Document Number: K21P121M50SF4 Freescale Semiconductor Rev. 4, 08/2013 Data Sheet: Technical Data K21P121M50SF4 K21 Sub-Family Supports the following: MK21DX128VMC5, MK21DX256VMC5, MK21DN512VMC5 Features Security and integrity modules Operating Characteristics Hardware CRC module to support fast cyclic Voltage range: 1.71 to 3.6 V redundancy checks Flash write voltage range: 1.71 to 3.6 V Tamper detect and secure storage Temperature range (ambient): -40 to 105C Hardware random-number generator Hardware encryption supporting DES, 3DES, AES, Performance MD5, SHA-1, and SHA-256 algorithms Up to 50 MHz ARM Cortex-M4 core with DSP 128-bit unique identification (ID) number per chip instructions delivering 1.25 Dhrystone MIPS per MHz Human-machine interface General-purpose input/output Memories and memory interfaces Up to 512 KB of program flash for devices without Analog modules FlexNVM. 16-bit SAR ADC Up to 256 KB program flash for devices with 12-bit DAC FlexNVM. Two analog comparators (CMP) containing a 6-bit 64 KB FlexNVM on FlexMemory devices DAC and programmable reference input 4 KB FlexRAM on FlexMemory devices Timers Up to 64 KB RAM Programmable delay block Serial programming interface (EzPort) Eight-channel motor control/general purpose/PWM Clocks timer 3 to 32 MHz crystal oscillator Two 2-channel general purpose timers, one with 32 kHz crystal oscillator quadrature decoder functionality Multi-purpose clock generator Periodic interrupt timers 16-bit low-power timer System peripherals Carrier modulator transmitter Multiple low-power modes to provide power Real-time clock optimization based on application requirements 16-channel DMA controller, supporting up to 63 Communication interfaces request sources USB full-/low-speed On-the-Go controller with on- External watchdog monitor chip transceiver Software watchdog USB Device Charger detect Low-leakage wakeup unit Two SPI modules Two I2C modules Four UART modules I2S module Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 20122013 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................3 5.4.1 Thermal operating requirements...........................21 1.1 Determining valid orderable parts......................................3 5.4.2 Thermal attributes.................................................21 2 Part identification......................................................................3 6 Peripheral operating requirements and behaviors....................22 2.1 Description.........................................................................3 6.1 Core modules....................................................................22 2.2 Format...............................................................................3 6.1.1 JTAG electricals....................................................22 2.3 Fields.................................................................................3 6.2 System modules................................................................25 2.4 Example............................................................................4 6.3 Clock modules...................................................................25 2.5 Small package marking.....................................................4 6.3.1 MCG specifications...............................................25 3 Terminology and guidelines......................................................5 6.3.2 Oscillator electrical specifications.........................27 3.1 Definition: Operating requirement......................................5 6.3.3 32 kHz oscillator electrical characteristics.............30 3.2 Definition: Operating behavior...........................................5 6.4 Memories and memory interfaces.....................................30 3.3 Definition: Attribute............................................................6 6.4.1 Flash electrical specifications................................30 3.4 Definition: Rating...............................................................6 6.4.2 EzPort switching specifications.............................33 3.5 Result of exceeding a rating..............................................7 6.5 Security and integrity modules..........................................34 3.6 Relationship between ratings and operating 6.5.1 DryIce Tamper Electrical Specifications................34 requirements......................................................................7 6.6 Analog...............................................................................35 3.7 Guidelines for ratings and operating requirements............8 6.6.1 ADC electrical specifications.................................35 3.8 Definition: Typical value.....................................................8 6.6.2 CMP and 6-bit DAC electrical specifications.........39 3.9 Typical value conditions....................................................9 6.6.3 12-bit DAC electrical characteristics.....................42 4 Ratings......................................................................................9 6.7 Timers................................................................................45 4.1 Thermal handling ratings...................................................9 6.8 Communication interfaces.................................................45 4.2 Moisture handling ratings..................................................10 6.8.1 USB electrical specifications.................................45 4.3 ESD handling ratings.........................................................10 6.8.2 USB DCD electrical specifications........................45 4.4 Voltage and current operating ratings...............................10 6.8.3 VREG electrical specifications..............................46 5 General.....................................................................................10 6.8.4 DSPI switching specifications (limited voltage 5.1 AC electrical characteristics..............................................11 range)....................................................................46 5.2 Nonswitching electrical specifications...............................11 6.8.5 DSPI switching specifications (full voltage range).48 5.2.1 Voltage and current operating requirements.........11 6.8.6 I2C switching specifications..................................50 5.2.2 LVD and POR operating requirements.................12 6.8.7 UART switching specifications..............................50 5.2.3 Voltage and current operating behaviors..............13 6.8.8 Normal Run, Wait and Stop mode performance 5.2.4 Power mode transition operating behaviors..........13 over the full operating voltage range.....................50 5.2.5 Power consumption operating behaviors..............14 6.8.9 VLPR, VLPW, and VLPS mode performance 5.2.6 EMC radiated emissions operating behaviors.......18 over the full operating voltage range.....................52 5.2.7 Designing with radiated emissions in mind...........19 7 Dimensions...............................................................................54 5.2.8 Capacitance attributes..........................................19 7.1 Obtaining package dimensions.........................................54 5.3 Switching specifications.....................................................19 8 Pinout........................................................................................54 5.3.1 Device clock specifications...................................19 8.1 K21 Signal Multiplexing and Pin Assignments..................54 5.3.2 General switching specifications...........................20 8.2 K21 Pinouts.......................................................................59 5.4 Thermal specifications.......................................................21 9 Revision History........................................................................60 K21 Sub-Family Data Sheet, Rev. 4, 08/2013. 2 Freescale Semiconductor, Inc.