Document Number: K22P80M50SF4 Freescale Semiconductor Rev. 4.1, 08/2013 Data Sheet: Technical Data K22P80M50SF4 K22 Sub-Family Supports the following: MK22DX128VLK5, MK22DX256VLK5, MK22DN512VLK5 Features Security and integrity modules Operating Characteristics Hardware CRC module to support fast cyclic Voltage range: 1.71 to 3.6 V redundancy checks Flash write voltage range: 1.71 to 3.6 V 128-bit unique identification (ID) number per chip Temperature range (ambient): -40 to 105C Human-machine interface Performance General-purpose input/output Up to 50 MHz ARM Cortex-M4 core with DSP Analog modules instructions delivering 1.25 Dhrystone MIPS per 16-bit SAR ADC MHz 12-bit DAC Memories and memory interfaces Two analog comparators (CMP) containing a 6-bit Up to 512 KB of program flash for devices without DAC and programmable reference input FlexNVM. Voltage reference Up to 256 KB program flash for devices with Timers FlexNVM. Programmable delay block 64 KB FlexNVM on FlexMemory devices Eight-channel motor control/general purpose/PWM 4 KB FlexRAM on FlexMemory devices timer Up to 64 KB RAM Two 2-channel general purpose timers, one with Serial programming interface (EzPort) quadrature decoder functionality Clocks Periodic interrupt timers 3 to 32 MHz crystal oscillator 16-bit low-power timer 32 kHz crystal oscillator Carrier modulator transmitter Multi-purpose clock generator Real-time clock System peripherals Communication interfaces Multiple low-power modes to provide power USB full-/low-speed On-the-Go controller with on- optimization based on application requirements chip transceiver 16-channel DMA controller, supporting up to 63 USB Device Charger detect request sources Two SPI modules External watchdog monitor Two I2C modules Software watchdog Four UART modules Low-leakage wakeup unit I2S module Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 20122013 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................3 5.4.1 Thermal operating requirements...........................21 1.1 Determining valid orderable parts......................................3 5.4.2 Thermal attributes.................................................21 2 Part identification......................................................................3 6 Peripheral operating requirements and behaviors....................22 2.1 Description.........................................................................3 6.1 Core modules....................................................................22 2.2 Format...............................................................................3 6.1.1 JTAG electricals....................................................22 2.3 Fields.................................................................................3 6.2 System modules................................................................25 2.4 Example............................................................................4 6.3 Clock modules...................................................................25 2.5 Small package marking.....................................................4 6.3.1 MCG specifications...............................................25 3 Terminology and guidelines......................................................5 6.3.2 Oscillator electrical specifications.........................27 3.1 Definition: Operating requirement......................................5 6.3.3 32 kHz oscillator electrical characteristics.............30 3.2 Definition: Operating behavior...........................................5 6.4 Memories and memory interfaces.....................................30 3.3 Definition: Attribute............................................................6 6.4.1 Flash electrical specifications................................30 3.4 Definition: Rating...............................................................6 6.4.2 EzPort switching specifications.............................33 3.5 Result of exceeding a rating..............................................7 6.5 Security and integrity modules..........................................34 3.6 Relationship between ratings and operating 6.6 Analog...............................................................................34 requirements......................................................................7 6.6.1 ADC electrical specifications.................................35 3.7 Guidelines for ratings and operating requirements............8 6.6.2 CMP and 6-bit DAC electrical specifications.........39 3.8 Definition: Typical value.....................................................8 6.6.3 12-bit DAC electrical characteristics.....................41 3.9 Typical value conditions....................................................9 6.6.4 Voltage reference electrical specifications............44 4 Ratings......................................................................................9 6.7 Timers................................................................................45 4.1 Thermal handling ratings...................................................9 6.8 Communication interfaces.................................................45 4.2 Moisture handling ratings..................................................10 6.8.1 USB electrical specifications.................................45 4.3 ESD handling ratings.........................................................10 6.8.2 USB DCD electrical specifications........................46 4.4 Voltage and current operating ratings...............................10 6.8.3 VREG electrical specifications..............................46 5 General.....................................................................................10 6.8.4 DSPI switching specifications (limited voltage 5.1 AC electrical characteristics..............................................11 range)....................................................................47 5.2 Nonswitching electrical specifications...............................11 6.8.5 DSPI switching specifications (full voltage range).48 5.2.1 Voltage and current operating requirements.........11 6.8.6 I2C switching specifications..................................50 5.2.2 LVD and POR operating requirements.................12 6.8.7 UART switching specifications..............................50 5.2.3 Voltage and current operating behaviors..............13 6.8.8 Normal Run, Wait and Stop mode performance 5.2.4 Power mode transition operating behaviors..........13 over the full operating voltage range.....................50 5.2.5 Power consumption operating behaviors..............14 6.8.9 VLPR, VLPW, and VLPS mode performance 5.2.6 EMC radiated emissions operating behaviors.......18 over the full operating voltage range.....................52 5.2.7 Designing with radiated emissions in mind...........19 7 Dimensions...............................................................................54 5.2.8 Capacitance attributes..........................................19 7.1 Obtaining package dimensions.........................................54 5.3 Switching specifications.....................................................19 8 Pinout........................................................................................54 5.3.1 Device clock specifications...................................19 8.1 K22 Signal Multiplexing and Pin Assignments..................54 5.3.2 General switching specifications...........................20 8.2 K22 Pinouts.......................................................................58 5.4 Thermal specifications.......................................................21 9 Revision History........................................................................59 K22 Sub-Family Data Sheet, Rev. 4.1, 08/2013. 2 Freescale Semiconductor, Inc.