Document Number MKE04P24M48SF0 Freescale Semiconductor Rev 3, 3/2014 Data Sheet: Technical Data MKE04P24M48SF0 KE04 Sub-Family Data Sheet Supports the following: MKE04Z8VTG4(R), MKE04Z8VWJ4(R), and MKE04Z8VFK4(R) Key features Operating characteristics Voltage range: 2.7 to 5.5 V Flash write voltage range: 2.7 to 5.5 V Temperature range (ambient): -40 to 105C Performance Security and integrity modules Up to 48 MHz ARM Cortex-M0+ core 80-bit unique identification (ID) number per chip Single cycle 32-bit x 32-bit multiplier Human-machine interface Single cycle I/O access port Up to 22 general-purpose input/output (GPIO) Memories and memory interfaces Two 8-bit keyboard interrupt modules (KBI) Up to 8 KB flash External interrupt (IRQ) Up to 1 KB RAM Analog modules Clocks One 12-channel 12-bit SAR ADC, operation in Oscillator (OSC) - supports 32.768 kHz crystal Stop mode, optional hardware trigger (ADC) or 4 MHz to 24 MHz crystal or ceramic Two analog comparators containing a 6-bit resonator choice of low power or high gain DAC and programmable reference input oscillators (ACMP) Internal clock source (ICS) - internal FLL with Timers internal or external reference, 37.5 kHz pre- One 6-channel FlexTimer/PWM (FTM) trimmed internal reference for 48 MHz system One 2-channel FlexTimer/PWM (FTM) clock One 2-channel periodic interrupt timer (PIT) Internal 1 kHz low-power oscillator (LPO) One pulse width timer (PWT) System peripherals One real-time clock (RTC) Power management module (PMC) with three Communication interfaces power modes: Run, Wait, Stop One SPI module (SPI) Low-voltage detection (LVD) with reset or One UART module (UART) interrupt, selectable trip points One I2C module (I2C) Watchdog with independent clock source (WDOG) Package options Programmable cyclic redundancy check module 24-pin QFN (CRC) 20-pin SOIC Serial wire debug interface (SWD) 16-pin TSSOP Aliased SRAM bitband region (BIT-BAND) Bit manipulation engine (BME) Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 2013-2014 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................3 5.2.2 FTM module timing...............................................16 1.1 Determining valid orderable parts......................................3 5.3 Thermal specifications.......................................................17 2 Part identification......................................................................3 5.3.1 Thermal characteristics.........................................17 2.1 Description.........................................................................3 6 Peripheral operating requirements and behaviors....................19 2.2 Format...............................................................................3 6.1 Core modules....................................................................19 2.3 Fields.................................................................................3 6.1.1 SWD electricals ....................................................19 2.4 Example............................................................................4 6.2 External oscillator (OSC) and ICS characteristics.............20 3 Parameter classification............................................................4 6.3 NVM specifications............................................................22 4 Ratings......................................................................................4 6.4 Analog...............................................................................23 4.1 Thermal handling ratings...................................................4 6.4.1 ADC characteristics...............................................23 4.2 Moisture handling ratings..................................................5 6.4.2 Analog comparator (ACMP) electricals.................25 4.3 ESD handling ratings.........................................................5 6.5 Communication interfaces.................................................26 4.4 Voltage and current operating ratings...............................5 6.5.1 SPI switching specifications..................................26 5 General.....................................................................................6 7 Dimensions...............................................................................29 5.1 Nonswitching electrical specifications...............................6 7.1 Obtaining package dimensions.........................................29 5.1.1 DC characteristics.................................................6 8 Pinout........................................................................................29 5.1.2 Supply current characteristics...............................13 8.1 Signal Multiplexing and Pin Assignments..........................29 5.1.3 EMC performance.................................................14 8.2 Device pin assignment......................................................31 5.2 Switching specifications.....................................................15 9 Revision history.........................................................................32 5.2.1 Control timing........................................................15 KE04 Sub-Family Data Sheet, Rev3, 3/2014. 2 Freescale Semiconductor, Inc.