Document Number: K51P100M100SF2V2 Freescale Semiconductor Rev. 3, 6/2013 Data Sheet: Technical Data K51P100M100SF2V2 K51 Sub-Family Supports the following: MK51DX256CLL10, MK51DN512CLL10 Features Human-machine interface Operating Characteristics Segment LCD controller supporting up to 40 Voltage range: 1.71 to 3.6 V frontplanes and 8 backplanes, or 44 frontplanes and Flash write voltage range: 1.71 to 3.6 V 4 backplanes, depending on the package size Temperature range (ambient): -40 to 85C Low-power hardware touch sensor interface (TSI) General-purpose input/output Performance Up to 100 MHz ARM Cortex-M4 core with DSP Analog modules instructions delivering 1.25 Dhrystone MIPS per Two 16-bit SAR ADCs MHz Programmable gain amplifier (PGA) (up to x64) integrated into each ADC Memories and memory interfaces Two 12-bit DACs Up to 512 KB program flash memory on non- Two operational amplifiers FlexMemory devices Two transimpedance amplifiers Up to 256 KB program flash memory on Three analog comparators (CMP) containing a 6-bit FlexMemory devices DAC and programmable reference input Up to 256 KB FlexNVM on FlexMemory devices Voltage reference 4 KB FlexRAM on FlexMemory devices Up to 128 KB RAM Timers Serial programming interface (EzPort) Programmable delay block Eight-channel motor control/general purpose/PWM Clocks timer 3 to 32 MHz crystal oscillator Two 2-channel quadrature decoder/general purpose 32 kHz crystal oscillator timers Multi-purpose clock generator Periodic interrupt timers 16-bit low-power timer System peripherals Carrier modulator transmitter Multiple low-power modes to provide power Real-time clock optimization based on application requirements Memory protection unit with multi-master Communication interfaces protection USB full-/low-speed On-the-Go controller with on- 16-channel DMA controller, supporting up to 63 chip transceiver request sources Three SPI modules External watchdog monitor Two I2C modules Software watchdog Five UART modules Low-leakage wakeup unit Secure Digital host controller (SDHC) I2S module Security and integrity modules Hardware CRC module to support fast cyclic redundancy checks 128-bit unique identification (ID) number per chip Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 20122013 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................4 6 Peripheral operating requirements and behaviors....................23 1.1 Determining valid orderable parts......................................4 6.1 Core modules....................................................................23 2 Part identification......................................................................4 6.1.1 Debug trace timing specifications.........................23 2.1 Description.........................................................................4 6.1.2 JTAG electricals....................................................24 2.2 Format...............................................................................4 6.2 System modules................................................................27 2.3 Fields.................................................................................4 6.3 Clock modules...................................................................27 2.4 Example............................................................................5 6.3.1 MCG specifications...............................................27 3 Terminology and guidelines......................................................5 6.3.2 Oscillator electrical specifications.........................29 3.1 Definition: Operating requirement......................................5 6.3.3 32 kHz oscillator electrical characteristics.............31 3.2 Definition: Operating behavior...........................................6 6.4 Memories and memory interfaces.....................................32 3.3 Definition: Attribute............................................................6 6.4.1 Flash electrical specifications................................32 3.4 Definition: Rating...............................................................7 6.4.2 EzPort switching specifications.............................37 3.5 Result of exceeding a rating..............................................7 6.5 Security and integrity modules..........................................38 3.6 Relationship between ratings and operating 6.6 Analog...............................................................................38 requirements......................................................................7 6.6.1 ADC electrical specifications.................................38 3.7 Guidelines for ratings and operating requirements............8 6.6.2 CMP and 6-bit DAC electrical specifications.........45 3.8 Definition: Typical value.....................................................8 6.6.3 12-bit DAC electrical characteristics.....................48 3.9 Typical value conditions....................................................9 6.6.4 Op-amp electrical specifications...........................51 4 Ratings......................................................................................10 6.6.5 Transimpedance amplifier electrical 4.1 Thermal handling ratings...................................................10 specifications full range....................................52 4.2 Moisture handling ratings..................................................10 6.6.6 Transimpedance amplifier electrical 4.3 ESD handling ratings.........................................................10 specifications limited range..............................53 4.4 Voltage and current operating ratings...............................10 6.6.7 Voltage reference electrical specifications............54 5 General.....................................................................................11 6.7 Timers................................................................................55 5.1 AC electrical characteristics..............................................11 6.8 Communication interfaces.................................................55 5.2 Nonswitching electrical specifications...............................11 6.8.1 USB electrical specifications.................................55 5.2.1 Voltage and current operating requirements.........12 6.8.2 USB DCD electrical specifications........................56 5.2.2 LVD and POR operating requirements.................13 6.8.3 USB VREG electrical specifications......................56 5.2.3 Voltage and current operating behaviors..............13 6.8.4 DSPI switching specifications (limited voltage 5.2.4 Power mode transition operating behaviors..........15 range)....................................................................56 5.2.5 Power consumption operating behaviors..............16 6.8.5 DSPI switching specifications (full voltage range).58 5.2.6 EMC radiated emissions operating behaviors.......19 6.8.6 Inter-Integrated Circuit Interface (I2C) timing........60 5.2.7 Designing with radiated emissions in mind...........20 6.8.7 UART switching specifications..............................61 5.2.8 Capacitance attributes..........................................20 6.8.8 SDHC specifications.............................................61 5.3 Switching specifications.....................................................20 6.8.9 I2S/SAI switching specifications............................62 5.3.1 Device clock specifications...................................20 6.9 Human-machine interfaces (HMI)......................................68 5.3.2 General switching specifications...........................21 6.9.1 TSI electrical specifications...................................68 5.4 Thermal specifications.......................................................22 6.9.2 LCD electrical characteristics................................69 5.4.1 Thermal operating requirements...........................22 7 Dimensions...............................................................................70 5.4.2 Thermal attributes.................................................22 7.1 Obtaining package dimensions.........................................70 K51 Sub-Family Data Sheet, Rev. 3, 6/2013. 2 Freescale Semiconductor, Inc.