unit I2S module Security and integrity modules Hardware CRC module to support fast cyclic redundancy checks 128-bit unique identification (ID) number per chip Human-machine interface Low-power hardware touch sensor interface (TSI) General-purpose input/output Analog modules Two 16-bit SAR ADCs Programmable gain amplifier (PGA) (up to x64) integrated into each ADC 12-bit DAC Three analog comparators (CMP) containing a 6-bit DAC and programmable reference input Voltage reference Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 2012 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................3 6 Peripheral operating requirements and behaviors....................21 1.1 Determining valid orderable parts......................................3 6.1 Core modules....................................................................22 2 Part identification......................................................................3 6.1.1 Debug trace timing specifications.........................22 2.1 Description.........................................................................3 6.1.2 JTAG electricals....................................................22 2.2 Format...............................................................................3 6.2 System modules................................................................25 2.3 Fields.................................................................................3 6.3 Clock modules...................................................................25 2.4 Example............................................................................4 6.3.1 MCG specifications...............................................25 3 Terminology and guidelines......................................................4 6.3.2 Oscillator electrical specifications.........................27 3.1 Definition: Operating requirement......................................4 6.3.3 32 kHz Oscillator Electrical Characteristics...........30 3.2 Definition: Operating behavior...........................................5 6.4 Memories and memory interfaces.....................................30 3.3 Definition: Attribute............................................................5 6.4.1 Flash electrical specifications................................30 3.4 Definition: Rating...............................................................6 6.4.2 EzPort Switching Specifications............................35 3.5 Result of exceeding a rating..............................................6 6.5 Security and integrity modules..........................................36 3.6 Relationship between ratings and operating 6.6 Analog...............................................................................36 requirements......................................................................6 6.6.1 ADC electrical specifications.................................36 3.7 Guidelines for ratings and operating requirements............7 6.6.2 CMP and 6-bit DAC electrical specifications.........43 3.8 Definition: Typical value.....................................................7 6.6.3 12-bit DAC electrical characteristics.....................46 3.9 Typical value conditions....................................................8 6.6.4 Voltage reference electrical specifications............49 4 Ratings......................................................................................9 6.7 Timers................................................................................50 4.1 Thermal handling ratings...................................................9 6.8 Communication interfaces.................................................50 4.2 Moisture handling ratings..................................................9 6.8.1 USB electrical specifications.................................50 4.3 ESD handling ratings.........................................................9 6.8.2 USB DCD electrical specifications........................51 4.4 Voltage and current operating ratings...............................9 6.8.3 USB VREG electrical specifications......................51 5 General.....................................................................................10 6.8.4 CAN switching specifications................................52 5.1 AC electrical characteristics..............................................10 6.8.5 DSPI switching specifications (limited voltage 5.2 Nonswitching electrical specifications...............................10 range)....................................................................52 5.2.1 Voltage and current operating requirements.........11 6.8.6 DSPI switching specifications (full voltage range).53 5.2.2 LVD and POR operating requirements.................11 6.8.7 I2C switching specifications..................................55 5.2.3 Voltage and current operating behaviors..............12 6.8.8 UART switching specifications..............................55 5.2.4 Power mode transition operating behaviors..........13 6.8.9 I2S/SAI Switching Specifications..........................55 5.2.5 Power consumption operating behaviors..............14 6.9 Human-machine interfaces (HMI)......................................60 5.2.6 Designing with radiated emissions in mind...........18 6.9.1 TSI electrical specifications...................................60 5.2.7 Capacitance attributes..........................................18 7 Dimensions...............................................................................61 5.3 Switching specifications.....................................................19 7.1 Obtaining package dimensions.........................................61 5.3.1 Device clock specifications...................................19 8 Pinout........................................................................................61 5.3.2 General switching specifications...........................19 8.1 K20 Signal Multiplexing and Pin Assignments..................61 5.4 Thermal specifications.......................................................20 8.2 K20 Pinouts.......................................................................64 5.4.1 Thermal operating requirements...........................20 9 Revision History........................................................................65 5.4.2 Thermal attributes.................................................21 K20 Sub-Family Data Sheet, Rev. 3, 11/2012. 2 Freescale Semiconductor, Inc.