Document Number: K21P80M50SF4 Freescale Semiconductor Rev. 4.1, 08/2013 Data Sheet: Technical Data K21P80M50SF4 K21 Sub-Family Supports the following: MK21DX128VLK5, MK21DX256VLK5, MK21DN512VLK5 Features Security and integrity modules Operating Characteristics Hardware CRC module to support fast cyclic Voltage range: 1.71 to 3.6 V redundancy checks Flash write voltage range: 1.71 to 3.6 V Tamper detect and secure storage Temperature range (ambient): -40 to 105C Hardware random-number generator Hardware encryption supporting DES, 3DES, AES, Performance MD5, SHA-1, and SHA-256 algorithms Up to 50 MHz ARM Cortex-M4 core with DSP 128-bit unique identification (ID) number per chip instructions delivering 1.25 Dhrystone MIPS per MHz Human-machine interface General-purpose input/output Memories and memory interfaces Up to 512 KB of program flash for devices without Analog modules FlexNVM. 16-bit SAR ADC Up to 256 KB program flash for devices with Two analog comparators (CMP) containing a 6-bit FlexNVM. DAC and programmable reference input 64 KB FlexNVM on FlexMemory devices Timers 4 KB FlexRAM on FlexMemory devices Programmable delay block Up to 64 KB RAM Eight-channel motor control/general purpose/PWM Serial programming interface (EzPort) timer Clocks Two 2-channel general purpose timers, one with 3 to 32 MHz crystal oscillator quadrature decoder functionality 32 kHz crystal oscillator Periodic interrupt timers Multi-purpose clock generator 16-bit low-power timer Carrier modulator transmitter System peripherals Real-time clock Multiple low-power modes to provide power optimization based on application requirements Communication interfaces 16-channel DMA controller, supporting up to 63 USB full-/low-speed On-the-Go controller with on- request sources chip transceiver External watchdog monitor USB Device Charger detect Software watchdog Two SPI modules Low-leakage wakeup unit Two I2C modules Four UART modules I2S module Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 20122013 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................3 5.4.1 Thermal operating requirements...........................21 1.1 Determining valid orderable parts......................................3 5.4.2 Thermal attributes.................................................21 2 Part identification......................................................................3 6 Peripheral operating requirements and behaviors....................22 2.1 Description.........................................................................3 6.1 Core modules....................................................................22 2.2 Format...............................................................................3 6.1.1 JTAG electricals....................................................22 2.3 Fields.................................................................................3 6.2 System modules................................................................25 2.4 Example............................................................................4 6.3 Clock modules...................................................................25 2.5 Small package marking.....................................................4 6.3.1 MCG specifications...............................................25 3 Terminology and guidelines......................................................5 6.3.2 Oscillator electrical specifications.........................27 3.1 Definition: Operating requirement......................................5 6.3.3 32 kHz oscillator electrical characteristics.............30 3.2 Definition: Operating behavior...........................................5 6.4 Memories and memory interfaces.....................................30 3.3 Definition: Attribute............................................................6 6.4.1 Flash electrical specifications................................30 3.4 Definition: Rating...............................................................6 6.4.2 EzPort switching specifications.............................33 3.5 Result of exceeding a rating..............................................7 6.5 Security and integrity modules..........................................34 3.6 Relationship between ratings and operating 6.5.1 DryIce Tamper Electrical Specifications................34 requirements......................................................................7 6.6 Analog...............................................................................35 3.7 Guidelines for ratings and operating requirements............8 6.6.1 ADC electrical specifications.................................35 3.8 Definition: Typical value.....................................................8 6.6.2 CMP and 6-bit DAC electrical specifications.........39 3.9 Typical value conditions....................................................9 6.7 Timers................................................................................42 4 Ratings......................................................................................9 6.8 Communication interfaces.................................................42 4.1 Thermal handling ratings...................................................9 6.8.1 USB electrical specifications.................................42 4.2 Moisture handling ratings..................................................10 6.8.2 USB DCD electrical specifications........................42 4.3 ESD handling ratings.........................................................10 6.8.3 VREG electrical specifications..............................43 4.4 Voltage and current operating ratings...............................10 6.8.4 DSPI switching specifications (limited voltage 5 General.....................................................................................10 range)....................................................................43 5.1 AC electrical characteristics..............................................11 6.8.5 DSPI switching specifications (full voltage range).45 5.2 Nonswitching electrical specifications...............................11 6.8.6 I2C switching specifications..................................47 5.2.1 Voltage and current operating requirements.........11 6.8.7 UART switching specifications..............................47 5.2.2 LVD and POR operating requirements.................12 6.8.8 Normal Run, Wait and Stop mode performance 5.2.3 Voltage and current operating behaviors..............13 over the full operating voltage range.....................47 5.2.4 Power mode transition operating behaviors..........13 6.8.9 VLPR, VLPW, and VLPS mode performance 5.2.5 Power consumption operating behaviors..............14 over the full operating voltage range.....................49 5.2.6 EMC radiated emissions operating behaviors.......18 7 Dimensions...............................................................................51 5.2.7 Designing with radiated emissions in mind...........19 7.1 Obtaining package dimensions.........................................51 5.2.8 Capacitance attributes..........................................19 8 Pinout........................................................................................51 5.3 Switching specifications.....................................................19 8.1 K21 Signal Multiplexing and Pin Assignments..................51 5.3.1 Device clock specifications...................................19 8.2 K21 Pinouts.......................................................................54 5.3.2 General switching specifications...........................20 9 Revision History........................................................................56 5.4 Thermal specifications.......................................................21 K21 Sub-Family Data Sheet, Rev. 4.1, 08/2013. 2 Freescale Semiconductor, Inc.