Document Number: K40P100M100SF2 Freescale Semiconductor Rev. 7, 02/2013 Data Sheet: Technical Data K40P100M100SF2 K40 Sub-Family Data Sheet Supports the following: MK40DN512ZVLL10 Features Human-machine interface Operating Characteristics Segment LCD controller supporting up to 40 Voltage range: 1.71 to 3.6 V frontplanes and 8 backplanes, or 44 frontplanes and Flash write voltage range: 1.71 to 3.6 V 4 backplanes, depending on the package size Temperature range (ambient): -40 to 105C Low-power hardware touch sensor interface (TSI) General-purpose input/output Performance Up to 100 MHz ARM Cortex-M4 core with DSP Analog modules instructions delivering 1.25 Dhrystone MIPS per Two 16-bit SAR ADCs MHz Programmable gain amplifier (PGA) (up to x64) integrated into each ADC Memories and memory interfaces 12-bit DAC Up to 512 KB program flash memory on non- Three analog comparators (CMP) containing a 6-bit FlexMemory devices DAC and programmable reference input Up to 128 KB RAM Voltage reference Serial programming interface (EzPort) Timers Clocks Programmable delay block 3 to 32 MHz crystal oscillator Eight-channel motor control/general purpose/PWM 32 kHz crystal oscillator timer Multi-purpose clock generator Two 2-channel quadrature decoder/general purpose timers System peripherals Periodic interrupt timers Multiple low-power modes to provide power 16-bit low-power timer optimization based on application requirements Carrier modulator transmitter Memory protection unit with multi-master Real-time clock protection 16-channel DMA controller, supporting up to 63 Communication interfaces request sources USB full-/low-speed On-the-Go controller with on- External watchdog monitor chip transceiver Software watchdog Two Controller Area Network (CAN) modules Low-leakage wakeup unit Three SPI modules Two I2C modules Security and integrity modules Five UART modules Hardware CRC module to support fast cyclic Secure Digital host controller (SDHC) redundancy checks I2S module 128-bit unique identification (ID) number per chip Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 20112013 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................4 6 Peripheral operating requirements and behaviors....................23 1.1 Determining valid orderable parts......................................4 6.1 Core modules....................................................................23 2 Part identification......................................................................4 6.1.1 Debug trace timing specifications.......................23 2.1 Description.........................................................................4 6.1.2 JTAG electricals..................................................23 2.2 Format...............................................................................4 6.2 System modules................................................................26 2.3 Fields.................................................................................4 6.3 Clock modules...................................................................26 2.4 Example............................................................................5 6.3.1 MCG specifications.............................................26 3 Terminology and guidelines......................................................5 6.3.2 Oscillator electrical specifications.......................28 3.1 Definition: Operating requirement......................................5 6.3.3 32 kHz Oscillator Electrical Characteristics........31 3.2 Definition: Operating behavior...........................................6 6.4 Memories and memory interfaces.....................................31 3.3 Definition: Attribute............................................................6 6.4.1 Flash electrical specifications.............................31 3.4 Definition: Rating...............................................................7 6.4.2 EzPort Switching Specifications.........................33 3.5 Result of exceeding a rating..............................................7 6.5 Security and integrity modules..........................................34 3.6 Relationship between ratings and operating 6.6 Analog...............................................................................34 requirements......................................................................7 6.6.1 ADC electrical specifications..............................34 3.7 Guidelines for ratings and operating requirements............8 6.6.2 CMP and 6-bit DAC electrical specifications......42 3.8 Definition: Typical value.....................................................8 6.6.3 12-bit DAC electrical characteristics...................44 3.9 Typical value conditions....................................................9 6.6.4 Voltage reference electrical specifications..........47 4 Ratings......................................................................................10 6.7 Timers................................................................................48 4.1 Thermal handling ratings...................................................10 6.8 Communication interfaces.................................................48 4.2 Moisture handling ratings..................................................10 6.8.1 USB electrical specifications...............................48 4.3 ESD handling ratings.........................................................10 6.8.2 USB DCD electrical specifications......................49 4.4 Voltage and current operating ratings...............................10 6.8.3 USB VREG electrical specifications...................49 5 General.....................................................................................11 6.8.4 CAN switching specifications..............................50 5.1 AC electrical characteristics..............................................11 6.8.5 DSPI switching specifications (limited voltage 5.2 Nonswitching electrical specifications...............................11 range).................................................................50 5.2.1 Voltage and current operating requirements......12 6.8.6 DSPI switching specifications (full voltage 5.2.2 LVD and POR operating requirements...............13 range).................................................................51 5.2.3 Voltage and current operating behaviors............13 6.8.7 Inter-Integrated Circuit Interface (I2C) timing.....53 5.2.4 Power mode transition operating behaviors.......15 6.8.8 UART switching specifications............................54 5.2.5 Power consumption operating behaviors............16 6.8.9 SDHC specifications...........................................54 5.2.6 EMC radiated emissions operating behaviors....19 6.8.10 I2S switching specifications................................55 5.2.7 Designing with radiated emissions in mind.........20 6.9 Human-machine interfaces (HMI)......................................58 5.2.8 Capacitance attributes........................................20 6.9.1 TSI electrical specifications................................58 5.3 Switching specifications.....................................................20 6.9.2 LCD electrical characteristics.............................59 5.3.1 Device clock specifications.................................20 7 Dimensions...............................................................................60 5.3.2 General switching specifications.........................20 7.1 Obtaining package dimensions.........................................60 5.4 Thermal specifications.......................................................21 8 Pinout........................................................................................60 5.4.1 Thermal operating requirements.........................21 8.1 K40 Signal Multiplexing and Pin Assignments..................60 5.4.2 Thermal attributes...............................................22 8.2 K40 Pinouts.......................................................................64 K40 Sub-Family Data Sheet Data Sheet, Rev. 7, 02/2013. 2 Freescale Semiconductor, Inc.