MK50DX256ZCLL10 NXP

Document Number: K50P100M100SF2 Freescale Semiconductor Rev. 7, 02/2013 Data Sheet: Technical Data K50P100M100SF2 K50 Sub-Family Data Sheet Supports the following: MK50DX256ZCLL10, MK50DN512ZCLL10 Features Human-machine interface Operating Characteristics Low-power hardware touch sensor interface (TSI) Voltage range: 1.71 to 3.6 V General-purpose input/output Flash write voltage range: 1.71 to 3.6 V Analog modules Temperature range (ambient): -40 to 85C Two 16-bit SAR ADCs Performance Programmable gain amplifier (PGA) (up to x64) Up to 100 MHz ARM Cortex-M4 core with DSP integrated into each ADC instructions delivering 1.25 Dhrystone MIPS per Two 12-bit DACs MHz Two operational amplifiers Two transimpedance amplifiers Memories and memory interfaces Three analog comparators (CMP) containing a 6-bit Up to 512 KB program flash memory on non- DAC and programmable reference input FlexMemory devices Voltage reference Up to 128 KB RAM Serial programming interface (EzPort) Timers FlexBus external bus interface Programmable delay block Eight-channel motor control/general purpose/PWM Clocks timer 3 to 32 MHz crystal oscillator Two 2-channel quadrature decoder/general purpose 32 kHz crystal oscillator timers Multi-purpose clock generator Periodic interrupt timers 16-bit low-power timer System peripherals Carrier modulator transmitter Multiple low-power modes to provide power Real-time clock optimization based on application requirements Memory protection unit with multi-master Communication interfaces protection USB full-/low-speed On-the-Go controller with on- 16-channel DMA controller, supporting up to 63 chip transceiver request sources Three SPI modules External watchdog monitor Two I2C modules Software watchdog Five UART modules Low-leakage wakeup unit Secure Digital host controller (SDHC) I2S module Security and integrity modules Hardware CRC module to support fast cyclic redundancy checks 128-bit unique identification (ID) number per chip Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 20112013 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................4 6 Peripheral operating requirements and behaviors....................23 1.1 Determining valid orderable parts......................................4 6.1 Core modules....................................................................23 2 Part identification......................................................................4 6.1.1 Debug trace timing specifications.........................23 2.1 Description.........................................................................4 6.1.2 JTAG electricals....................................................23 2.2 Format...............................................................................4 6.2 System modules................................................................26 2.3 Fields.................................................................................4 6.3 Clock modules...................................................................26 2.4 Example............................................................................5 6.3.1 MCG specifications...............................................26 3 Terminology and guidelines......................................................5 6.3.2 Oscillator electrical specifications.........................28 3.1 Definition: Operating requirement......................................5 6.3.3 32 kHz Oscillator Electrical Characteristics...........31 3.2 Definition: Operating behavior...........................................6 6.4 Memories and memory interfaces.....................................31 3.3 Definition: Attribute............................................................6 6.4.1 Flash electrical specifications................................31 3.4 Definition: Rating...............................................................7 6.4.2 EzPort Switching Specifications............................33 3.5 Result of exceeding a rating..............................................7 6.4.3 Flexbus Switching Specifications..........................34 3.6 Relationship between ratings and operating 6.5 Security and integrity modules..........................................37 requirements......................................................................7 6.6 Analog...............................................................................37 3.7 Guidelines for ratings and operating requirements............8 6.6.1 ADC electrical specifications.................................37 3.8 Definition: Typical value.....................................................8 6.6.2 CMP and 6-bit DAC electrical specifications.........45 3.9 Typical value conditions....................................................9 6.6.3 12-bit DAC electrical characteristics.....................47 4 Ratings......................................................................................10 6.6.4 Op-amp electrical specifications...........................50 4.1 Thermal handling ratings...................................................10 6.6.5 Transimpedance amplifier electrical 4.2 Moisture handling ratings..................................................10 specifications full range....................................51 4.3 ESD handling ratings.........................................................10 6.6.6 Transimpedance amplifier electrical 4.4 Voltage and current operating ratings...............................10 specifications limited range..............................52 5 General.....................................................................................11 6.6.7 Voltage reference electrical specifications............53 5.1 AC electrical characteristics..............................................11 6.7 Timers................................................................................54 5.2 Nonswitching electrical specifications...............................11 6.8 Communication interfaces.................................................54 5.2.1 Voltage and current operating requirements.........12 6.8.1 USB electrical specifications.................................54 5.2.2 LVD and POR operating requirements.................13 6.8.2 USB DCD electrical specifications........................55 5.2.3 Voltage and current operating behaviors..............13 6.8.3 USB VREG electrical specifications......................55 5.2.4 Power mode transition operating behaviors..........15 6.8.4 DSPI switching specifications (limited voltage 5.2.5 Power consumption operating behaviors..............16 range)....................................................................55 5.2.6 EMC radiated emissions operating behaviors.......19 6.8.5 DSPI switching specifications (full voltage range).57 5.2.7 Designing with radiated emissions in mind...........20 6.8.6 Inter-Integrated Circuit Interface (I2C) timing........59 5.2.8 Capacitance attributes..........................................20 6.8.7 UART switching specifications..............................60 5.3 Switching specifications.....................................................20 6.8.8 SDHC specifications.............................................60 5.3.1 Device clock specifications...................................20 6.8.9 I2S switching specifications..................................61 5.3.2 General switching specifications...........................20 6.9 Human-machine interfaces (HMI)......................................64 5.4 Thermal specifications.......................................................21 6.9.1 TSI electrical specifications...................................64 5.4.1 Thermal operating requirements...........................21 7 Dimensions...............................................................................65 5.4.2 Thermal attributes.................................................22 7.1 Obtaining package dimensions.........................................65 K50 Sub-Family Data Sheet Data Sheet, Rev. 7, 02/2013. 2 Freescale Semiconductor, Inc.