MK20DX256VLL10 NXP

Document Number: K20P100M100SF2V2 Freescale Semiconductor Rev. 3, 6/2013 Data Sheet: Technical Data K20P100M100SF2V2 K20 Sub-Family Supports the following: MK20DX256VLL10, MK20DN512VLL10 Features Human-machine interface Operating Characteristics Low-power hardware touch sensor interface (TSI) Voltage range: 1.71 to 3.6 V General-purpose input/output Flash write voltage range: 1.71 to 3.6 V Analog modules Temperature range (ambient): -40 to 105C Two 16-bit SAR ADCs Performance Programmable gain amplifier (PGA) (up to x64) Up to 100 MHz ARM Cortex-M4 core with DSP integrated into each ADC instructions delivering 1.25 Dhrystone MIPS per 12-bit DAC MHz Two transimpedance amplifiers Three analog comparators (CMP) containing a 6-bit Memories and memory interfaces DAC and programmable reference input Up to 512 KB program flash memory on non- Voltage reference FlexMemory devices Up to 128 KB RAM Timers Serial programming interface (EzPort) Programmable delay block FlexBus external bus interface Eight-channel motor control/general purpose/PWM timer Clocks Two 2-channel quadrature decoder/general purpose 3 to 32 MHz crystal oscillator timers 32 kHz crystal oscillator Periodic interrupt timers Multi-purpose clock generator 16-bit low-power timer Carrier modulator transmitter System peripherals Real-time clock Multiple low-power modes to provide power optimization based on application requirements Communication interfaces Memory protection unit with multi-master USB full-/low-speed On-the-Go controller with on- protection chip transceiver 16-channel DMA controller, supporting up to 63 Two Controller Area Network (CAN) modules request sources Three SPI modules External watchdog monitor Two I2C modules Software watchdog Five UART modules Low-leakage wakeup unit Secure Digital host controller (SDHC) I2S module Security and integrity modules Hardware CRC module to support fast cyclic redundancy checks 128-bit unique identification (ID) number per chip Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 20122013 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................4 6 Peripheral operating requirements and behaviors....................23 1.1 Determining valid orderable parts......................................4 6.1 Core modules....................................................................23 2 Part identification......................................................................4 6.1.1 Debug trace timing specifications.......................23 2.1 Description.........................................................................4 6.1.2 JTAG electricals..................................................24 2.2 Format...............................................................................4 6.2 System modules................................................................27 2.3 Fields.................................................................................4 6.3 Clock modules...................................................................27 2.4 Example............................................................................5 6.3.1 MCG specifications.............................................27 3 Terminology and guidelines......................................................5 6.3.2 Oscillator electrical specifications.......................29 3.1 Definition: Operating requirement......................................5 6.3.3 32 kHz oscillator electrical characteristics..........32 3.2 Definition: Operating behavior...........................................6 6.4 Memories and memory interfaces.....................................32 3.3 Definition: Attribute............................................................6 6.4.1 Flash electrical specifications.............................32 3.4 Definition: Rating...............................................................7 6.4.2 EzPort switching specifications...........................34 3.5 Result of exceeding a rating..............................................7 6.4.3 Flexbus switching specifications.........................35 3.6 Relationship between ratings and operating 6.5 Security and integrity modules..........................................38 requirements......................................................................7 6.6 Analog...............................................................................38 3.7 Guidelines for ratings and operating requirements............8 6.6.1 ADC electrical specifications..............................38 3.8 Definition: Typical value.....................................................8 6.6.2 CMP and 6-bit DAC electrical specifications......46 3.9 Typical value conditions....................................................9 6.6.3 12-bit DAC electrical characteristics...................49 4 Ratings......................................................................................10 6.6.4 Voltage reference electrical specifications..........52 4.1 Thermal handling ratings...................................................10 6.7 Timers................................................................................53 4.2 Moisture handling ratings..................................................10 6.8 Communication interfaces.................................................53 4.3 ESD handling ratings.........................................................10 6.8.1 USB electrical specifications...............................53 4.4 Voltage and current operating ratings...............................10 6.8.2 USB DCD electrical specifications......................54 5 General.....................................................................................11 6.8.3 USB VREG electrical specifications...................54 5.1 AC electrical characteristics..............................................11 6.8.4 CAN switching specifications..............................55 5.2 Nonswitching electrical specifications...............................11 6.8.5 DSPI switching specifications (limited voltage 5.2.1 Voltage and current operating requirements......12 range).................................................................55 5.2.2 LVD and POR operating requirements...............13 6.8.6 DSPI switching specifications (full voltage 5.2.3 Voltage and current operating behaviors............13 range).................................................................56 5.2.4 Power mode transition operating behaviors.......15 6.8.7 Inter-Integrated Circuit Interface (I2C) timing.....58 5.2.5 Power consumption operating behaviors............16 6.8.8 UART switching specifications............................59 5.2.6 EMC radiated emissions operating behaviors....19 6.8.9 SDHC specifications...........................................59 5.2.7 Designing with radiated emissions in mind.........20 6.8.10 I2S/SAI switching specifications.........................60 5.2.8 Capacitance attributes........................................20 6.9 Human-machine interfaces (HMI)......................................67 5.3 Switching specifications.....................................................20 6.9.1 TSI electrical specifications................................67 5.3.1 Device clock specifications.................................20 7 Dimensions...............................................................................68 5.3.2 General switching specifications.........................21 7.1 Obtaining package dimensions.........................................68 5.4 Thermal specifications.......................................................22 8 Pinout........................................................................................68 5.4.1 Thermal operating requirements.........................22 8.1 K20 signal multiplexing and pin assignments....................68 5.4.2 Thermal attributes...............................................22 8.2 K20 pinouts.......................................................................72 K20 Sub-Family Data Sheet, Rev. 3, 6/2013. 2 Freescale Semiconductor, Inc.