Document Number MKE04P24M48SF0 NXP Semiconductors Rev. 5, 04/2020 Data Sheet: Technical Data MKE04P24M48SF0 KE04 Sub-Family Data Sheet Supports the following: MKE04Z8VTG4(R), MKE04Z8VWJ4(R), and MKE04Z8VFK4(R) Key features Security and integrity modules 80-bit unique identification (ID) number per chip Operating characteristics Voltage range: 2.7 to 5.5 V Human-machine interface Flash write voltage range: 2.7 to 5.5 V Up to 22 general-purpose input/output (GPIO) Temperature range (ambient): -40 to 105C Two up to 8-bit keyboard interrupt modules (KBI) External interrupt (IRQ) Performance Up to 48 MHz Arm Cortex-M0+ core Analog modules Single cycle 32-bit x 32-bit multiplier One 12-channel 12-bit SAR ADC, operation in Stop Single cycle I/O access port mode, optional hardware trigger (ADC) Two analog comparators containing a 6-bit DAC Memories and memory interfaces and programmable reference input (ACMP) Up to 8 KB flash Up to 1 KB RAM Timers One 6-channel FlexTimer/PWM (FTM) Clocks One 2-channel FlexTimer/PWM (FTM) Oscillator (OSC) - supports 32.768 kHz crystal or 4 One 2-channel periodic interrupt timer (PIT) MHz to 24 MHz crystal or ceramic resonator choice One pulse width timer (PWT) of low power or high gain oscillators One real-time clock (RTC) Internal clock source (ICS) - internal FLL with internal or external reference, 37.5 kHz pre-trimmed Communication interfaces internal reference for 48 MHz system clock One SPI module (SPI) Internal 1 kHz low-power oscillator (LPO) One UART module (UART) One I2C module (I2C) System peripherals Power management module (PMC) with three power Package options modes: Run, Wait, Stop 24-pin QFN Low-voltage detection (LVD) with reset or interrupt, 20-pin SOIC selectable trip points 16-pin TSSOP Watchdog with independent clock source (WDOG) Programmable cyclic redundancy check module (CRC) Serial wire debug interface (SWD) Aliased SRAM bitband region (BIT-BAND) Bit manipulation engine (BME) NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Table of Contents 1 Ordering parts.......................................................................................3 5.2.2 FTM module timing....................................................... 16 1.1 Determining valid orderable parts............................................... 3 5.3 Thermal specifications.................................................................17 2 Part identification................................................................................. 3 5.3.1 Thermal operating requirements.................................... 17 2.1 Description...................................................................................3 5.3.2 Thermal characteristics.................................................. 17 2.2 Format..........................................................................................3 6 Peripheral operating requirements and behaviors................................ 19 2.3 Fields............................................................................................3 6.1 Core modules............................................................................... 19 2.4 Example....................................................................................... 4 6.1.1 SWD electricals .............................................................19 3 Parameter classification........................................................................4 6.2 External oscillator (OSC) and ICS characteristics.......................20 4 Ratings..................................................................................................4 6.3 NVM specifications..................................................................... 22 4.1 Thermal handling ratings............................................................. 4 6.4 Analog..........................................................................................23 4.2 Moisture handling ratings............................................................ 5 6.4.1 ADC characteristics....................................................... 23 4.3 ESD handling ratings................................................................... 5 6.4.2 Analog comparator (ACMP) electricals.........................25 4.4 Voltage and current operating ratings..........................................5 6.5 Communication interfaces........................................................... 26 5 General................................................................................................. 6 6.5.1 SPI switching specifications.......................................... 26 5.1 Nonswitching electrical specifications........................................ 6 7 Dimensions...........................................................................................29 5.1.1 DC characteristics.......................................................... 6 7.1 Obtaining package dimensions.................................................... 29 5.1.2 Supply current characteristics........................................ 13 8 Pinout................................................................................................... 29 5.1.3 EMC performance..........................................................14 8.1 Signal Multiplexing and Pin Assignments...................................29 5.2 Switching specifications.............................................................. 15 8.2 Device pin assignment................................................................. 31 5.2.1 Control timing................................................................ 15 9 Revision history....................................................................................32 KE04 Sub-Family Data Sheet, Rev. 5, 04/2020 2 NXP Semiconductors