NXP Semiconductors Document Number: MPX5100 Data Sheet: Technical Data Rev. 14, 12/2018 MPX5100, 0 to 100 kPa, Differential, MPX5100 Gauge, and Absolute, Integrated, Pressure Sensors The MPX5100 series piezoresistive transducer is a state-of-the-art monolithic Unibody packages silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high-level, analog output signal that is proportional to the applied pressure. Features 2.5% maximum error over 0 to 85 C Ideally suited for microprocessor or microcontroller-based systems Patented silicon shear stress strain gauge Available in absolute, differential and gauge configuration MPX5100AP/GP MPX5100DP 98ASB42796B 98ASA42797B Durable epoxy unibody element Easy-to-use chip carrier option Small outline packages Typical applications Patient monitoring Process control Pump/motor control Pressure switching White goods MPXV5100DP MPXV5100GP 98ASA99255D 98ASA99303D MPXV5100GC6U MPXV5100GC7U 98ASB17757C 98ASB17759C Ordering information of Ports Pressure type Device Device name Shipping Package marking None Single Dual Gauge Differential Absolute Unibody Package (MPX5100 Series) MPX5100AP Tray 98ASB42796B MPX5100AP MPX5100DP Tray 98ASB42797B MPX5100DP MPX5100GP Tray 98ASB42796B MPX5100GP Small Outline Package (MPXV5100 Series) MPXV5100DP Tray 98ASA99255D MPXV5100DP MPXV5100GC6U Rail 98ASB17757C MPXV5100G MPXV5100GC7U Rail 98ASB17759C MPXV5100G MPXV5100GP Tray 98ASA99303D MPXV5100GP NXP reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 2018 NXP Semiconductors, B.V.Contents 1 General Description 3 1.1 MPX5100AP/DP/GP Block diagram 3 1.2 MPX5100AP/DP/GP Pinout (Unibody) 3 1.3 MPXV5100DP/GC6U/GC7U/GP block diagram . 4 1.4 MPXV5100DP/GC6U/GC7U/GP pinout (small outline package) 4 2 Mechanical and Electrical Specifications . 5 2.1 Maximum ratings . 5 2.2 Operating characteristics 5 3 On-chip Temperature Compensation and Calibration 6 4 Package Information 9 4.1 Pressure (P1)/Gauge (P2) side identification table . 9 4.2 Minimum recommended footprint for surface mounted applications . 9 4.3 Package dimensions 9 5 Revision History 19 Related Documentation The MPX5100 device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the NXP homepage at: