Document Number: K22P48M50SF4 Freescale Semiconductor Rev. 4, 08/2013 Data Sheet: Technical Data K22P48M50SF4 K22 Sub-Family Supports the following: MK22DX128VLF5, MK22DX256VLF5 Features Human-machine interface Operating Characteristics General-purpose input/output Voltage range: 1.71 to 3.6 V Analog modules Flash write voltage range: 1.71 to 3.6 V 16-bit SAR ADC Temperature range (ambient): -40 to 105C Two analog comparators (CMP) containing a 6-bit Performance DAC and programmable reference input Up to 50 MHz ARM Cortex-M4 core with DSP Voltage reference instructions delivering 1.25 Dhrystone MIPS per Timers MHz Programmable delay block Memories and memory interfaces Eight-channel motor control/general purpose/PWM Up to 256 KB program flash for devices with timer FlexNVM. Two 2-channel general purpose timers, one with 64 KB FlexNVM on FlexMemory devices quadrature decoder functionality 4 KB FlexRAM on FlexMemory devices Periodic interrupt timers Up to 64 KB RAM 16-bit low-power timer Serial programming interface (EzPort) Carrier modulator transmitter Real-time clock Clocks 3 to 32 MHz crystal oscillator Communication interfaces 32 kHz crystal oscillator USB full-/low-speed On-the-Go controller with on- Multi-purpose clock generator chip transceiver USB Device Charger detect System peripherals SPI module Multiple low-power modes to provide power I2C module optimization based on application requirements Four UART modules 16-channel DMA controller, supporting up to 63 I2S module request sources External watchdog monitor Software watchdog Low-leakage wakeup unit Security and integrity modules Hardware CRC module to support fast cyclic redundancy checks 128-bit unique identification (ID) number per chip Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 20122013 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................3 5.4.1 Thermal operating requirements...........................21 1.1 Determining valid orderable parts......................................3 5.4.2 Thermal attributes.................................................21 2 Part identification......................................................................3 6 Peripheral operating requirements and behaviors....................22 2.1 Description.........................................................................3 6.1 Core modules....................................................................22 2.2 Format...............................................................................3 6.1.1 JTAG electricals....................................................22 2.3 Fields.................................................................................3 6.2 System modules................................................................25 2.4 Example............................................................................4 6.3 Clock modules...................................................................25 2.5 Small package marking.....................................................4 6.3.1 MCG specifications...............................................25 3 Terminology and guidelines......................................................5 6.3.2 Oscillator electrical specifications.........................27 3.1 Definition: Operating requirement......................................5 6.3.3 32 kHz oscillator electrical characteristics.............30 3.2 Definition: Operating behavior...........................................5 6.4 Memories and memory interfaces.....................................30 3.3 Definition: Attribute............................................................6 6.4.1 Flash electrical specifications................................30 3.4 Definition: Rating...............................................................6 6.4.2 EzPort switching specifications.............................33 3.5 Result of exceeding a rating..............................................7 6.5 Security and integrity modules..........................................34 3.6 Relationship between ratings and operating 6.6 Analog...............................................................................34 requirements......................................................................7 6.6.1 ADC electrical specifications.................................35 3.7 Guidelines for ratings and operating requirements............8 6.6.2 CMP and 6-bit DAC electrical specifications.........39 3.8 Definition: Typical value.....................................................8 6.6.3 Voltage reference electrical specifications............41 3.9 Typical value conditions....................................................9 6.7 Timers................................................................................42 4 Ratings......................................................................................9 6.8 Communication interfaces.................................................42 4.1 Thermal handling ratings...................................................9 6.8.1 USB electrical specifications.................................42 4.2 Moisture handling ratings..................................................10 6.8.2 USB DCD electrical specifications........................43 4.3 ESD handling ratings.........................................................10 6.8.3 VREG electrical specifications..............................43 4.4 Voltage and current operating ratings...............................10 6.8.4 DSPI switching specifications (limited voltage 5 General.....................................................................................10 range)....................................................................43 5.1 AC electrical characteristics..............................................11 6.8.5 DSPI switching specifications (full voltage range).45 5.2 Nonswitching electrical specifications...............................11 6.8.6 I2C switching specifications..................................47 5.2.1 Voltage and current operating requirements.........11 6.8.7 UART switching specifications..............................47 5.2.2 LVD and POR operating requirements.................12 6.8.8 Normal Run, Wait and Stop mode performance 5.2.3 Voltage and current operating behaviors..............13 over the full operating voltage range.....................47 5.2.4 Power mode transition operating behaviors..........13 6.8.9 VLPR, VLPW, and VLPS mode performance 5.2.5 Power consumption operating behaviors..............14 over the full operating voltage range.....................49 5.2.6 EMC radiated emissions operating behaviors.......18 7 Dimensions...............................................................................51 5.2.7 Designing with radiated emissions in mind...........19 7.1 Obtaining package dimensions.........................................51 5.2.8 Capacitance attributes..........................................19 8 Pinout........................................................................................51 5.3 Switching specifications.....................................................19 8.1 K22 Signal Multiplexing and Pin Assignments..................51 5.3.1 Device clock specifications...................................19 8.2 K22 Pinouts.......................................................................54 5.3.2 General switching specifications...........................20 9 Revision History........................................................................55 5.4 Thermal specifications.......................................................21 K22 Sub-Family Data Sheet, Rev. 4, 08/2013. 2 Freescale Semiconductor, Inc.