Document Number: K20P81M100SF2 Freescale Semiconductor Rev. 7, 02/2013 Data Sheet: Technical Data K20P81M100SF2 K20 Sub-Family Data Sheet Supports the following: MK20DX256ZVLK10, MK20DN512ZVLK10, MK20DX256ZVMB10, MK20DN512ZVMB10 Features Security and integrity modules Operating Characteristics Hardware CRC module to support fast cyclic Voltage range: 1.71 to 3.6 V redundancy checks Flash write voltage range: 1.71 to 3.6 V 128-bit unique identification (ID) number per chip Temperature range (ambient): -40 to 105C Human-machine interface Performance Low-power hardware touch sensor interface (TSI) Up to 100 MHz ARM Cortex-M4 core with DSP General-purpose input/output instructions delivering 1.25 Dhrystone MIPS per Analog modules MHz Two 16-bit SAR ADCs Memories and memory interfaces Programmable gain amplifier (PGA) (up to x64) Up to 512 KB program flash memory on non- integrated into each ADC FlexMemory devices 12-bit DAC Up to 256 KB program flash memory on Three analog comparators (CMP) containing a 6-bit FlexMemory devices DAC and programmable reference input Up to 256 KB FlexNVM on FlexMemory devices Voltage reference 4 KB FlexRAM on FlexMemory devices Timers Up to 128 KB RAM Programmable delay block Serial programming interface (EzPort) Eight-channel motor control/general purpose/PWM FlexBus external bus interface timer Clocks Two 2-channel quadrature decoder/general purpose 3 to 32 MHz crystal oscillator timers 32 kHz crystal oscillator Periodic interrupt timers Multi-purpose clock generator 16-bit low-power timer Carrier modulator transmitter System peripherals Real-time clock Multiple low-power modes to provide power optimization based on application requirements Communication interfaces Memory protection unit with multi-master USB full-/low-speed On-the-Go controller with on- protection chip transceiver 16-channel DMA controller, supporting up to 63 Two Controller Area Network (CAN) modules request sources Two SPI modules External watchdog monitor Two I2C modules Software watchdog Four UART modules Low-leakage wakeup unit Secure Digital host controller (SDHC) I2S module Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 20112013 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................4 6 Peripheral operating requirements and behaviors....................23 1.1 Determining valid orderable parts......................................4 6.1 Core modules....................................................................23 2 Part identification......................................................................4 6.1.1 Debug trace timing specifications.......................23 2.1 Description.........................................................................4 6.1.2 JTAG electricals..................................................24 2.2 Format...............................................................................4 6.2 System modules................................................................27 2.3 Fields.................................................................................4 6.3 Clock modules...................................................................27 2.4 Example............................................................................5 6.3.1 MCG specifications.............................................27 3 Terminology and guidelines......................................................5 6.3.2 Oscillator electrical specifications.......................29 3.1 Definition: Operating requirement......................................5 6.3.3 32 kHz Oscillator Electrical Characteristics........31 3.2 Definition: Operating behavior...........................................6 6.4 Memories and memory interfaces.....................................32 3.3 Definition: Attribute............................................................6 6.4.1 Flash electrical specifications.............................32 3.4 Definition: Rating...............................................................7 6.4.2 EzPort Switching Specifications.........................36 3.5 Result of exceeding a rating..............................................7 6.4.3 Flexbus Switching Specifications........................37 3.6 Relationship between ratings and operating 6.5 Security and integrity modules..........................................40 requirements......................................................................7 6.6 Analog...............................................................................40 3.7 Guidelines for ratings and operating requirements............8 6.6.1 ADC electrical specifications..............................40 3.8 Definition: Typical value.....................................................8 6.6.2 CMP and 6-bit DAC electrical specifications......48 3.9 Typical value conditions....................................................9 6.6.3 12-bit DAC electrical characteristics...................50 4 Ratings......................................................................................10 6.6.4 Voltage reference electrical specifications..........53 4.1 Thermal handling ratings...................................................10 6.7 Timers................................................................................54 4.2 Moisture handling ratings..................................................10 6.8 Communication interfaces.................................................54 4.3 ESD handling ratings.........................................................10 6.8.1 USB electrical specifications...............................54 4.4 Voltage and current operating ratings...............................10 6.8.2 USB DCD electrical specifications......................55 5 General.....................................................................................11 6.8.3 USB VREG electrical specifications...................55 5.1 AC electrical characteristics..............................................11 6.8.4 CAN switching specifications..............................56 5.2 Nonswitching electrical specifications...............................11 6.8.5 DSPI switching specifications (limited voltage 5.2.1 Voltage and current operating requirements......12 range).................................................................56 5.2.2 LVD and POR operating requirements...............13 6.8.6 DSPI switching specifications (full voltage 5.2.3 Voltage and current operating behaviors............13 range).................................................................57 5.2.4 Power mode transition operating behaviors.......15 6.8.7 Inter-Integrated Circuit Interface (I2C) timing.....59 5.2.5 Power consumption operating behaviors............16 6.8.8 UART switching specifications............................60 5.2.6 EMC radiated emissions operating behaviors....19 6.8.9 SDHC specifications...........................................60 5.2.7 Designing with radiated emissions in mind.........20 6.8.10 I2S switching specifications................................61 5.2.8 Capacitance attributes........................................20 6.9 Human-machine interfaces (HMI)......................................64 5.3 Switching specifications.....................................................20 6.9.1 TSI electrical specifications................................64 5.3.1 Device clock specifications.................................20 7 Dimensions...............................................................................65 5.3.2 General switching specifications.........................20 7.1 Obtaining package dimensions.........................................65 5.4 Thermal specifications.......................................................21 8 Pinout........................................................................................65 5.4.1 Thermal operating requirements.........................21 8.1 K20 Signal Multiplexing and Pin Assignments..................65 5.4.2 Thermal attributes...............................................22 8.2 K20 Pinouts.......................................................................70 K20 Sub-Family Data Sheet Data Sheet, Rev. 7, 02/2013. 2 Freescale Semiconductor, Inc.