NXP Semiconductors K27P169M150SF5 Data Sheet: Technical Data Rev. 1, 03/2017 Kinetis K27F MCU Sub-Family MK27FN2M0VMI15 High performance ARM Cortex-M4 MCU with 2 MB Flash, 1 MB SRAM, 2 USB Controllers (High-Speed and Full- Speed), SDRAM controller, QuadSPI interface and integrated Power Management Controller . K27F extends the Kinetis Micontroller portfolio with large embedded memory, advanced external memory interfaces, performance, and peripheral integration while maintaining a high level of software compatibility with previous Kinetis devices: The extended memory resources include a total of 2 MB of programmable flash and 1 MB of embedded SRAM which can be used to support application needs for data logging 169 MAPBGA (MI) and rich human to machine interfaces with displays 9 x 9 x 1.28 mm Pitch 0.65 mm K27F enables memory expansion leveraging the SDRAM controller and QuadSPI interface for eXecution-In-Place (XIP) from an external Serial NOR flash Both the USB High-Speed and Crystal-less Full-Speed Controllers integrate a PHY to reduce BOM cost The integrated smart peripherals such as Low-power UARTs and Timers operate in very low-power modes to optimize battery life of the system K27F leverages a standard MCU topology with a single input supply voltage ranging from 1.71V to 3.6V and an independant VBAT domain Performance Human-machine interface Up to 150 MHz ARM Cortex-M4 based core with DSP Up to 120 General-purpose input/output (GPIOs) instructions and Single Precision Floating Point unit Analog modules (FPU) Integrated Power Management Control (PMC) Memories and memory expansion One 16-bit SAR ADCs, two 6-bit DAC and one 12-bit 2 MB dual bank program flash and 1 MB SRAM DAC 8 KB I/D + 8 KB System cache Two analog comparators (CMP) containing a 6-bit 32-bit external bus interface (FlexBus) DAC and programmable reference input 32-bit SDRAM controller 1.2 V Voltage reference Dual QuadSPI interface with eXecution-In-Place (XIP) Timers supports SDR and DDR serial flash and octal One 4-ch 32-bit Periodic interrupt timer configurations Two 16-bit low-power timer PWM modules 32 KB Boot ROM with built-in bootloader Two 8-ch motor control/general purpose/PWM timers System and Clocks Two 2-ch quadrature decoder/general purpose timers 32-ch Asynchronous DMA Real-time clock with independent 3.6 V power domain Multiple low-power modes Programmable delay block Memory protection unit with multi-master protection Operating Characteristics 3 to 32 MHz main crystal oscillator Temperature range (ambient): -40 to 105C (BGA) 32 kHz low power crystal oscillator Main V Voltage and Flash write voltage range:1.71 48 MHz internal reference DD V3.6 V Hardware and Software Watchdogs Independent V (QuadSPI):1.71 V3.6 V DDIO E NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Security Independent V (RTC): 1.71 V3.6 V BAT Hardware random-number generator I/O Voltage range (V ): 1.71 V3.6 V DD Memory Mapped Crypto Acceleration Unit(MMCAU): Communication interfaces DES, 3-DES, AES, SHA-1, SHA-256 and MD5 Two USB controllers:Crystal-less Full-/low-speed + accelerator transceiver Host and Device High-/Full-/low-speed + Cyclic Redundancy Check (CRC) PHY Host and Device Target Applications Secure Digital Host Controller (SDHC) Wearables Two I2S modules, four I2C modules and five Low- Low-end graphic display system Power UART modules Cost-optimized multi-standard wireless smart home Four SPI modules (SPI3 supports more than 40 hubs Mbps) Home Automation devices 32-ch Programmable module (FlexIO) to emulate Consumer accessories various serial, parallel or custom interfaces Ordering Information 1 Part Number Embedded Memory Package Type Maximum number of I O s Flash SRAM MK27FN2M0VMI15 2 MB 1 MB 169 MAPBGA 120 1. To confirm current availability of orderable part numbers, go to